Abstract: There are provided a surface-coated copper filler having an excellent oxidation resistance for use in a conductive composition, a method for producing the surface-coated copper filler, and a conductive composition containing the surface-coated copper filler. The surface-coated copper filler comprises: a copper particle; a first coating layer containing an amine compound, which is bonded to copper on a surface of the copper particle via a chemical bond and/or a physical bond; and a second coating layer containing an aliphatic monocarboxylic acid having 8 to 20 carbon atoms, which is bonded to the amine compound via a chemical bond. The amine compound is represented by the following formula (1): H2NCH2mNHnCH2mNH2??(1) wherein m is an integer of 0 to 3, n is an integer of 0 to 2, m is 0 to 3 when n is 0, and m is 1 to 3 when n is 1 or 2.

Abstract: There are provided a surface-coated copper filler having an excellent oxidation resistance for use in a conductive composition, a method for producing the surface-coated copper filler, and a conductive composition containing the surface-coated copper filler. The surface-coated copper filler comprises: a copper particle; a first coating layer containing an amine compound, which is bonded to copper on a surface of the copper particle via a chemical bond and/or a physical bond; and a second coating layer containing an aliphatic monocarboxylic acid having 8 to 20 carbon atoms, which is bonded to the amine compound via a chemical bond. The amine compound is represented by the following formula (1): H2N??CH2?mNH?n?CH2?mNH2??(1) wherein m is an integer of 0 to 3, n is an integer of 0 to 2, m is 0 to 3 when n is 0, and m is 1 to 3 when n is 1 or 2.