Abstract: The present application provides a dispersion dispersed satisfactorily cellulose nanofibers, powdery cellulose nanofibers obtained by pulverizing thereof, a resin composition obtained by blending thereof and a molding raw material for a 3D printer by using thereof. It is possible to obtain a composition uniformly finely dispersed the cellulose nanofibers by treating a mixture containing unmodified cellulose nanofibers and a dispersant using a high speed agitating Medialess disperser, and followed by pulverizing the composition to blend with a resin and a rubber component. Also, a resin composition improved in mechanical properties and heat resistance, obtained by blending the powdery cellulose nanofibers above with a thermoplastic resin or a thermosetting resin, is useful as a molding material for a 3D printer.

Abstract: A pattern forming method includes forming a photosensitive resin composition layer on at least one surface of a substrate using a photosensitive transfer material, exposing the photosensitive resin composition layer; and developing the exposed photosensitive resin composition layer, in which the photosensitive transfer material includes a support, a thermoplastic resin layer, and a photosensitive resin composition layer in this order, and the photosensitive resin composition layer includes a polymer component (A) including a polymer having a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group and a photoacid generator (B).

Abstract: Provided are a photosensitive resin composition from which a cured product having a thin film thickness, excellent light-shielding properties, and a high surface hardness is obtained; as well as a cured product obtained by curing the photosensitive resin composition, a cured film and a method for producing the same, a method for producing a resin pattern, and a liquid crystal display device, an organic EL display device, an infrared cut filter, or a solid-state imaging device, each having the cured film. The photosensitive resin composition of the present invention includes (Component A) a polymer having a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group; (Component B) a photoacid generator; (Component C) a solvent; (Component D) a compound having a crosslinkable group and a molecular weight in the range of 100 to 2,000; and (Component S) titanium black.

Abstract: A photosensitive transfer material including a support, a thermoplastic resin layer, and a photosensitive resin composition layer in this order, in which the photosensitive resin composition layer includes a polymer component (A) including a polymer having a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group and a photoacid generator (B).

Abstract: A pattern forming method includes forming a photosensitive resin composition layer on at least one surface of a substrate using a photosensitive transfer material, exposing the photosensitive resin composition layer; and developing the exposed photosensitive resin composition layer, in which the photosensitive transfer material includes a support, a thermoplastic resin layer, and a photosensitive resin composition layer in this order, and the photosensitive resin composition layer includes a polymer component (A) including a polymer having a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group and a photoacid generator (B).

Abstract: Provided is a photosensitive resin composition from which a cured product having thin film thickness, excellent light-shielding properties, and high surface hardness is obtained. A a cured film and a method for producing the same, a method for producing a resin pattern, and an LCD device, an organic EL display device, an infrared cut filter, or a solid-state imaging device are also provided. The photosensitive resin composition includes a polymer component including at least one of categories (1) or (2), a photoacid generator, a solvent, and titanium black, wherein (1) includes (a1) a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group, and (a2) a constitutional unit containing a crosslinkable group, and (2) includes (a1) a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group, and (a2) a constitutional unit containing a crosslinkable group.

Abstract: Provided is a photosensitive resin composition from which a cured product having thin film thickness, excellent light-shielding properties, and high surface hardness is obtained. A a cured film and a method for producing the same, a method for producing a resin pattern, and an LCD device, an organic EL display device, an infrared cut filter, or a solid-state imaging device are also provided. The photosensitive resin composition includes a polymer component including at least one of categories (1) or (2), a photoacid generator, a solvent, and titanium black, wherein (1) includes (a1) a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group, and (a2) a constitutional unit containing a crosslinkable group, and (2) includes (a1) a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group, and (a2) a constitutional unit containing a crosslinkable group.

Abstract: Provided are a photosensitive resin composition from which a cured product having a thin film thickness, excellent light-shielding properties, and a high surface hardness is obtained; as well as a cured product obtained by curing the photosensitive resin composition, a cured film and a method for producing the same, a method for producing a resin pattern, and a liquid crystal display device, an organic EL display device, an infrared cut filter, or a solid-state imaging device, each having the cured film. The photosensitive resin composition of the present invention includes (Component A) a polymer having a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group; (Component B) a photoacid generator; (Component C) a solvent; (Component D) a compound having a crosslinkable group and a molecular weight in the range of 100 to 2,000; and (Component S) titanium black.

Abstract: A photosensitive transfer material including a support, a thermoplastic resin layer, and a photosensitive resin composition layer in this order, in which the photosensitive resin composition layer includes a polymer component (A) including a polymer having a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group and a photoacid generator (B).

Abstract: There is provided that a method for producing a resin pattern, and the method includes at least the steps (1) to (7) in this order; (1) a coating step of coating a photosensitive resin composition on a substrate; (2) a solvent removal step of removing the solvent from the applied photosensitive resin composition; (3) an exposure step of patternwise exposing the photosensitive resin composition from which the solvent has been removed, to an active radiation; (4) a development step of developing the exposed photosensitive resin composition using an aqueous developer liquid; (5) an overcoating step of providing an overcoat layer on the developed photosensitive resin composition; (6) a heat-treating step of heat-treating the photosensitive resin composition on which the overcoat layer has been provided; and (7) a removal step of removing the overcoat layer.

