Abstract: Provided is a fire-fighting robot that can quickly start to fight a fire occurring at a hazardous location, which firefighters cannot access, and extinguish fires occurring at any location without receiving a supply of fire extinguishing water. The fire-fighting robot (1) of the present invention is self-propelled and remote-controlled via wireless or mobile communications to fight a fire. The robot includes one or more fire extinguisher storage portions (24a, 24b) for storing fire extinguishers (24c, 24d) which provide a jet of a fire-fighting agent from a jet outlet (26) by depressing a lever, a jet control portion disposed in the fire extinguisher storage portion (24a, 24b) for depressing the lever, and a jet outlet securing portion (26a) for detachably securing the jet outlet (26) of the fire extinguisher (24c, 24d).

Abstract: The invention provides a robot apparatus not requiring any incidental equipment in a building since an autonomous behavior is enabled, and capable of coping with abnormal phenomena. The robot apparatus includes means (112) for judging an autonomous mode or an autonomous/remote collaboration mode, means (113) for executing an autonomous motion when the mode judging means judges that the mode is an autonomous mode, means (117) for judging the collaboration ratio when the mode judging means judges that the mode is an autonomous/remote collaboration mode, means (118) for executing a complete remote motion when the judged collaboration ratio is 100% remote, and means (119) for executing an autonomous/remote collaboration motion when the judged collaboration ratio is not 100% remote.

Abstract: Provided is a fire-fighting robot that can quickly start to fight a fire occurring at a hazardous location, which firefighters cannot access, and extinguish fires occurring at any location without receiving a supply of fire extinguishing water. The fire-fighting robot (1) of the present invention is self-propelled and remote-controlled via wireless or mobile communications to fight a fire. The robot includes one or more fire extinguisher storage portions (24a, 24b) for storing fire extinguishers (24c, 24d) which provide a jet of a fire-fighting agent from a jet outlet (26) by depressing a lever, a jet control portion disposed in the fire extinguisher storage portion (24a, 24b) for depressing the lever, and a jet outlet securing portion (26a) for detachably securing the jet outlet (26) of the fire extinguisher (24c, 24d).

Abstract: A microwave plasma processing process and apparatus useful in the fabrication of integrated circuit (IC) or similar semiconductor devices, wherein the object or material to be processed, such as a semiconductor wafer, is processed with plasma generated using microwaves transmitted through a microwave transmission window disposed perpendicular to an electric field of the progressive microwaves in the waveguide.

Abstract: A downstream microwave plasma processing apparatus useful in fabricating an integrated circuit semiconductor device includes a waveguide, a microwave transmitting window perpendicular to a microwave electric field in the waveguide, a plasma generating chamber below the window and a reaction chamber separated from the plasma generating region by a gas-porous microwave shield. The microwave energy is transmitted into the plasma generating chamber through the microwave transmitting window, and generates a plasma which is confined therein by the shield. Radicals of a short-lived reactive gas, generated in the plasma, pass through the shield and impinge onto a workpiece placed in the reaction chamber. Uniform and effective downstream plasma etching or ashing is produced.

Abstract: After a semiconductor wafer is processed, a photoresist on the semiconductor wafer is removed by an irradiation of oxygen plasma while the wafer is cooled by a cooling device. The cooling device can be a susceptor or a stage on which the wafer is placed, and coolant flows through a pipe or duct installed thereto. Cooling of the wafer prevents the photoresist from being softened by the heat from the plasma. Thus, the inner side of the photoresist remains hard enough to support the affected surface portion of the photoresist, which is also difficult to remove, preventing the affected surface portion from sticking onto the surface of the wafer. Therefore, the affected portion can be more effectively irradiated by the plasma, and can be decomposed without leaving residue on the wafer. Reduced residue on the wafer surface contributes to improve production yield and quality of the products made from this wafer.

Abstract: A spin dryer including a rotary stage for supporting a substrate to be dried, particularly adapted for use in producing semiconductor devices, and a stationary cover spaced from the substrate. The stationary cover has at least the same area as that of the substrate and is provided with a number of openings for charging a dry and dust-free gas onto the substrate, whereby oxidation and dust-contamination of the substrate are avoided.

Abstract: A microwave plasma processing process and apparatus useful in the fabrication of integrated circuit (IC) or similar semiconductor devices, wherein the object or material to be processed, such as a semiconductor wafer, is processed with plasma generated using microwaves transmitted through a microwave transmission window disposed perpendicular to an electric field of the progressive microwaves in the waveguide.