Abstract: A nonvolatile semiconductor storing device according to the present invention comprises a block replacing means for replacing a defective block with a redundant block when a memory block in a memory array is the defective block. The block replacing means includes an address translation circuit 10 for converting an inputted external block address into an internal block address by inverting an address bit corresponding to dissident of each address bit between a defective block address of the defective block and a redundant block address among address bits of the inputted external block address, and each of the memory blocks 5 is selected based on the internal block address after the translation of the external block address inputted from outside by the address translation circuit 10.

Abstract: A semiconductor storage device according to the present invention comprises one or more memory planes 8 comprising a plurality of memory blocks 9, and a block selection circuit for decoding an block address signal for selecting the memory block 9 from the memory plane 8 to select the memory block, generates a dummy block address for selecting a dummy block that is different from the selected block address and a defective block address of a defective block by a predetermined logical operation targeted for a specific partial bit in address bits of the selected block address when the defective block is contained in the memory plane. A bit line connected to the selected memory cell selected by the selected block address and a bit line in the dummy block are connected to differential input terminals of a sense amplifier circuit 9.

Abstract: A nonvolatile semiconductor storing device according to the present invention comprises a block replacing means for replacing a defective block with a redundant block when a memory block in a memory array is the defective block. The block replacing means includes an address translation circuit 10 for converting an inputted external block address into an internal block address by inverting an address bit corresponding to dissident of each address bit between a defective block address of the defective block and a redundant block address among address bits of the inputted external block address, and each of the memory blocks 5 is selected based on the internal block address after the translation of the external block address inputted from outside by the address translation circuit 10.

Abstract: A semiconductor storage device according to the present invention comprises one or more memory planes 8 comprising a plurality of memory blocks 9, and a block selection circuit for decoding an block address signal for selecting the memory block 9 from the memory plane 8 to select the memory block, generates a dummy block address for selecting a dummy block that is different from the selected block address and a defective block address of a defective block by a predetermined logical operation targeted for a specific partial bit in address bits of the selected block address when the defective block is contained in the memory plane. A bit line connected to the selected memory cell selected by the selected block address and a bit line in the dummy block are connected to differential input terminals of a sense amplifier circuit 9.

Abstract: A semiconductor memory device comprises at least one memory plane in which a plurality of memory blocks are arranged, and a block decoder circuit which decodes a block address signal for selecting the memory block from the memory plane and outputs block selection signals for selecting the memory block, as well as puts all of the block selection signals in a selected state and output them in a predetermined test mode, and a block selection signal inversion circuit which inverts or non-inverts signal levels of the block selection signals.

Abstract: Two bias circuits which supply a current to a selected memory cell and a reference memory cell have the same circuit constitution. Each bias circuit includes a first active element between a power supply node and a junction node, where a current is controlled to prevent a voltage level at the junction node from fluctuating, a second active element between the power supply node and an output node, where a current is controlled such that a voltage level at the output node is changed in direction opposite to a voltage level at the junction node in other bias circuit, a third active element and a fourth active element between the junction node and a current supply node and between the output node and the current supply node, respectively, where a bias voltage is adjusted.

Abstract: A nonvolatile semiconductor memory device includes a readout circuit which reads data stored in a selected memory cell by applying predetermined voltage to the selected memory cell and a reference cell such that currents corresponding to the respective threshold voltage may flow, and comparing the current flowing in the selected memory cell with the current flowing in the reference cell. The readout circuit commonly uses the reference cell set in the same storage state for normal readout and for readout for program verification, and when the predetermined voltage is applied to the selected memory cell and the reference memory cell at the time of the readout for the program verification, it sets an applying condition to the reference memory cell such that its storage state may be shifted more in the program state direction than that in an applying condition at the time of the normal readout.

Abstract: A semiconductor memory device is provided, which comprising a memory cell array comprising a two-value memory region and a multi-value memory region, in which the two-value memory region comprises a plurality of memory cells each storing 1-bit data and the multi-value memory region comprises a plurality of memory cells each storing 2 or more-bit data, and a sense amplifier section common to data read of the two-value memory region and data read of the multi-value memory region, for reading data stored in a selected memory cell by comparing a potential of the selected memory cell with a reference potential.

Abstract: A reading circuit, for reading data from one memory cell of a plurality of memory cells, includes a plurality of division sensing circuits each connected to the one memory cell via a sensing line corresponding thereto among a plurality of sensing lines; and a current-voltage conversion circuit for converting a current flowing through each sensing line into a sensing voltage representing a potential of the corresponding sensing line. Each division sensing circuit includes a current load circuit for supplying a current to the one memory cell via a corresponding sensing line, and a sense amplifier for sensing a potential difference between the corresponding sensing line and a corresponding reference line of a plurality of reference lines. The current load circuit included in at least one division sensing circuit has a current supply capability different from that of the current load circuit included in another division sensing circuits.

Abstract: A nonvolatile semiconductor memory device comprises a readout circuit which reads data stored in a selected memory cell by applying predetermined voltage to the selected memory cell and a reference cell such that currents corresponding to the respective threshold voltage may flow, and comparing the current flowing in the selected memory cell with the current flowing in the reference cell. The readout circuit commonly uses the reference cell set in the same storage state for normal readout and for readout for program verification, and when the predetermined voltage is applied to the selected memory cell and the reference memory cell at the time of the readout for the program verification, it sets an applying condition to the reference memory cell such that its storage state may be shifted more in the program state direction than that in an applying condition at the time of the normal readout.