Abstract: There is provided that a method for producing a resin pattern, and the method includes at least the steps (1) to (7) in this order; (1) a coating step of coating a photosensitive resin composition on a substrate; (2) a solvent removal step of removing the solvent from the applied photosensitive resin composition; (3) an exposure step of patternwise exposing the photosensitive resin composition from which the solvent has been removed, to an active radiation; (4) a development step of developing the exposed photosensitive resin composition using an aqueous developer liquid; (5) an overcoating step of providing an overcoat layer on the developed photosensitive resin composition; (6) a heat-treating step of heat-treating the photosensitive resin composition on which the overcoat layer has been provided; and (7) a removal step of removing the overcoat layer.

Abstract: A positive resist composition comprising the components of: (A) a compound capable of generating an acid upon irradiation with one of an actinic ray and a radiation; (B) a resin that is insoluble or slightly soluble in alkalis, but becomes alkali-soluble under an action of an acid; (C) a basic compound; and (D) a compound comprising at least three hydroxyl groups or at least three substituted hydroxyl groups, and comprising at least one cyclic structure.

Abstract: A positive photosensitive composition comprising (A1) a compound that generates an aromatic sulfonic acid substituted with at least one fluorine atom and/or a group having at least one fluorine atom upon irradiation of an actinic ray or radiation, (B) a resin that has a monocyclic or polycyclic alicyclic hydrocarbon structure and is decomposed by the action of an acid to increase solubility in an alkali developing solution, and (C) a compound that has at least three hydroxy or substituted hydroxy groups and at least one cyclic structure or (A2) an onium salt of an alkanesulfonic acid in which the ?-position of the sulfonic acid is not substituted with a fluorine atom and/or an onium salt of a carboxylic acid.

Abstract: Provided is a positive photosensitive resin composition comprising (A) a polymer which has alicyclic hydrocarbon skeleton and decomposes under the action of an acid to be rendered soluble in alkali, (B) a compound which generates an acid upon irradiation with actinic rays, (C) a nitrogen-containing basic compound, (D) at least one of a fluorine-containing surfactant and a silicon-containing surfactant and (E) a solvent. The composition can exhibit better characteristics when the solvent (E) is a combination of specified solvents.

Abstract: Provided is a positive photosensitive resin composition comprising (A) a polymer which has alicyclic hydrocarbon skeletons and composes under the action of an acid to be rendered soluble in alkali, (B) a compound which generates an acid upon irradiation with actinic rays, (C) a nitrogen-containing basic compound, (D) at least one of a fluorine-containing surfactant and a silicon-containing surfactant and (E) a solvent. The composition can exhibit better characteristics when the solvent (E) is a combination of specified solvents.

Abstract: A positive photoresist composition comprising the components of: (a) a resin which decomposes by the action of an acid, thereby having an increased solubility in an alkali developer; and (b) a compound which is represented by the formula (1) and generates an acid by exposure to active rays or radiation, and a compound which is represented by the formula (2) and generates an acid by exposure to active rays or radiation.

Abstract: A positive photosensitive composition suitable for resist pattern formation under exposure to far ultraviolet light of wavelengths of 250 nm or shorter, particularly 220 nm or shorther, comprising: (A) a resin comprising constitutional repeating units wherein particular ring structures are present and having groups capable of decomposing under the action of an acid to cause an increase of the solubility in an alkali developer, (B) a photo-acid generator capable of generating an acid upon irradiation with actinic rays or radiation, and (C) a fluorine-containing surfactant, a silicon-containing surfactant or a mixture thereof.

Abstract: A positive resist composition comprises: (A) a resin having an aliphatic cyclic hydrocarbon group and increasing the solubility to an alkali developer by the action of an acid; (B) a compound generating an acid upon irradiation with an actinic ray or radiation; and (C) a nitrogen-containing compound having in the molecule at least one partial structure represented by following formula (I).

Abstract: A positive photosensitive composition comprising (A1) a compound that generates an aromatic sulfonic acid substituted with at least one fluorine atom and/or a group having at least one fluorine atom upon irradiation of an actinic ray or radiation, (B) a resin that has a monocyclic or polycyclic alicyclic hydrocarbon structure and is decomposed by the action of an acid to increase solubility in an alkali developing solution, and (C) a compound that has at least three hydroxy or substituted hydroxy groups and at least one cyclic structure or (A2) an onium salt of an alkanesulfonic acid in which the &agr;-position of the sulfonic acid is not substituted with a fluorine atom and/or an onium salt of a carboxylic acid.

Abstract: Provided is a positive photosensitive resin composition comprising (A) a polymer which has alicyclic hydrocarbon skeletons and decomposes under the action of an acid to be rendered soluble in alkali, (B) a compound which generates an acid upon irradiation with actinic rays, (C) a nitrogen-containing basic compound, (D) at least one of a fluorine-containing surfactant and a silicon-containing surfactant and (E) a solvent. The composition can exhibit better characteristics when the solvent (E) is a combination of specified solvents.