Patents by Inventor Yasunobu Azuma

Yasunobu Azuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-dimensional memory device containing self-aligned interlocking bonded structure and method of making the same
    Patent number: 10381322
    Abstract: A first substrate has a first mesa structure that protrudes from a first bonding-side planar surface. A first metal pad structure is embedded within the first mesa structure. A second substrate has a first recess cavity that is recessed from a second bonding-side planar surface. A second metal pad structure is located at a recessed region of the first recess cavity. The first bonding-side planar surface and the second bonding-side planar surface are brought into physical contact with each other, while the first mesa structure is disposed within a volume of the first recess cavity by self-alignment. A gap is provided between the first metal pad structure and the second metal pad structure within a volume of the first recess cavity. A metal connection pad is formed by selectively growing a third metallic material from the first metal pad structure and the second metal pad structure.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: August 13, 2019
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: Yasunobu Azuma, Michiaki Sano