Abstract: A heat pipe including a container being a tubular body, the container having an end surface of one end portion and an end surface of another end portion, the end surfaces each being sealed; a wick structure provided inside the container; and a working fluid enclosed inside the container. The wick structure includes a first wick portion and a second wick portion in at least one cross section perpendicular to a longitudinal direction of the container, the second wick portion being integral with the first wick portion, the second wick portion extending outward from the first wick portion, the second wick portion being thinner than the first wick portion, and the second wick portion includes a flat portion extending in a direction perpendicular to a height direction of the internal space of the container.

Abstract: A heat pipe has a flat container; a wick structure housed inside the flat container; and a working fluid sealed inside the flat container, wherein in at least one cross section of the flat container, the wick structure contacts both of the pair of flat inner surfaces of the flat container, and both side faces of the wick structure do not contact any of the inner surfaces of the flat container, wherein the wick structure has a first wick part and a second wick part, respectively disposed in the lengthwise direction of the flat container, the second wick part being directly or indirectly connected to the first wick part and having a maximum width that is wider than a maximum width of the first wick part, and wherein the second wick part is disposed in the heat receiving portion of the heat pipe.

Abstract: A heat pipe has a heat receiving portion that is to be thermally connected to a heat generating member so as to absorb heat from the heat generating member. The heat pipe includes a sealed flat container; a wick structure housed inside the flat container; and a working fluid sealed inside the flat container. In at least one cross section of the flat container, the wick structure includes a first wick member and a second wick member disposed vertically, the wick structure also has a first wick part and a second wick part respectively disposed in the lengthwise direction of the flat container, the second wick part having a maximum width that is wider than a maximum width of the first wick part. The second wick part is disposed in the heat receiving portion of the heat pipe.

Abstract: An object of the present disclosure is to provide a heat sink that can equalize heat input in a heat receiving portion and increase a volume of the heat receiving portion, prevent an increase in heat resistance in the heat receiving portion even when a heat generation amount from a heat-generating element increases, and exhibit excellent cooling performance with respect to a cooling target.

Abstract: An object of the present disclosure is to provide a heat sink that can equalize heat input in a heat receiving portion and increase a volume of the heat receiving portion, prevent an increase in heat resistance in the heat receiving portion even when a heat generation amount from a heat-generating element increases, and exhibit excellent cooling performance with respect to a cooling target.

Abstract: The invention provides a flattened heat pipe whose vapor flowing passage is not clogged and which has an excellent capillary force. The flattened heat pipe has a closed container formed by flattening a tubular container, a plurality of wick structures arrayed within the container in a longitudinal direction so as to form an acute-angled portion where a capillary force is large at least partially within the container, a hollow portion formed of an outer peripheral surface of the wick structure and an inner wall surface of the container and a working fluid sealed into the container.

Abstract: A heat pipe has a flat container; a wick structure housed inside the flat container; and a working fluid sealed inside the flat container, wherein in at least one cross section of the flat container, the wick structure contacts both of the pair of flat inner surfaces of the flat container, and both side faces of the wick structure do not contact any of the inner surfaces of the flat container, wherein the wick structure has a first wick part and a second wick part, respectively disposed in the lengthwise direction of the flat container, the second wick part being directly or indirectly connected to the first wick part and having a maximum width that is wider than a maximum width of the first wick part, and wherein the second wick part is disposed in the heat receiving portion of the heat pipe.

Abstract: A heat pipe has a heat receiving portion that is to be thermally connected to a heat generating member so as to absorb heat from the heat generating member. The heat pipe includes a sealed flat container; a wick structure housed inside the flat container; and a working fluid sealed inside the flat container. In at least one cross section of the flat container, the wick structure includes a first wick member and a second wick member disposed vertically, the wick structure also has a first wick part and a second wick part respectively disposed in the lengthwise direction of the flat container, the second wick part having a maximum width that is wider than a maximum width of the first wick part. The second wick part is disposed in the heat receiving portion of the heat pipe.

Abstract: The invention provides a flattened heat pipe whose vapor flowing passage is not clogged and which has an excellent capillary force. The flattened heat pipe has a closed container formed by flattening a tubular container, a plurality of wick structures arrayed within the container in a longitudinal direction so as to form an acute-angled portion where a capillary force is large at least partially within the container, a hollow portion formed of an outer peripheral surface of the wick structure and an inner wall surface of the container and a working fluid sealed into the container.

Abstract: The invention provides a flattened heat pipe whose vapor flowing passage is not clogged and which has an excellent capillary force. The flattened heat pipe has a closed container formed by flattening a tubular container, a plurality of wick structures arrayed within the container in a longitudinal direction so as to form an acute-angled portion where a capillary force is large at least partially within the container, a hollow portion formed of an outer peripheral surface of the wick structure and an inner wall surface of the container and a working fluid sealed into the container.

