Abstract: A method for manufacturing a laminated ceramic electronic component allows for production of highly reliable laminated ceramic electronic components even when the coating rate of a ceramic slurry on a surface of a carrier film is increased in order to reduce the thickness of the ceramic green sheet. A ceramic green sheet is formed by pulling out a carrier film from a carrier film roll, coating the film with a ceramic slurry using a coating apparatus, drying the film with a drying apparatus, and rolling up the film using a take-up apparatus. The carrier film is unrolled, an internal electrode pattern is printed thereon by a printing apparatus, the surface of the film is dried, and the film is rolled up by the take-up apparatus. The rolled carrier film is pulled out, the ceramic green sheet is peeled away, and a plurality of the ceramic green sheets are laminated. Following the cutting of the laminated body into individual elements, these elements are fired, and external electrodes are formed thereon.

Abstract: A method for producing a ceramic electronic part includes forming a plurality of internal electrodes arranged in a ceramic sintered compact, superimposed via a ceramic layer. The free ends of the internal electrodes are formed to have a wedge-like cross-sectional shape, with the length L of the wedge and the internal thickness t of the electrode at the base of the wedge satisfying the relationship L>2t so that there is no risk of generating inter-layer peel-off or delamination in the ceramic layers.

Abstract: A method for manufacturing a laminated ceramic electronic component allows for production of highly reliable laminated ceramic electronic components even when the coating rate of a ceramic slurry on a surface of a carrier film is increased in order to reduce the thickness of the ceramic green sheet. A ceramic green sheet is formed by pulling out a carrier film from a carrier film roll, coating the film with a ceramic slurry using a coating apparatus, drying the film with a drying apparatus, and rolling up the film using a take-up apparatus. The carrier film is unrolled, an internal electrode pattern is printed thereon by a printing apparatus, the surface of the film is dried, and the film is rolled up by the take-up apparatus. The rolled carrier film is pulled out, the ceramic green sheet is peeled away, and a plurality of the ceramic green sheets are laminated. Following the cutting of the laminated body into individual elements, these elements are fired, and external electrodes are formed thereon.

Abstract: A multilayer ceramic capacitor comprises a sintered ceramic compact including primary crystalline phases and secondary phases. The primary crystalline phases mainly contain CaTiO3 and CaZrO3. The secondary phases mainly contain Si and Ca. The amount of Ca in the secondary phase is about 30 mol % or less.

Abstract: The present invention provides a method for manufacturing an electronic component of laminated ceramics such as a laminated ceramic capacitor in which, when a ceramic paste is applied on a ceramic green sheet in order to substantially eliminate steps caused by the thickness of a film of inner circuit elements such as an inner electrode, the ceramic paste is prevented from generating a gap between the paste and the film of inner circuit elements, or the thickness of the ceramic paste is prevented from being increased, by allowing the paste to overflow the film of inner circuit elements, even when the application position has been a little shifted, wherein an inclined face is formed at the periphery of an inner electrode that serves as the film of inner circuit elements, the ceramic paste being applied so as to overlap the periphery of the inner electrode, and wherein the used ceramic paste contains about 40% by weight to 85% by weight of solvents in order to facilitate smooth leveling of the applied ceramic pa

Abstract: A sorting method of monolithic ceramic capacitors in which high reliable sorting can be efficiently achieved based on measuring an insulating resistance involves first performing a burn-in process, which applies not less than double of the rated voltage at the maximum working temperature to a monolithic ceramic capacitor. Thereafter, a high temperature insulation resistance measuring process, which involves measuring an insulation resistance while applying not less than the rated voltage at a temperature of not less than 70° C. to the monolithic ceramic capacitor, is performed so that monolithic ceramic capacitors having abnormal insulation resistances are eliminated. Preferably, the direction of applied voltage in the burn-in process agrees with the direction of applied voltage in the high temperature insulation resistance measuring process.

