Patents by Inventor Yasunobu Kadota
Yasunobu Kadota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10199953Abstract: A power conversion device comprising: a plurality of first power semiconductor modules incorporating a series circuit of a first semiconductor device and a second semiconductor device, the series circuit connected in parallel to a series circuit of a first capacitor and a second capacitor which are connected in series to a direct current power supply; a plurality of second power semiconductor modules incorporating a bi-directional semiconductor device connected between a connection point between the first capacitor and the second capacitor and a connection point between the first semiconductor device and the second semiconductor device; and a laminated bus bar connecting main circuit terminals of the plurality of first power semiconductor modules and the plurality of second power semiconductor modules to each other. The laminated bus bar includes a pair of output bas bars disposed at a front side and a back side, respectively so as to facing each other.Type: GrantFiled: October 23, 2017Date of Patent: February 5, 2019Assignee: FUJI ELECTRIC CO., LTD.Inventor: Yasunobu Kadota
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Patent number: 10186980Abstract: A power conversion device includes: a plurality of first power semiconductor modules in each of which a series circuit of a first semiconductor device and a second semiconductor device is built in, each of the plurality of first power semiconductor modules being connected in parallel with a series circuit of a first capacitor and a second capacitor connected in series with a DC power source; and a plurality of second power semiconductor module in each of which a bidirectional semiconductor device is built in, the bidirectional semiconductor device being connected between a connection point between the first capacitor and the second capacitor and one of connection points between the first semiconductor devices and the second semiconductor devices. Each of the first power semiconductor modules and the second power semiconductor modules are arranged on a mounting surface of a cooling body in a staggered arrangement.Type: GrantFiled: September 22, 2017Date of Patent: January 22, 2019Assignee: FUJI ELECTRIC CO., LTD.Inventors: Yasunobu Kadota, Yasuaki Furusho
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Patent number: 10079552Abstract: A power conversion device including: a first capacitor and a second capacitor which are connected to each other in series; a plurality of first power semiconductor modules having terminals disposed on one surface; a plurality of second power semiconductor modules having terminals disposed on one surface; and a laminated bus bar connecting the first capacitor and the second capacitor and the plurality of modules, wherein the first power semiconductor modules and the second power semiconductor modules are disposed in such a manner that their respective output terminals face each other in a disposition direction of the terminals, and in the laminated bus bar, an output bus bar connecting the output terminals of the first power semiconductor modules and the second power semiconductor modules to each other is held in an insulated manner in an opening portion provided to the intermediate bus bar.Type: GrantFiled: October 23, 2017Date of Patent: September 18, 2018Assignee: FUJI ELECTRIC CO., LTD.Inventor: Yasunobu Kadota
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Publication number: 20180183350Abstract: A power conversion device including: a first capacitor and a second capacitor which are connected to each other in series; a plurality of first power semiconductor modules having terminals disposed on one surface; a plurality of second power semiconductor modules having terminals disposed on one surface; and a laminated bus bar connecting the first capacitor and the second capacitor and the plurality of modules, wherein the first power semiconductor modules and the second power semiconductor modules are disposed in such a manner that their respective output terminals face each other in a disposition direction of the terminals, and in the laminated bus bar, an output bus bar connecting the output terminals of the first power semiconductor modules and the second power semiconductor modules to each other is held in an insulated manner in an opening portion provided to the intermediate bus bar.Type: ApplicationFiled: October 23, 2017Publication date: June 28, 2018Applicant: FUJI ELECTRIC CO., LTD.Inventor: Yasunobu KADOTA
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Publication number: 20180183349Abstract: A power conversion device comprising: a plurality of first power semiconductor modules incorporating a series circuit of a first semiconductor device and a second semiconductor device, the series circuit connected in parallel to a series circuit of a first capacitor and a second capacitor which are connected in series to a direct current power supply; a plurality of second power semiconductor modules incorporating a bi-directional semiconductor device connected between a connection point between the first capacitor and the second capacitor and a connection point between the first semiconductor device and the second semiconductor device; and a laminated bus bar connecting main circuit terminals of the plurality of first power semiconductor modules and the plurality of second power semiconductor modules to each other. The laminated bus bar incudes a pair of output bas bars disposed at a front side and a back side, respectively so as to facing each other.Type: ApplicationFiled: October 23, 2017Publication date: June 28, 2018Applicant: FUJI ELECTRIC CO., LTD.Inventor: Yasunobu KADOTA
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Publication number: 20180145604Abstract: A power conversion device includes: a plurality of first power semiconductor modules in each of which a series circuit of a first semiconductor device and a second semiconductor device is built in, each of the plurality of first power semiconductor modules being connected in parallel with a series circuit of a first capacitor and a second capacitor connected in series with a DC power source; and a plurality of second power semiconductor module in each of which a bidirectional semiconductor device is built in, the bidirectional semiconductor device being connected between a connection point between the first capacitor and the second capacitor and one of connection points between the first semiconductor devices and the second semiconductor devices. Each of the first power semiconductor modules and the second power semiconductor modules are arranged on a mounting surface of a cooling body in a staggered arrangement.Type: ApplicationFiled: September 22, 2017Publication date: May 24, 2018Applicant: FUJI ELECTRIC CO., LTD.Inventors: Yasunobu Kadota, Yasuaki Furusho