Patents by Inventor Yasuko WADA

Yasuko WADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190141996
    Abstract: The present invention aims to provide an antibacterial and antiviral composition capable of exhibiting antibacterial and antiviral properties in a short period of time and excellent in handleability and safety. The present invention also aims to provide antibacterial and antiviral particles, a processed fabric, a coating material for a processed coating film, a processed coating film, a coating material for a UV-cured coating film, and a UV-cured coating film each prepared using the antibacterial and antiviral composition. Provided is an antibacterial and antiviral composition containing an antibacterial and antiviral polymer compound, the polymer compound being an amino group-containing polymer.
    Type: Application
    Filed: March 31, 2017
    Publication date: May 16, 2019
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yasuko WADA, Tatsuya MATSUKUBO, Motokuni ICHITANI, Hiroji FUKUI, Masazumi OKUDO, Kenichi OOTSUKI, Taro SUZUKI, Kazuya NISHIHARA, Yohei NISHIMURA
  • Patent number: 9493625
    Abstract: The present invention provides a thermally expandable microcapsule that has a high expansion ratio and durability at high temperatures, and is not likely to cause discoloration and odor when used for foam molding. The thermally expandable microcapsule of the present invention includes: a shell formed from a polymer; and a volatile expansion agent as a core agent encapsulated by the shell, the shell obtained by polymerizing a monomer composition that contains a nitrile monomer and a compound having a glycidyl group in a molecule, the shell exhibiting a value y of 50% or higher and a ratio y/x of 1.1 or higher, in which x represents a gel fraction at ordinary temperature, and y represents a gel fraction upon heating at 180° C. for 30 minutes.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: November 15, 2016
    Assignees: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Hiroshi Yamauchi, Hiroyuki Morita, Satoshi Haneda, Yasuko Wada
  • Publication number: 20150368423
    Abstract: The present invention provides a thermally expandable microcapsule that has a high expansion ratio and durability at high temperatures, and is not likely to cause discoloration and odor when used for foam molding. The thermally expandable microcapsule of the present invention includes: a shell formed from a polymer; and a volatile expansion agent as a core agent encapsulated by the shell, the shell obtained by polymerizing a monomer composition that contains a nitrile monomer and a compound having a glycidyl group in a molecule, the shell exhibiting a value y of 50% or higher and a ratio y/x of 1.1 or higher, in which x represents a gel fraction at ordinary temperature, and y represents a gel fraction upon heating at 180° C. for 30 minutes.
    Type: Application
    Filed: September 22, 2014
    Publication date: December 24, 2015
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Hiroshi YAMAUCHI, Hiroyuki MORITA, Satoshi HANEDA, Yasuko WADA