Patents by Inventor Yasunaga Suzuki

Yasunaga Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110285095
    Abstract: In a fluid pressure apparatus, a packing is constituted from an annular seal member made of an elastic rubber material, and support rings made of a material possessing low friction, which are mounted on an outer circumference of the seal member. The seal member includes, on an outer circumference thereof, a sealing projection, shoulder portions formed on both sides of the sealing projection, and concave grooves interposed between the shoulder portions and the sealing projection. The support rings include support surfaces on outer circumferences thereof, and engagement projections on inner circumferences thereof, such that by engagement of the projections in the concave grooves, the support rings are mounted on the seal member so as to surround outer circumferences of the shoulder portions.
    Type: Application
    Filed: May 13, 2011
    Publication date: November 24, 2011
    Applicant: SMC Kabushiki Kaisha
    Inventors: Masahiro OKUMA, Yasunaga Suzuki
  • Publication number: 20110283880
    Abstract: In a fluid pressure apparatus, a packing includes an annular seal member made of an elastic material, and support rings made of a low-friction material, which are mounted on an outer circumference of the seal member. The seal member includes, on an outer circumference thereof, a sealing projection that contacts an inner surface of the slide hole. The support rings are disposed on both sides of the sealing projection, and protrude beyond the seal member in the axial direction. Outer circumferential surfaces of the support rings always contact the inner circumferential surface of the slide hole. When a transverse load does not act on a piston as a partitioning member, the inner circumferential surfaces of the support rings do not contact the outer circumference of the piston. When a transverse load acts on the piston, the inner circumferential surfaces of the support rings contact the outer circumference of the piston.
    Type: Application
    Filed: May 13, 2011
    Publication date: November 24, 2011
    Applicant: SMC Kabushiki Kaisha
    Inventors: Masahiro OKUMA, Yasunaga Suzuki
  • Publication number: 20110283883
    Abstract: A fluid pressure apparatus includes a piston, and a packing provided on an outer circumference of the piston. The packing includes a support ring made of a low-friction material, and a ring-shaped seal member mounted to the support ring. When at least a certain amount of transverse load acts on the piston, an outer circumferential surface of the support ring abuts against an inner circumferential surface of the slide hole, whereby the piston is prevented from contacting with the inner circumferential surface of the slide hole.
    Type: Application
    Filed: May 13, 2011
    Publication date: November 24, 2011
    Applicant: SMC Kabushiki Kaisha
    Inventors: Masahiro Okuma, Yasunaga Suzuki
  • Patent number: 6520065
    Abstract: A cylinder tube of a cylinder has an outer periphery, as taken in the circumferential direction thereof but excepting the upright surface thereof, comprising: surfaces curved convexly outward, and first to third chamfered portions, and a casing of a position detecting sensor to be mounted on the cylinder has an outer periphery formed of surfaces curved convexly outward and a chamfered portion, thereby it is possible to prevent a liquid from being trapped on the outer surface for avoiding the sanitary problem.
    Type: Grant
    Filed: March 1, 2001
    Date of Patent: February 18, 2003
    Assignee: SMC Kabushiki Kaisha
    Inventors: Koji Sakurai, Yasunaga Suzuki
  • Publication number: 20010018862
    Abstract: A cylinder tube of a cylinder has an outer periphery, as taken in the circumferential direction thereof but excepting the upright surface thereof, comprising: surfaces curved convexly outward, and first to third chamfered portions, and a casing of a position detecting sensor to be mounted on the cylinder has an outer periphery formed of surfaces curved convexly outward and a chamfered portion, thereby it is possible to prevent a liquid from being trapped on the outer surface for avoiding the sanitary problem.
    Type: Application
    Filed: March 1, 2001
    Publication date: September 6, 2001
    Inventors: Koji Sakurai, Yasunaga Suzuki
  • Patent number: 5053909
    Abstract: Disclosed is a semiconductor integrated circuit device equipped with a buffer portion which includes a pair of an input buffer portion and an output buffer portion. When an input circuit equipped with an input protection circuit is formed at the input buffer portion, circuit elements for an output circuit disposed at the output buffer portion are used in order to constitute the input protection circuit.
    Type: Grant
    Filed: May 2, 1989
    Date of Patent: October 1, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Yasunaga Suzuki, Toshiaki Matsubara, Akira Uragami
  • Patent number: 5001487
    Abstract: A semiconductor integrated circuit device is disclosed. The circuit device uses modified (m+n) input cells, each equipped with high load driving functional elements disposed at the periphery of the cell, and having n signal input terminal(s) in addition to m normal signal input terminals that are incorporated in the cell.
    Type: Grant
    Filed: June 26, 1990
    Date of Patent: March 19, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Yasunaga Suzuki, Toshiaki Matsubara, Haruo Mamyoda, Akira Uragami
  • Patent number: 4827368
    Abstract: A semiconductor integrated circuit device is provided which is equipped with a buffer portion which includes a pair of an input buffer portion and an output buffer portion. When an input circuit equipped with an input protection circuit is formed at the input buffer portion, circuit elements for an output circuit disposed at the corresponding output buffer portion are used in order to constitute the input protection circuit.
    Type: Grant
    Filed: September 16, 1987
    Date of Patent: May 2, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Yasunaga Suzuki, Toshiaki Matsubara, Akira Uragami
  • Patent number: 4710842
    Abstract: A semiconductor integrated circuit device is provided which is equipped with a buffer portion which includes a pair of an input buffer portion and an output buffer portion. When an input circuit equipped with an input protection circuit is formed at the corresponding input buffer portion, circuit elements for an output circuit disposed at the output buffer portion are used in order to constitute the input protection circuit. Therefore, the circuit elements of the corresponding output buffer portion, which normally would be unused, are utilized to provide an important circuit function.
    Type: Grant
    Filed: March 18, 1986
    Date of Patent: December 1, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Yasunaga Suzuki, Toshiaki Matsubara, Akira Uragami
  • Patent number: D445704
    Type: Grant
    Filed: August 22, 2000
    Date of Patent: July 31, 2001
    Assignee: SMC Kabushiki Kaisha
    Inventor: Yasunaga Suzuki
  • Patent number: D575175
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: August 19, 2008
    Assignee: SMC Corporation
    Inventor: Yasunaga Suzuki
  • Patent number: D575176
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: August 19, 2008
    Assignee: SMC Corporation
    Inventor: Yasunaga Suzuki
  • Patent number: D575177
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: August 19, 2008
    Assignee: SMC Corporation
    Inventor: Yasunaga Suzuki
  • Patent number: D420683
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: February 15, 2000
    Assignee: SMC Kabushiki Kaisha
    Inventor: Yasunaga Suzuki