Abstract: A method for processing a mold material which includes a heating step of heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer.

Abstract: A supporting member separation apparatus including a light emitting section configured to emit light through a support plate to at least a partial region of a peripheral portion of a release layer so as to alter the region, a first holding section configured to, in such a manner as to form a gap between a portion of a substrate and a portion of the support plate which portions sandwich the region as altered, hold the support plate from a side of a surface portion of the support plate which surface portion is opposite to a surface portion of the support plate which surface portion faces the region as altered and lift the support plate, and a fluid nozzle configured to inject a fluid into the layered body through the gap in such a manner as to separate the support plate from the layered body.

Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

Abstract: A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.

Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

Abstract: A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.

Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

Abstract: An attachment method including an overlapping step of overlapping a support plate over a substrate under a reduced pressure environment; a temporary fixing step of temporarily fixing the support plate to the substrate; and an attaching step of attaching the support plate to the substrate under a reduced pressure environment. The method further includes, prior to the overlapping step, at least one of a first heating step in which heating is performed under an atmospheric pressure environment and a second heating step in which heating is performed under a reduced pressure environment.

Abstract: An attachment method including an overlapping step of overlapping a support plate over a substrate under a reduced pressure environment; a temporary fixing step of temporarily fixing the support plate to the substrate; and an attaching step of attaching the support plate to the substrate under a reduced pressure environment. The method further includes, prior to the overlapping step, at least one of a first heating step in which heating is performed under an atmospheric pressure environment and a second heating step in which heating is performed under a reduced pressure environment.

Abstract: A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.

Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

Abstract: The treatment device 100 of the present invention is a treatment device for carrying out treatment to a treatment object 18 whose treatment surface includes a second treatment surface 18b and a first treatment surface 18a surrounding the second treatment surface 18b, the treatment device including: a table section 10 for placing the treatment object 18 thereon; and a first feeding section 24 for feeding a first treatment liquid to an approximate boundary between the first and the second treatment surfaces 18a, 18b and a second feeding section 46 for feeding a second treatment liquid to the second treatment surface 18b. Thus, the present invention provides a treatment device, a treatment method, and a surface treatment jig, each of the treatment device and the treatment method being capable of carrying out independent treatments to a treatment surface and an exposed surface surrounding the treatment surface, respectively.

Abstract: A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.

Abstract: A method for processing a mold material which includes a heating step of heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer.

Abstract: To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.

Abstract: To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.

Abstract: In order to provide a liquid solvent abutment unit for accelerating the reaction of a liquid solvent against an adhesive member existing between a perforated support plate and a wafer, a liquid solvent abutment unit includes a supply part for supplying a support plate surface with a liquid solvent, a retention part for retaining the supplied liquid solvent in the hole-formed region on the support plate surface; a recovery part for recovering the liquid solvent retained in the hole-formed region, and a vibration unit for vibrating the liquid solvent.

Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Abstract: A surface treating jig of the present invention includes a treatment solution collecting section having (i) a ring-like groove formed on a surface (a) facing to a surface (a) to be treated of a semiconductor wafer and (ii) a through hole for collecting the treatment solution, the through hole formed so as to be continuous with the ring-like groove. With this arrangement, the present invention provides a surface treatment apparatus that prevents the treatment solution from spattering to a surface other than the surface (a) to be treated, and thereby, treatment with the treatment solution can be performed only with respect to the target surface.

Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.