Abstract: According to one embodiment, a semiconductor memory device includes: a plurality of first conductive layers aligned in a first direction with a space in between; a first plug penetrating the first conductive layers; a second conductive layer below the first conductive layers, the second conductive layer being coupled to a lower end of the first plug; a first transistor below the first conductive layers; a second transistor in a second region between the first transistor and a first region below the second conductive layer, the second transistor having a gate electrically coupled to the first transistor and a drain electrically coupled to the first transistor; and a third transistor in the second region, the third transistor having a source and a drain electrically coupled to each other.

Abstract: A semiconductor memory device includes first and second memory chips, each including a region of a core circuit, a first area adjacent to a first side of the region in a first direction, a second area adjacent to a second side of the region in a second direction, a third area adjacent to the first area in the first direction and to the second area in the second direction, a first pad in the first area, a second pad in the second area, and third pad in the third area. In each memory chip, a first bonding wire connects the first and third pads. In addition, a second bonding wire connects the second pads of the first and second memory chips. The second memory chip is stacked on the first memory chip to expose the first, second, and third areas of the first memory chip in a third direction.

Abstract: A semiconductor memory device includes first and second memory chips, each including a region of a core circuit, a first area adjacent to a first side of the region in a first direction, a second area adjacent to a second side of the region in a second direction, a third area adjacent to the first area in the first direction and to the second area in the second direction, a first pad in the first area, a second pad in the second area, and third pad in the third area. In each memory chip, a first bonding wire connects the first and third pads. In addition, a second bonding wire connects the second pads of the first and second memory chips. The second memory chip is stacked on the first memory chip to expose the first, second, and third areas of the first memory chip in a third direction.

Abstract: A semiconductor memory device includes first and second memory chips, each including a region of a core circuit, a first area adjacent to a first side of the region in a first direction, a second area adjacent to a second side of the region in a second direction, a third area adjacent to the first area in the first direction and to the second area in the second direction, a first pad in the first area, a second pad in the second area, and third pad in the third area. In each memory chip, a first bonding wire connects the first and third pads. In addition, a second bonding wire connects the second pads of the first and second memory chips. The second memory chip is stacked on the first memory chip to expose the first, second, and third areas of the first memory chip in a third direction.

Abstract: A semiconductor memory device includes first and second memory chips, each including a region of a core circuit, a first area adjacent to a first side of the region in a first direction, a second area adjacent to a second side of the region in a second direction, a third area adjacent to the first area in the first direction and to the second area in the second direction, a first pad in the first area, a second pad in the second area, and third pad in the third area. In each memory chip, a first bonding wire connects the first and third pads. In addition, a second bonding wire connects the second pads of the first and second memory chips. The second memory chip is stacked on the first memory chip to expose the first, second, and third areas of the first memory chip in a third direction.

Abstract: A semiconductor memory device includes bit lines and word lines arranged lengthwise and breadthwise, memory cells 1 capable of reading out and writing in, MOS transistors Q1 and Q2 for pre-charge, MOS transistors Q3 for short-circuiting, and transistors Q4 and Q5 for setting voltage level. The bit lines are provided two pieces at each bit. Between the MOS transistors Q1, Q2 for pre-charge and the bit lines driving power supply terminal Vcc, three pieces of the fuses F1-F3 are connected at each column. When the leak defect occurs to the bit lines, all of the fuses F1-F3 connected to the bit lines are cut. Further, a semiconductor memory device includes a plurality of section regions, a redundancy circuit RD1 which replaces a defective cell at each section region, a redundancy circuit RD2 which replaces the defective cell at each row address. The section regions are provided at each address in the column direction. In each section region, cell ground power supply lines Vss are formed circularly.

Abstract: A semiconductor memory device includes normal row selection lines (NWL1 to NWL128) for selecting one of normal rows, a spare row selection line (SWL) for selecting a spare row instead when one of the normal rows has a defect, fuses (F1 to F128) which are respectively arranged on the normal row selection lines, and blown when a defect exists, a normal row non-selection circuit (inverters IN3 and IN6 and gate G3) when one of the fuses (F1 to F128) is blown, setting a corresponding normal row in a non-selected state, and a spare row selection circuit (gates G4, G5, and G6, transistors P2 and N1, a NOR gate NR1, and an inverter IN6) selecting the spare row instead of the defective normal row. The spare row selection circuit performs dynamic operation in synchronism with a clock (ck).

Abstract: A semiconductor device comprises: a first circuit (11) formed in a first well (N-type) and a second well (P-type) of a semiconductor substrate, supplied with a first supply voltage (V.sub.ss) and a second supply voltage (V.sub.cc) higher than the first supply voltage, and activated when a first well bias voltage (V.sub.BP1) is applied to the first well (N-type) and a second well bias voltage (V.sub.BN1) is applied to the second well (P-type); a second circuit (201; 202) formed in a third well (N-type) and a fourth well (P-type) of the same semiconductor substrate as above, supplied with the first supply voltage (V.sub.ss) and a third supply voltage (V.sub.cc2) higher than the first supply voltage but different from the second supply voltage (V.sub.cc), and activated when a third well bias voltage (V.sub.BP2) is applied to the third well (N-type) and a fourth well bias voltage (V.sub.BN2) is applied to the fourth well (P-type); a first bias circuit (20) supplied with the first and second supply voltages (V.

Abstract: A semiconductor memory device having memory cells arranged in a matrix, each of the memory cells having input/output terminals, word lines for selecting the memory cells, pairs of bit lines connected to the input/output terminals, bit line pulling-up means for pulling up the potential of the bit lines, bit line loading means connected to another pair of bit lines and bit line equalizing means provided for the bit lines for equalizing the potential of the bit lines by allowing conduction between the bit lines before data is read from a selected memory cell.

Abstract: A delay circuit is interposed between first and second circuit systems both driven by a first supply voltage. The delay circuit delays a signal applied by the first circuit system, and then transmits the delayed signal to the second circuit system. In particular, a constant voltage supply circuit generates a second supply voltage (constant voltage) on the basis of the first supply voltage, and supplies the constant voltage to this delay circuit, so that a stable constant delay time can be obtained by the delay circuit without being subjected to the influence of fluctuations of the first supply voltage. All the circuit elements are formed on the same semiconductor substrate. Further, it is preferable to construct the constant voltage supply circuit in such a way that the output voltage thereof is programmable.

Abstract: This invention is a BiMOS logical circuit that provides a suitable output level with a limited number of components. The intermediate node of a PMOS transistor and an NMOS transistor is connected to the base of a bipolar transistor to control output voltage. The NMOS transistor is connected between the output terminal and the power source, and an output voltage approximately equal to the power supply voltage is obtained at the output terminal.

Abstract: The invention is a BiMOS logical circuit having a reduced number of components and increased operating speed. First and second MOS transistors are provided for, respectively, driving first and second bipolar transistors. The gates of these MOS transistors are, respectively, connected to the bases of the second and first bipolar transistors. The input terminal is connected to the gates of the MOS transistors.