Patents by Inventor Yasunobu Nakagawa
Yasunobu Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230398257Abstract: An object of the present invention is to provide a bioabsorbable and stretchable fibrous medical material that enables formation of ligation which provides a small and hard-to-unravel knot even with a weak force. The present invention provides a fibrous medical material which is a fibrous material composed of a molded article provided by spinning and drawing a bioabsorbable aliphatic polymer, wherein an elongation at break is 75% or greater, an intermediate elastic modulus in tension at a strain ranging from 0.25% and 10% is lower than an initial elastic modulus in tension at a strain ranging from 0.05% to 0.25%, the intermediate elastic modulus in tension is 400 MPa or less, and a residual strain rate after 100% deformation is 70% or less.Type: ApplicationFiled: October 25, 2021Publication date: December 14, 2023Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., National University Corporation Tokai National Higher Education and Research SystemInventors: Akira MAEHARA, Hitoshi HIRATA, Atsuhiko MURAYAMA, Yasunobu NAKAGAWA
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Patent number: 11124649Abstract: The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility. The present invention provides a curable resin composition comprising the following components: (A): a polyorganosiloxane represented by the average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.01?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the average composition formula: R2mHnSiO[(4-m-n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.5, and 0.8?m+n?3; (C): a zirconium compound; and (D): a hydrosilylation catalyst.Type: GrantFiled: July 10, 2017Date of Patent: September 21, 2021Assignee: NICHIA CORPORATIONInventors: Shinya Yabuno, Ryo Itaya, Yasunobu Nakagawa
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Publication number: 20210277236Abstract: The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility. The present invention provides a curable resin composition comprising the following components: (A): a polyorganosiloxane represented by the average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.01?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the average composition formula: R2mHnSiO[(4-m-n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.5, and 0.8?m+n?3; (C): a zirconium compound; and (D): a hydrosilylation catalyst.Type: ApplicationFiled: July 10, 2017Publication date: September 9, 2021Applicant: NICHIA CORPORATIONInventors: Shinya YABUNO, Ryo ITAYA, Yasunobu NAKAGAWA
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Patent number: 10947384Abstract: An objective of the present invention is to provide a curable resin composition for forming a cured product having excellent heat resistance, light resistance, flexibility, and toughness. The present invention provides a curable resin composition containing the following components in specific blended amounts. (A): A polyorganosiloxane represented by average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 R1 is alkyl, aryl, alkenyl, or the like; a proportion of the alkyl is from 30 to 98 mol %, a proportion of the aryl is from 1 to 50 mol %, and a proportion of the alkenyl is from 1 to 20 mol % relative to a total amount of R1; and a1>0, a2>0, a3?0, a4>0, 0.01?a1/a2?10, and a1+a2+a3+a4=1. (B): A polyorganosiloxane having not more than 10 silicon atoms and having a proportion of an alkenyl group relative to a total amount (100 mol %) of the organic groups bonded to the silicon atom from 20 to 60 mol %.Type: GrantFiled: August 24, 2017Date of Patent: March 16, 2021Assignee: DAICEL CORPORATIONInventors: Yasunobu Nakagawa, Shinya Yabuno
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Patent number: 10870758Abstract: An object of the present invention is to provide a curable resin composition for forming a less tacky cured product, having excellent gas barrier properties and heat and light resistance. This curable resin composition comprises the following components (A), (B), and (C): (A): a polyorganosiloxane represented by the following average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.5?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the following average composition formula: R2mHnSiO[(4?m?n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.0, and 0.8?m+n?3; and (C): a hydrosilylation catalyst.Type: GrantFiled: February 20, 2017Date of Patent: December 22, 2020Assignee: DAICEL CORPORATIONInventors: Shinya Yabuno, Ryo Itaya, Shigeaki Kamuro, Yasunobu Nakagawa
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Patent number: 10619046Abstract: An object of the present invention is to provide a curable resin composition for forming a less tacky cured product having excellent gas barrier properties, heat resistance, light resistance, flexibility and heat shock resistance. The curable resin composition comprises the following components (A), (B), (C), and (D), wherein a content of the component (C) is 0.3 to 20 wt %, based on the total amount of the composition: (A): a polyorganosiloxane represented by an average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4, wherein each R1 is alkyl, aryl, alkenyl, etc., and a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol %, based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.5?a1/a2?10, and a1+a2+a3+a4=1; (B): a polyorganosiloxane represented by an average composition formula: R2mHnSiO[(4-m-n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.0, and 0.Type: GrantFiled: March 23, 2017Date of Patent: April 14, 2020Assignee: DAICEL CORPORATIONInventors: Yasunobu Nakagawa, Shinya Yabuno