Abstract: A heat sink that can reduce a load imposed on a heat pipe and enhance a heat transfer efficiency from a heating body to a heat radiation fin is provided. The heat sink has a base plate 21 having a heat receiving portion to which a semiconductor device 11 is thermally connected, a heat pipe disposed on the base plate 21 while partially brought into contact with the heat receiving portion, and a heat radiation fin arranged to be stacked on the base plate 21 and the heat pipe 22. The base plate 21 is formed of a metal plate and has an opening portion 35 at the site corresponding to the heat receiving portion, and the heat receiving plate 36 which is formed of a metal plate having higher thermal conductivity than the base plate 21 is arranged to form substantially the same plane with the base plate 21.

Abstract: The invention provides a flattened heat pipe whose vapor flowing passage is not clogged and which has an excellent capillary force. The flattened heat pipe has a closed container formed by flattening a tubular container, a plurality of wick structures arrayed within the container in a longitudinal direction so as to form an acute-angled portion where a capillary force is large at least partially within the container, a hollow portion formed of an outer peripheral surface of the wick structure and an inner wall surface of the container and a working fluid sealed into the container.

Abstract: A thin sheet type heat pipe is disclosed. The heat pipe may include a hermetically sealed container that is formed of foil sheets opposed and jointed at peripheral portions. The heat pipe may further include at least one spacer including a sheet having a fluid path and exerting a capillary force, which is movably housed in the container without bonding between the spacer and the container for maintaining flexibility to allow the container to be bent smoothly. The heat pipe may also include a working fluid enclosed in the container.

Abstract: The present invention has proposed a thin sheet type heat pipe comprising: a hermetically sealed container which is formed of foil sheets opposed and jointed at peripheral portions; at least one spacer which is movably housed in said container and has a fluid path to exert a capillary force; at least one spacer which is movably housed in said container and has no fluid path; and a working fluid enclosed in said container.

Abstract: The present invention has proposed a thin sheet type heat pipe comprising: a hermetically sealed container which is formed of foil sheets opposed and jointed at peripheral portions; at least one spacer which is movably housed in said container and has a fluid path to exert a capillary force; at least one spacer which is movably housed in said container and has no fluid path; and a working fluid enclosed in said container.

Abstract: A heat treatment jig with a silicon carbide coating for production of a semiconductor includes a base material and a silicon carbide film formed on the surface of the base material by a CVD method. The silicon carbide film is formed from a plurality of layers substantially parallel to the surface of the base material, and at least one of the layers is formed as a nucleus formation layer while the other layers are formed as ordinary crystal layers so that crystal growth between the ordinary crystal layers across the nucleus formation layer is discontinuous while crystal growth of the silicon carbide in the ordinary crystal layers are continuous in a direction of thickness of the ordinary crystal layers.

Abstract: End members are located at the top and the bottom of a vertical heat treatment device. A plurality of support members are vertically mounted on the end members. A plurality of wafer hold members are fixed on the support members in a parallel manner, each of which is formed in an approximately circular arc shape. The wafer hold member is made of SiC by a CVD method or Si3N4 by a CVD method. The wafer hold member has a plate portion on which a wafer is to be placed and a reinforce portion connected to the plate portion. The plate portion is 100-1000 microns in thickness.

Abstract: A ceramic device is disclosed that has a silicon base plate, a first ceramic film formed on a first surface of the silicon base plate, a second ceramic film formed on a second surface of the silicon base plate opposite to the first surface, and an operation opening formed in the silicon base plate between the first and second surfaces. A surface portion of the first ceramic film exposed to the operation opening Is a mirror surface having 0.05 micrometers or less of center line average height Ra. A mirror surface keeping film can be formed between the first surface of the silicon base plate and the first ceramic film for keeping a mirror surface in an etching step to etch the silicon base plate, and the silicon base plate can be reduced partially in the etching step for forming an operation opening thereby exposing a corresponding portion of the mirror surface keeping film to the operation opening.

Abstract: A disc-shaped electrode plate body is made of high-purity glassy carbon and has a large number of very-small-diameter through holes each of which has a plurality of spherical recesses in its internal wall surface.

Abstract: The susceptor according to the present invention comprises a main body in the shape of a trapezoidal plate, and which has three circular depressions formed in its surface. The main body is made of silicon carbide having a bulk density of 3.00 g/cm.sup.3 or more. At least 70% of the surface region of the main body is made of crystal particles having a diameter of 5 .mu.m or more. The main body has a thickness of, for example, 700 .mu.m. Six susceptors are attached to a hexagonal upper plate which is fastened to a shaft, and also to a hexagonal lower plate, thereby forming a barrel. Silicon wafers are placed in the circular depressions, so that single-crystal layers may be epitaxially formed on the wafers.