Patents by Inventor Yasunobu Yoshidomi

Yasunobu Yoshidomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication process of wiring board
    Patent number: 5664325
    Abstract: A wiring board is fabricated through the following steps:(A) forming, on one side of an elongated carrier metal foil made of a first metal, a thin layer with a second metal whose etching conditions are different from those of the first metal;(B) forming, on a surface of the thin layer, a desired wiring pattern with a third metal whose etching conditions are different from those of the second metal;(C) superposing the carrier metal foil on an insulating substrate with the side of the wiring pattern being positioned inside, whereby the wiring pattern is embedded in the insulating substrate; and(D) etching off the carrier metal foil and the thin layer at desired parts thereof.
    Type: Grant
    Filed: March 27, 1995
    Date of Patent: September 9, 1997
    Assignee: Hitachi Chemical Co. Ltd.
    Inventors: Naoki Fukutomi, Hajime Nakayama, Yoshiaki Tsubomatsu, Kouichi Kaitou, Yasunobu Yoshidomi, Yoshihiro Takahashi
  • Fabrication process of wiring board
    Patent number: 5426850
    Abstract: A wiring board is fabricated through the following steps:(A) forming, on one side of an elongated carrier metal foil made of a first metal, a thin layer with a second metal whose etching conditions are different from those of the first metal;(B) forming, on a surface of the thin layer, a desired wiring pattern with a third metal whose etching conditions are different from those of the second metal;(C) superposing the carrier metal foil on an insulating substrate with the side of the wiring pattern being positioned inside, whereby the wiring pattern is embedded in the insulating substrate; and(D) etching off the carrier metal foil and the thin layer at desired parts thereof.
    Type: Grant
    Filed: November 30, 1992
    Date of Patent: June 27, 1995
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Naoki Fukutomi, Hajime Nakayama, Yoshiaki Tsubomatsu, Kouichi Kaitou, Yasunobu Yoshidomi, Yoshihiro Takahashi