Patents by Inventor Yasuko TAKAYA

Yasuko TAKAYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180298515
    Abstract: Instead of the renewal or purification of copper sulfate plating solutions performed based on the increase of defective products as an ex post facto measure or the empirical determination, a technique capable of managing copper sulfate plating solutions by assessing the aging of the copper sulfate plating solutions in an objective manner is provided. A method for managing a copper sulfate plating solution used for performing copper sulfate plating for a material to be plated, the method containing: measuring a concentration of impurities in the copper sulfate plating solution; and assessing aging of the copper sulfate plating solution from the concentration of the impurities.
    Type: Application
    Filed: April 27, 2015
    Publication date: October 18, 2018
    Applicant: JCU CORPORATION
    Inventors: Tetsuro EDA, Hisayuki TODA, Kazuki KISHIMOTO, Yasuko TAKAYA, Ryoichi KIMIZUKA