Abstract: Embodiments of the present invention provide methods and apparatuses for implementing hierarchical design-for-test (DFT) logic on a circuit. The hierarchical DFT logic implements DFT circuitry that can be dedicated to a module, and which can configure DFT circuitry for multiple modules to share a sequential input signal and/or to share a sequential output signal. During operation, the DFT circuitry for a first module can propagate a bit sequence from the sequential input signal to the DFT circuitry of a second module, such that the bit sequence can include a set of control signal values for controlling the DFT circuitry, and can include compressed test vectors for testing the modules. Furthermore, the DFT circuitry for the second module can generate a sequential response signal, which combines the compressed response vectors from the second module and a sequential response signal from the DFT circuitry of the first module.

Abstract: To increase scan compression during testing of an IC design, an X-chain method is provided. In this method, a subset of scan cells that are likely to capture an X are identified and then placed on separate X-chains. A configuration and observation modes for an unload selector and/or an unload compressor can be provided. The configuration and observation modes provide a first compression for non-X-chains that is greater than a second compression provided for X-chains. ATPG can be modified based on such configuration and observation modes. This X-chain method can be fully integrated in the design-for-test (DFT) flow, requires no additional user input, and has negligible impact on area and timing. Test generation results on industrial designs demonstrate significantly increased compression, with no loss of coverage, for designs with high X-densities.

Abstract: Embodiments of the present invention provide methods and apparatuses for implementing hierarchical design-for-test (DFT) logic on a circuit. The hierarchical DFT logic implements DFT circuitry that can be dedicated to a module, and which can configure DFT circuitry for multiple modules to share a sequential input signal and/or to share a sequential output signal. During operation, the DFT circuitry for a first module can propagate a bit sequence from the sequential input signal to the DFT circuitry of a second module, such that the bit sequence can include a set of control signal values for controlling the DFT circuitry, and can include compressed test vectors for testing the modules. Furthermore, the DFT circuitry for the second module can generate a sequential response signal, which combines the compressed response vectors from the second module and a sequential response signal from the DFT circuitry of the first module.

Abstract: To increase scan compression during testing of an IC design, an X-chain method is provided. In this method, a subset of scan cells that are likely to capture an X are identified and then placed on separate X-chains. A configuration and observation modes for an unload selector and/or an unload compressor can be provided. The configuration and observation modes provide a first compression for non-X-chains that is greater than a second compression provided for X-chains. ATPG can be modified based on such configuration and observation modes. This X-chain method can be fully integrated in the design-for-test (DFT) flow, requires no additional user input, and has negligible impact on area and timing. Test generation results on industrial designs demonstrate significantly increased compression, with no loss of coverage, for designs with high X-densities.