Abstract: A semiconductor memory device comprises at least one memory plane in which a plurality of memory blocks are arranged, and a block decoder circuit which decodes a block address signal for selecting the memory block from the memory plane and outputs block selection signals for selecting the memory block, as well as puts all of the block selection signals in a selected state and output them in a predetermined test mode, and a block selection signal inversion circuit which inverts or non-inverts signal levels of the block selection signals.

Abstract: Two bias circuits which supply a current to a selected memory cell and a reference memory cell have the same circuit constitution. Each bias circuit includes a first active element between a power supply node and a junction node, where a current is controlled to prevent a voltage level at the junction node from fluctuating, a second active element between the power supply node and an output node, where a current is controlled such that a voltage level at the output node is changed in direction opposite to a voltage level at the junction node in other bias circuit, a third active element and a fourth active element between the junction node and a current supply node and between the output node and the current supply node, respectively, where a bias voltage is adjusted.

Abstract: In the nonvolatile semiconductor memory device of this invention, a program control circuit 1 sets the threshold value of a first reference cell RFC0 by means of a write circuit WC on the basis of a result of comparing the threshold value of the first reference cell RFC0 with the threshold value of a second reference cell SRC executed by a sense amplifier 8 for trimming. The compare of threshold values by the sense amplifier 8 for trimming can be executed within a shorter time than in the threshold value read operation of the first reference cell RFC0. Therefore, when the number of the first reference cells is increased, the threshold value adjustment time can be remarkably reduced in comparison with the prior art in which the threshold value of the first reference cell is adjusted by reading the first reference cell.

Abstract: In the nonvolatile semiconductor memory device of this invention, a program control circuit 1 sets the threshold value of a first reference cell RFC0 by means of a write circuit WC on the basis of a result of comparing the threshold value of the first reference cell RFC0 with the threshold value of a second reference cell SRC executed by a sense amplifier 8 for trimming. The compare of threshold values by the sense amplifier 8 for trimming can be executed within a shorter time than in the threshold value read operation of the first reference cell RFC0. Therefore, when the number of the first reference cells is increased, the threshold value adjustment time can be remarkably reduced in comparison with the prior art in which the threshold value of the first reference cell is adjusted by reading the first reference cell.

Abstract: A semiconductor memory device is provided, which comprising a memory cell array comprising a two-value memory region and a multi-value memory region, in which the two-value memory region comprises a plurality of memory cells each storing 1-bit data and the multi-value memory region comprises a plurality of memory cells each storing 2 or more-bit data, and a sense amplifier section common to data read of the two-value memory region and data read of the multi-value memory region, for reading data stored in a selected memory cell by comparing a potential of the selected memory cell with a reference potential.

Abstract: A non-volatile semiconductor memory device, comprises a plurality of memory banks each including a plurality of memory cells, a command recognition section for identifying an externally input command signal and outputting an identification signal, an internal control section for generating a control signal for executing a command designated by the identification signal, an address control section for generating an internal address signal to a memory region including an arbitrary combination of the plurality of memory banks to be accessed, based on the externally input address signal, and a first address inversion section for inverting or non-inverting the logical values of at least a specific bit of the input address signal and outputting the resultant input address signal to the address control section. Predetermined memory cells are accessed based on the control signal and the internal address signal.

Abstract: A reading circuit, for reading data from one memory cell of a plurality of memory cells, includes a plurality of division sensing circuits each connected to the one memory cell via a sensing line corresponding thereto among a plurality of sensing lines; and a current-voltage conversion circuit for converting a current flowing through each sensing line into a sensing voltage representing a potential of the corresponding sensing line. Each division sensing circuit includes a current load circuit for supplying a current to the one memory cell via a corresponding sensing line, and a sense amplifier for sensing a potential difference between the corresponding sensing line and a corresponding reference line of a plurality of reference lines. The current load circuit included in at least one division sensing circuit has a current supply capability different from that of the current load circuit included in another division sensing circuits.

Abstract: A semiconductor integrated circuit of the present invention includes: n first output circuits and m second output circuits which are provided such that adjacent first and second output circuits are spaced at a regular first pitch; and input circuits which are provided such that adjacent input circuits are spaced at a regular second pitch, in which the first and second output circuits are provided such that at least part of ones of the first and second output circuit blocks alternate with the other ones of the first and second output circuits and each of the first output circuits is connected to a corresponding one of input circuits by a first conductor line which is kept straight, and second conductor lines are connected to the second output circuits such that each second conductor line passes through a gap between the input circuits.

Abstract: A data transfer control device of the present invention includes: a command recognition section for recognizing the input control command; a first address output section for controlling an output and storage order of the data transfer addresses and the data transfer completion address based on the input control command; a first memory address storage section for storing the data transfer start address of the first memory array output from the first address output section; a second memory address storage section for storing the data transfer start address of the second memory array output from the first address output section; a third memory address storage section for storing the data transfer completion address output from the first address output section.

Abstract: A semiconductor memory device in which an input command controls an operation includes a command state machine for decoding the input command and outputting the decoding result; a plurality of status registers for storing state information of the semiconductor memory device; a first switching circuit for receiving data from the plurality of status registers, and selectively outputting the data from at least one of the plurality of status registers to a first data bus; and a second switching circuit for receiving the data on the first data bus and data from a sense amplifier, and selectively outputting either one of data to a second data bus. At least the first switching circuit, among the first and second switching circuits, is controlled by the decoding result output by the command state machine.