Abstract: In the temperature of 70-140 degrees C., the burn-in process of applying a voltage to monolithic ceramic capacitors so that the strength of the electric field applied between the internal electrodes opposing each other may be 7 30 kV/mm is performed. Subsequently, the insulation resistance of the monolithic ceramic capacitor is measured. The monolithic ceramic capacitors are sorted based on the insulation resistance measured during this insulation-resistance measurement process. In this case, it is sufficient to apply the burn-in process for 2-300 seconds.

Abstract: A dicing blade is disclosed which is capable of precisely cutting an object at a high speed without causing significant deposition of swarf upon a cut surface even when the object being cut has a large thickness. The dicing blade includes a ring-shaped cutting blade having a cutting edge formed on the peripheral rim of the ring-shaped cutting blade. At least one slit with a depth greater than the thickness of an object to be cut is formed in the cutting edge.

Abstract: A monolithic capacitor includes a plurality of monolithic ceramic capacitor elements provided with external electrodes at both ends thereof, solder layers arranged on the entire surfaces of the external electrodes of the monolithic ceramic capacitor elements, and metal terminals electrically connected to the external electrodes of the monolithic ceramic capacitor elements. The monolithic ceramic capacitor elements are joined to each other by the solder layers and are stacked on each other. The external electrodes of the monolithic ceramic capacitor elements are electrically connected to each other by the solder layers.

Abstract: A ceramic capacitor made from a ceramic mainly containing a CaZrO3-CaTiO3 solid solution exhibiting a high solid solubility is provided. The powder X-ray diffraction pattern of the ceramic satisfies conditions: (X-ray intensity of valley D)/(X-ray intensity of peak B)<0.2; and (X-ray intensity of valley E)/(X-ray intensity of peak B)<0.2, wherein the peak B is assigned to the (121) plane of the CaZrO3-CaTiO3 solid solution at approximately 32.0°, the valley D lies at approximately 31.8° between a peak A which is assigned to the (200) plane of the CaZrO3-CaTiO3 solid solution detected at approximately 31.6° and the peak B, and the valley E lies at approximately 32.2° between the peak B and a peak C which is assigned to the (002) plane of the CaZrO3-CaTiO3 solid solution detected at approximately 32.4°. A manufacturing method therefor is also provided.

Abstract: A monolithic capacitor including a sintered body formed from a TiO2-containing reduction-resistant dielectric ceramic material; a plurality of internal electrodes which are formed inside the sintered body, the electrodes being formed of a base metal; and first and second external electrodes which are formed on the sintered body, the internal electrodes being electrically connected to the external electrodes; wherein the amount of Ti contained in a secondary phase of the sintered body is about 2 wt. % or less as TiO2. A process for producing the monolithic capacitor of the present invention is also disclosed.

Abstract: A ceramic electronic component includes a ceramic electronic component body having two end faces opposing each other, side faces connecting the two end faces, and terminal electrodes formed on each end face; and terminal members, each including a metal being soldered to one of the terminal electrodes. Each of the terminal electrodes includes a metal layer formed only on the end face, a conductive resin layer formed on the metal layer, the conductive resin layer including metal powder and resin, and a plating film on the conductive resin layer.

Abstract: A ceramic electronic component includes at least one component body having two end faces opposing each other and side faces connecting the two end faces, and terminal electrodes formed on the component body. Each of the terminal electrodes extends from each end face to edge portions of each side face of the component body. Each of the terminal electrodes includes a metal layer formed on at least each end face of the component body, a conductive resin layer for covering at least portions of the side faces of the component body, and a metal plating film covering the outer surface of the terminal electrode. The conductive resin layer extends from the metal layer including the edge of the metal layer to the portions of the side faces, and includes a conductive resin containing metal powder and resin. The thickness of the conductive resin layer above the side faces is at least about 10 &mgr;m.

