Abstract: A method for producing a composite resin particle dispersion includes: performing polymerization A by polymerizing a styrene compound and a vinyl monomer other than the styrene compound to form a styrene-based resin; performing polymerization B by polymerizing a (meth)acrylic acid ester compound in the presence of the styrene-based resin to form intermediate resin particles containing the styrene-based resin and a (meth)acrylic acid ester-based resin; and performing polymerization C by polymerizing a styrene compound and a vinyl monomer other than the styrene compound in the presence of the intermediate resin particles to form composite resin particles. The mass ratio of the styrene-based resin to the (meth)acrylic acid ester-based resin in the composite resin particles is from 80:20 to 20:80. A difference between the lowest glass transition temperature and the highest glass transition temperature in the composite resin particles is 30° C. or more.

Abstract: A method for producing a composite resin particle dispersion includes: performing polymerization A by polymerizing a styrene compound and a vinyl monomer other than the styrene compound to form a styrene-based resin; performing polymerization B by polymerizing a (meth)acrylic acid ester compound in the presence of the styrene-based resin to form intermediate resin particles containing the styrene-based resin and a (meth)acrylic acid ester-based resin; and performing polymerization C by polymerizing a styrene compound and a vinyl monomer other than the styrene compound in the presence of the intermediate resin particles to form composite resin particles. The mass ratio of the styrene-based resin to the (meth)acrylic acid ester-based resin in the composite resin particles is from 80:20 to 20:80. A difference between the lowest glass transition temperature and the highest glass transition temperature in the composite resin particles is 30° C. or more.

Abstract: A particle-dispersed polyimide precursor solution contains: a polyimide precursor consisting of a polymer of a tetracarboxylic dianhydride and a diamine containing a fluorene-based diamine having a fluorene skeleton; particles; and an aqueous solvent containing water.

Abstract: A polyimide precursor-containing aqueous composition contains at least one polymer material selected from the group consisting of a water-insoluble fibrous organic substance and a polyalkylene oxide having a viscosity-average molecular weight of 5 million or more, a polyimide precursor, particles, and water.

Abstract: A polyimide precursor solution includes a polyimide precursor having a glass transition temperature Tg of equal to or higher than 300° C. after imidization, an aqueous solvent containing water, an organic amine compound, and resin particles having a volume average particle size of equal to or less than 100 nm.

Abstract: There is provided a porous polyimide film in which the pore distribution width A represented by the following formula is 1.15 or less, the average pore diameter is within a range of 0.50 ?m to 3.0 ?m, and the air permeation speed is 30 seconds or less: A=(D84/D16)1/2 wherein D16 is the pore diameter at 16% cumulation from the small diameter side of pores, and D84 is the pore diameter at 84% cumulation from the small diameter side of pores.

Abstract: A porous polyimide film has plural pores, in which an average flattening of the plural pores is within a range of 0.1 to 0.7, a coefficient of variation of a distance between adjacent pores is within a range of 0.10 to 0.40, and a front surface and aback surface communicate with each other through the plural pores.

Abstract: A method for producing a composite resin particle dispersion includes: polymerizing a (meth)acrylic acid ester compound to form a (meth)acrylic acid ester-based resin; and polymerizing a styrene compound and a vinyl monomer other than the styrene compound in the presence of the (meth)acrylic acid ester-based resin to form composite resin particles containing a styrene-based resin and the (meth)acrylic acid ester-based resin. The mass ratio of the styrene-based resin to the (meth)acrylic acid ester-based resin in the composite resin particles is from 80:20 to 20:80. A difference between the lowest glass transition temperature and the highest glass transition temperature in the composite resin particles is 30° C. or more.

Abstract: A pressure sensitive adhesive includes: composite resin particles that contain a styrene resin containing, as polymerization components, styrene and a vinyl monomer other than styrene, and a (meth)acrylate resin containing, as a polymerization component, a (meth)acrylate; and an aqueous solvent containing water, in which a mass ratio of the styrene resin to the (meth)acrylate resin (styrene resin:(meth)acrylate resin) is 80:20 to 20:80, a difference between the lowest glass transition temperature and the highest glass transition temperature of the composite resin particles is 30° C. or more, a melt viscosity of the composite resin particles at 100° C. is 4000 Pa·s or more and 20000 Pa·s or less, and, in a melt viscosity range of the composite resin particles of 4000 Pa·s or more and 20000 Pa·s or less, a slope of a logarithm of the melt viscosity of the composite resin particles relative to a temperature of the composite resin particles is ?0.08 or more and ?0.04 or less.