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Publication number: 20200049618Abstract: Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D>0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mm2 in separation load evaluation and/or a total separation load of not more than 0.018 N·mm per mm2.Type: ApplicationFiled: October 10, 2019Publication date: February 13, 2020Applicants: DAICEL CORPORATION, NICHIA CORPORATIONInventors: Yasunobu NAKAGAWA, Takeshi YOSHIDA, Satoru OGAWA, Masafumi KURAMOTO, Masahide BANDO
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Publication number: 20200048460Abstract: An object of the present invention is to provide a curable resin composition for forming a less tacky cured product, having excellent gas barrier properties and heat and light resistance. This curable resin composition comprises the following components (A), (B), and (C): (A): a polyorganosiloxane represented by the following average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.5?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the following average composition formula: R2mHnSiO[(4?m?n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.0, and 0.8?m+n?3; and (C): a hydrosilylation catalyst.Type: ApplicationFiled: February 20, 2017Publication date: February 13, 2020Applicant: DAICEL CORPORATIONInventors: Shinya YABUNO, Ryo ITAYA, Shigeaki KAMURO, Yasunobu NAKAGAWA
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Patent number: 10488325Abstract: Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D>0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mm2 in separation load evaluation and/or a total separation load of not more than 0.018 N·mm per mm2.Type: GrantFiled: June 22, 2017Date of Patent: November 26, 2019Assignees: DAICEL CORPORATION, NICHIA CORPORATIONInventors: Yasunobu Nakagawa, Takeshi Yoshida, Satoru Ogawa, Masafumi Kuramoto, Masahide Bando
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Publication number: 20190218346Abstract: An objective of the present invention is to provide a curable resin composition for forming a cured product having excellent heat resistance, light resistance, flexibility, and toughness. The present invention provides a curable resin composition containing the following components in specific blended amounts. (A): A polyorganosiloxane represented by average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 R1 is alkyl, aryl, alkenyl, or the like; a proportion of the alkyl is from 30 to 98 mol %, a proportion of the aryl is from 1 to 50 mol %, and a proportion of the alkenyl is from 1 to 20 mol % relative to a total amount of R1; and a1>0, a2>0, a3?0, a4>0, 0.01?a1/a2?10, and a1+a2+a3+a4=1. (B): A polyorganosiloxane having not more than 10 silicon atoms and having a proportion of an alkenyl group relative to a total amount (100 mol %) of the organic groups bonded to the silicon atom from 20 to 60 mol %.Type: ApplicationFiled: August 24, 2017Publication date: July 18, 2019Applicant: DAICEL CORPORATIONInventors: Yasunobu NAKAGAWA, Shinya YABUNO
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Publication number: 20190106571Abstract: An object of the present invention is to provide a curable resin composition for forming a less tacky cured product having excellent gas barrier properties, heat resistance, light resistance, flexibility and heat shock resistance. The curable resin composition comprises the following components (A), (B), (C), and (D), wherein a content of the component (C) is 0.3 to 20 wt %, based on the total amount of the composition: (A): a polyorganosiloxane represented by an average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4, wherein each R1 is alkyl, aryl, alkenyl, etc., and a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol %, based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.5?a1/a2?10, and a1+a2+a3+a4=1; (B): a polyorganosiloxane represented by the following average composition formula (II): R2mHnSiO[(4-m-n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.0, and 0.Type: ApplicationFiled: March 23, 2017Publication date: April 11, 2019Applicant: DAICEL CORPORATIONInventors: Yasunobu NAKAGAWA, Shinya YABUNO
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Publication number: 20170369751Abstract: Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D>0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mm2 in separation load evaluation and/or a total separation load of not more than 0.018 N·mm per mm2.Type: ApplicationFiled: June 22, 2017Publication date: December 28, 2017Applicants: DAICEL CORPORATION, NICHIA CORPORATIONInventors: Yasunobu NAKAGAWA, Takeshi YOSHIDA, Satoru OGAWA, Masafumi KURAMOTO, Masahide BANDO
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Patent number: 9646904Abstract: The curable resin composition according to the present invention includes a polyorganosiloxane (A), a silsesquioxane (B), an isocyanurate compound (C), and a silane coupling agent (D). The polyorganosiloxane (A) is a polyorganosiloxane approximately devoid of aryl groups. The silsesquioxane (B) includes a ladder-like silsesquioxane. The curable resin composition has excellent heat resistance, transparency and flexibility. It offers superior reflow resistance and barrier properties to a corrosive gas.Type: GrantFiled: January 9, 2014Date of Patent: May 9, 2017Assignee: DAICEL CORPORATIONInventors: Yasunobu Nakagawa, Shigeaki Kamuro