Abstract: An electronic multilayer ceramic component is disclosed which is less susceptible to having a crack or delamination in a sintered ceramic block and has high thermal shock resistance, high humidity resistance, and high reliability. Dimensional parameters EW, WG, T, and G of the electronic multilayer ceramic component are determined such that the following conditions are satisfied: WG/EW≧0.3; and T/G≦7.0, where EW is the width of inner electrodes, WG is the width of a side gap region between the ends of the inner electrodes and one of side faces of a sintered ceramic block, T is the thickness of a region in which the plurality of inner electrodes are laminated, and G is the thickness of one of the outermost ceramic layers parallel to the plurality of inner electrodes and located outside the region in which the plurality of inner electrodes are laminated.

Abstract: A method for manufacturing a highly reliable laminated ceramic capacitor that hardly causes an interlayer peeling phenomenon such as delamination and hardly suffers invasion of a plating solution during plating or invasion of water and moisture during use, comprising the steps of: preparing a non-fired ceramic green chip comprising at least one layer of internal electrode containing a metallic compound comprising a metal that forms a solid solution with the internal electrode, or reacts with the internal electrode to form a compound, or segregates on the internal electrode or at the periphery of the internal electrode; firing the green chip to allow the metal in the metallic compound to form a solid solution with the internal electrode, to react with the internal electrode to form a compound, or to segregate the metallic compound on the internal electrode or at the periphery of the metallic compound, thereby enhancing the adhesion between the internal electrode and the ceramic; and forming external electrodes

Abstract: A laminated ceramic electronic component using a ceramic sintered body mainly comprising CaZrO3, which can be fired in a neutral or reducing atmosphere at a low temperature and in which inner electrodes are formed using cheap base metals. The inner electrodes Ni are disposed so as to be stacked via a ceramic layer in the ceramic sintered body having a principal component of CaZrO3 and containing a MnO2 phase and a glass phase, and forming outer electrodes on the outer surfaces of the ceramic sintered body.

Abstract: A monolithic ceramic capacitor includes a sintered ceramic compact having a core-shell structure, a plurality of internal electrodes arranged in and separated by the ceramic sintered compact so as to overlap in the thickness direction, and a plurality of external electrodes formed on the outermost faces of the ceramic sintered compact. In the core-shell structure, cores are composed of a particulate dielectric ceramic, and shells are formed on the cores and are composed of a material having a dielectric constant lower than that of the dielectric ceramic. The area ratio of the cores to the shells lies in a range of 7:3 to 3:7 in a cross-section of the sintered ceramic compact in an arbitrary direction. The core-shell structure can achieve further miniaturization and higher capacitance of the monolithic ceramic capacitor, in addition to superior temperature characteristics.

Abstract: A ceramic electronic part includes a plurality of internal electrodes arranged in a ceramic sintered compact, superimposed via a ceramic layer. The free ends of the internal electrodes are formed to have a wedge-like cross-sectional shape, with the length L of the wedge and the internal thickness t of the electrode at the base of the wedge satisfying the relationship L>2t so that there is no risk of generating inter-layer peel-off or delamination in the ceramic layers.

Abstract: The present invention provides a laminated ceramic capacitor having good temperature characteristics, and suitable for attaining miniaturization, large capacitance and low production cost besides having high reliability in the high temperature load test, wherein a plurality of inner electrodes are formed in a ceramic sintered body comprising a reduction resistant dielectric ceramic in which grains having a core-shell structure and grains having a homogeneous structure are mixed together, and wherein outer electrodes are formed on the outer surfaces of the ceramic sintered body, the area ratio between the total area of the grains having the core-shell structure and the total area of the grains having the homogeneous structure being adjusted within a the range of about 2:8 to 4:6 when a cross section is observed along an arbitrary direction of the ceramic sintered body.

Abstract: The present invention provides a reliable ceramic electronic component in which cracks are hardly generated in the ceramic sintered body when a heat impact is applied or even when a stress caused by bending of a printed circuit board after packaging is applied, wherein inner electrodes are disposed in the ceramic sintered body, and wherein a first and second outer electrodes are formed so as to cover the first and second end faces, the first and second outer electrodes comprising electrode cover members extending to the upper face and lower face, up to both side faces of the ceramic sintered body, and the distance e and the distance Lg satisfying the relation of 1.5×Lg≦e≦3.