Patents by Inventor Yasunori Anbe

Yasunori Anbe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • REMOVABLE COPPER FOIL ATTACHED SUBSTRATE AND METHOD FOR PRODUCING CIRCUIT BOARD
    Publication number: 20150208518
    Abstract: It is an object of the present invention to provide a removable copper foil attached substrate capable of easily producing a coreless circuit board at low production cost and low raw material cost as compared with a conventional example. The substrate includes a release resin layer attached copper foil including a copper foil and a release resin layer attached on a surface of the copper foil; and a support layer. The release resin layer attached copper foil is integrally bonded to the support layer with the release resin layer in-between. The release resin layer allows removal of the copper foil from the support layer. A peel strength for removal of the copper foil from the support layer is 20 to 300 N/m.
    Type: Application
    Filed: August 29, 2013
    Publication date: July 23, 2015
    Applicant: Panasonic Intellectual Property Management Co. Ltd
    Inventors: Kentaro Fujino, Tatsuo Yonemoto, Hirofumi Midorikawa, Yasunori Anbe