Abstract: In a hybrid circuit device comprising a base plate on which a circuit including coils is provided, and a flat package of integrated circuit having a smaller flat area than that of the base plate, the flat package and base plate are superimposed upon each other; the two circuits are connected together through terminals of the flat package; external terminals are connected to at least one of the two circuits; the hybrid circuit device is encapsulated with plastics as a whole, with the external terminals being exposed through the encapsulation; and on that part of the base plate which does not overlap the flat package, circuit components constituting the circuit provided on the base plate are securely mounted at lateral positions with respect to the flat package.

Abstract: A hybrid circuit device comprising a flat package incorporating an integrated circuit therein, and a delay line circuit constituted by a plurality of coils and a plurality of capacitors. A base plate supporting the delay line circuit is disposed on the flat package. First terminals which are upwardly bent and second terminals are led out of the flat package. The upwardly-bent terminals connect the integrated circuit and delay line circuit to each other at side portions of the base plate. Furthermore, separate external terminals, which are attached to the base plate and connected to the second terminals of the flat package, are provided in two rows holding the flat package therebetween. The device is encapsulated with the free end portion of each of the separate external terminals being exposed through the encapsulation at a position substantially equidistant from the top and bottom surfaces of the encapsulated device.

Abstract: A hybrid circuit device comprising a flat package incorporating an integrated circuit therein, and a delay line constituted by a plurality of coils and capacitors. The base plate having the delay line mounted on one main surface thereof is placed, at the other main surface thereof, on the flat package. Upwardly bent terminals and non-bent terminals are led out of the flat package. The upwardly bent terminals connect the integrated circuit and delay line to each other at side portions of the base plate. Furthermore, separate terminals are provided in two rows holding the flat package therebetween and connected to the non-bent terminals of the flat package. The device is encapsulated, with the free end portion of each of the separate terminals being exposed.