Patents by Inventor Yasunori AMBE

Yasunori AMBE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting resin composition, prepreg, metal-clad laminate, printed wiring board, film with resin, and metal foil with resin
    Patent number: 11414528
    Abstract: A thermosetting resin composition contains a thermosetting resin and an inorganic filler. The thermosetting resin includes a curing agent. A 3 mass % methyl ethyl ketone solution of the curing agent has a Gardner color scale of 15 or more. The content of the curing agent accounts for 10 mass % or more of a total solid content of the thermosetting resin composition.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: August 16, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryuji Takahashi, Shimpei Obata, Yasunori Ambe, Tomo Muguruma
  • RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
    Publication number: 20220025171
    Abstract: A resin composition contains an epoxy compound, a maleimide compound, a phenolic compound, core-shell rubber, and an inorganic filler. The maleimide compound has an N-phenyl maleimide structure. The content of the maleimide compound falls within a range from 10 parts by mass to less than 40 parts by mass with respect to 100 parts by mass in total of the epoxy compound, the maleimide compound, and the phenolic compound.
    Type: Application
    Filed: November 15, 2019
    Publication date: January 27, 2022
    Inventors: Tomo MUGURUMA, Ryuji TAKAHASHI, Shimpei OBATA, Yasunori AMBE
  • THERMOSETTING RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, FILM WITH RESIN, AND METAL FOIL WITH RESIN
    Publication number: 20200332078
    Abstract: A thermosetting resin composition contains a thermosetting resin and an inorganic filler. The thermosetting resin includes a curing agent. A 3 mass % methyl ethyl ketone solution of the curing agent has a Gardner color scale of 15 or more. The content of the curing agent accounts for 10 mass % or more of a total solid content of the thermosetting resin composition.
    Type: Application
    Filed: October 12, 2018
    Publication date: October 22, 2020
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryuji TAKAHASHI, Shimpei OBATA, Yasunori AMBE, Tomo MUGURUMA