Abstract: A method for producing a composite resin particle dispersion includes: performing polymerization A by polymerizing a styrene compound and a vinyl monomer other than the styrene compound to form a styrene-based resin; performing polymerization B by polymerizing a (meth)acrylic acid ester compound in the presence of the styrene-based resin to form intermediate resin particles containing the styrene-based resin and a (meth)acrylic acid ester-based resin; and performing polymerization C by polymerizing a styrene compound and a vinyl monomer other than the styrene compound in the presence of the intermediate resin particles to form composite resin particles. The mass ratio of the styrene-based resin to the (meth)acrylic acid ester-based resin in the composite resin particles is from 80:20 to 20:80. A difference between the lowest glass transition temperature and the highest glass transition temperature in the composite resin particles is 30° C. or more.

Abstract: A polyimide precursor-containing aqueous composition contains a polyimide precursor, resin particles having a polyalkylene oxide group, and a solvent containing water and an aprotic polar solvent.

Abstract: A method for producing a liquid dispersion of composite resin particles includes polymerizing a styrene compound and an extra vinyl monomer together to give a styrene resin; polymerizing a (meth)acrylate compound in the presence of the styrene resin to give intermediate resin particles A, which are resin particles containing the styrene resin and a (meth)acrylate resin; polymerizing a styrene compound and an extra vinyl monomer in the presence of intermediate resin particles A to give liquid dispersion B, which is a liquid dispersion containing intermediate resin particles B; and adding a polymerization initiator to liquid dispersion B to give a liquid dispersion containing composite resin particles. In the composite resin particles as a whole, the ratio by mass between the styrene and (meth)acrylate resins is between 80:20 and 20:80. There is a difference of 30° C. or more between the lowest and highest glass transition temperatures of the composite resin particles.

Abstract: A polyimide precursor solution contains a polyimide precursor having a weight average molecular weight of 40,000 or more, and an aqueous solvent containing a tertiary amine compound and water, in which a viscosity of the polyimide precursor solution after a storage at 25° C. for 14 days is 50% or more and 200% or less with respect to a viscosity of the polyimide precursor solution before the storage.

Abstract: A particle-dispersed polyimide precursor solution contains a polyimide precursor having a unit represented by the following formula (I), particles, and a solvent, in which the particle-dispersed polyimide precursor solution satisfies both the following conditions (1) and (2), (in the formula (I), A represents a tetravalent organic group, and B represents a divalent organic group represented by any of the following formulas (B1) to (B4)), (in the formulas (B1) to (B4), Ar1, Ar10, and Ar11 each independently represent a trivalent aromatic group which may have a substituent, Ar2, Ar4, Ar5, Ar7 and Ar8 each independently represent a divalent aromatic group which may have a substituent, Ar3 and Ar6 each independently represent a tetravalent aromatic group which may have a substituent or a group represented by the following formula (II), Ar9 represents a divalent aromatic group which may have a substituent or a group represented by the following formula (III), X1 to X7 each independently represent N

Abstract: A particle-dispersed polyimide precursor solution contains: a polyimide precursor consisting of a polymer of a tetracarboxylic dianhydride and a diamine containing a fluorene-based diamine having a fluorene skeleton; particles; and an aqueous solvent containing water.

Abstract: A separator for a non-aqueous secondary battery includes: a polyimide porous film; and adhesive resin particles that are attached to a surface of the polyimide porous film and have a responsiveness to at least one of pressure and heat.

Abstract: An all-solid-state battery includes a positive electrode active material layer containing a positive electrode active material; a negative electrode active material layer containing a negative electrode active material; and a solid electrolyte layer containing a solid electrolyte and a porous polyimide film which holds the solid electrolyte. The porous polyimide film has a void ratio of 60% or more and 80% or less and a pore diameter of 0.1 ?m or more and 10 ?m or less.

Abstract: A polyimide precursor-containing aqueous composition contains at least one polymer material selected from the group consisting of a water-insoluble fibrous organic substance and a polyalkylene oxide having a viscosity-average molecular weight of 5 million or more, a polyimide precursor, particles, and water.

Abstract: A porous polyimide film has plural pores, in which an average flattening of the plural pores is within a range of 0.1 to 0.7, a coefficient of variation of a distance between adjacent pores is within a range of 0.10 to 0.40, and a front surface and aback surface communicate with each other through the plural pores.

Abstract: A polyimide precursor solution includes a polyimide precursor; an imidazole compound; a tertiary amine compound other than the imidazole compound; and an aqueous solvent containing water, in which a ratio of the number of moles of the imidazole compound to the number of moles of a tetracarboxylic dianhydride component of the polyimide precursor is 0.5 or more and less than 1.6, a ratio of the number of moles of the tertiary amine compound to the number of moles of the imidazole compound is within a range of 0.3 to 6.0, and a content of the water is 50% by mass or more with respect to the aqueous solvent.