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Patent number: 9644098Abstract: Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance and transparency and, in particular, offers excellent barrier properties to a corrosive gas. The curable resin composition according to the present invention includes a polyorganosiloxane (A), an isocyanurate compound (B), and a silane coupling agent (C). The polyorganosiloxane (A) is an aryl-containing polyorganosiloxane. The polyorganosiloxane (A) preferably includes a polyorganosiloxane having a number-average molecular weight (Mn) of 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard.Type: GrantFiled: August 27, 2015Date of Patent: May 9, 2017Assignee: DAICEL CORPORATIONInventors: Shigeaki Kamuro, Yasunobu Nakagawa
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Patent number: 9481791Abstract: Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance and transparency and, in particular, offers excellent barrier properties to a corrosive gas. The curable resin composition according to the present invention includes a polyorganosiloxane (A), an isocyanurate compound (B), and a silane coupling agent (C). The polyorganosiloxane (A) is an aryl-containing polyorganosiloxane. The polyorganosiloxane (A) preferably includes a polyorganosiloxane having a number-average molecular weight (Mn) of 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard.Type: GrantFiled: February 4, 2014Date of Patent: November 1, 2016Assignee: DAICEL CORPORATIONInventors: Shigeaki Kamuro, Yasunobu Nakagawa
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Publication number: 20160017147Abstract: Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance and transparency and, in particular, offers excellent barrier properties to a corrosive gas. The curable resin composition according to the present invention includes a polyorganosiloxane (A), an isocyanurate compound (B), and a silane coupling agent (C). The polyorganosiloxane (A) is an aryl-containing polyorganosiloxane. The polyorganosiloxane (A) preferably includes a polyorganosiloxane having a number-average molecular weight (Mn) of 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard.Type: ApplicationFiled: February 4, 2014Publication date: January 21, 2016Applicant: DAICEL CORPORATIONInventors: Shigeaki KAMURO, Yasunobu NAKAGAWA
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Publication number: 20150368514Abstract: Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance and transparency and, in particular, offers excellent barrier properties to a corrosive gas. The curable resin composition according to the present invention includes a polyorganosiloxane (A), an isocyanurate compound (B), and a silane coupling agent (C). The polyorganosiloxane (A) is an aryl-containing polyorganosiloxane. The polyorganosiloxane (A) preferably includes a polyorganosiloxane having a number-average molecular weight (Mn) of 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard.Type: ApplicationFiled: August 27, 2015Publication date: December 24, 2015Applicant: DAICEL CORPORATIONInventors: Shigeaki KAMURO, Yasunobu NAKAGAWA
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Publication number: 20150340299Abstract: Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance, transparency, and flexibility and, in particular, offers superior reflow resistance and barrier properties to a corrosive gas. The curable resin composition according to the present invention includes a polyorganosiloxane (A), a silsesquioxane (B), an isocyanurate compound (C), and a silane coupling agent (D). The polyorganosiloxane (A) is a polyorganosiloxane approximately devoid of aryl groups. The silsesquioxane (B) includes a ladder-like silsesquioxane.Type: ApplicationFiled: January 9, 2014Publication date: November 26, 2015Applicant: DAICEL CORPORATIONInventors: Yasunobu NAKAGAWA, Shigeaki KAMURO
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Patent number: 9181397Abstract: Provided is a curable resin composition capable of forming a cured product which has excellent heat resistance, transparency, and flexibility and particularly excels in reflow resistance and barrier properties to a corrosive gas. The curable resin composition includes a ladder-type polyorganosilsesquioxane and an isocyanurate compound such as a triglycidyl isocyanurate compound, a monoallyl diglycidyl isocyanurate compound, a diallyl monoglycidyl isocyanurate compound, or a triallyl isocyanurate compound.Type: GrantFiled: December 19, 2012Date of Patent: November 10, 2015Assignee: DAICEL CORPORATIONInventors: Shigeaki Kamuro, Yasunobu Nakagawa
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Publication number: 20140332987Abstract: Provided is a curable resin composition capable of forming a cured product which has excellent heat resistance, transparency, and flexibility and particularly excels in reflow resistance and barrier properties to a corrosive gas. The curable resin composition includes a ladder-type polyorganosilsesquioxane and an isocyanurate compound such as a triglycidyl isocyanurate compound, a monoallyl diglycidyl isocyanurate compound, a diallyl monoglycidyl isocyanurate compound, or a triallyl isocyanurate compound.Type: ApplicationFiled: December 19, 2012Publication date: November 13, 2014Inventors: Shigeaki Kamuro, Yasunobu Nakagawa