Patents by Inventor Yasumori Narizuka

Yasumori Narizuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board and method for producing same
    Patent number: 6998713
    Abstract: The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring comprising a Cr or Ti layer, which is connected to the electrode and closely contacts with the insulation layer, and of a Cu layer which is closely contacts with the Cr or Ti layer; a protective film which covers the wiring and is provided with another hole for soldering; and a solder for the outer connection which is mounted in the both holes and brought to diffuse into the Cu layer to produce an alloy, and brought to reach the Cr or Ti layer thereby connecting the solder to the Cr or Ti layer.
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: February 14, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Yasumori Narizuka, Mitsuko Itou, Yoshihide Yamaguchi, Hiroyuki Tenmei
  • Wiring board and its production method, semiconductor device and its production method, and electronic apparatus
    Patent number: 6756688
    Abstract: There are provided a high density and low manufacturing cost wiring board with high reliability in connection, a semiconductor device and a producing method therefor. The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring consisting of a Cr or Ti layer, which is connected to the electrode and closely contacts with the insulation layer, and of a Cu layer which is closely contacts with the Cr or Ti layer; a protective film which covers the wiring and is provided with another hole for soldering; and a solder for the outer connection which is mounted in the both holes and brought to diffuse into the Cu layer to produce an alloy, and brought to reach the Cr or Ti layer thereby connecting the solder to the Cr or Ti layer.
    Type: Grant
    Filed: November 21, 2002
    Date of Patent: June 29, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Yasumori Narizuka, Mitsuko Itou, Yoshihide Yamaguchi, Hiroyuki Tenmei
  • Wiring board and its production method, semiconductor device and its production method, and electronic apparatus
    Patent number: 6515372
    Abstract: There are provided a high density and low manufacturing cost wiring board with high reliability in connection, a semiconductor device and a producing method therefor.The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring consisting of a Cr or Ti layer, which is connected to the electrode and closely contacts with the insulation layer, and of a Cu layer which is closely contacts with the Cr or Ti layer; a protective film which covers the wiring and is provided with another hole for soldering; and a solder for the outer connection which is mounted in the both holes and brought to diffuse into the Cu layer to produce an alloy, and brought to reach the Cr or Ti layer thereby connecting the solder to the Cr or Ti layer.
    Type: Grant
    Filed: August 20, 2001
    Date of Patent: February 4, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Yasumori Narizuka, Mitsuko Itou, Yoshihide Yamaguchi, Hiroyuki Tenmei