Abstract: This invention provides a glass composition for joining ceramic articles to ceramic or metallic articles, the composition comprising:(i) about 100 parts by weight of at least one of TiN, TiB.sub.2, AlN, AlB.sub.2, BN, B.sub.4 C, SiC and Si.sub.3 N.sub.4 powders,(ii) about 20 to about 1600 parts by weight of SiO.sub.2 powder,(iii) about 1 to about 600 parts by weight of B.sub.2 O.sub.3 powder, and(iv) about 1 to about 1600 parts by weight of at least one of powders of (R.sup.1).sub.2 O wherein R.sup.1 is Na, K or Li, (R.sup.2)O wherein R.sup.2 is Mg, Ca, Ba, Zn, Pb or Cd, (R.sup.3)O.sub.2 wherein R.sup.3 is Ti, Zr or Mn, and (R.sup.4).sub.2 O.sub.3 wherein R.sup.4 is Al or Bi.

Abstract: A composition for forming electroless plating on ceramics which comprises (i) 1 weight part of at least one member selected from the group consisting of organic palladium compounds and organic silver compounds, (ii) 0.1 to 200 weight parts of at least one member selected from the group consisting of organic metal compounds, (iii) 10 to 1000 weight parts of an organic solvent and optionally (iv) 1 to 500 weight parts of at least one member selected from the group consisting of high molecular compounds and particulate inorganic substances.

Abstract: A composition for chemical copper plating having a pH of 12 to 14 and containing a boron hydride compound serving as a reducing agent, a water-soluble copper compound and a copper complexing agent, the composition being characterized in that the copper complexing agent is at least one of hydroxyalkyl-substituted ethylenediamines represented by the formula ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are the same or different and are each unsubstituted lower alkyl or hydroxyl- and/or carboxyl-substituted lower alkyl, and at least one of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 is hydroxyl-substituted lower alkyl, and hydroxyalkyl-substituted diethylenetriamines represented by the formula ##STR2## wherein R.sub.5, R.sub.6, R.sub.7 and R.sub.8 are the same or different and are each unsubstituted lower alkyl or hydroxyl-and/or carboxyl substituted lower alkyl, R.sub.9 is hydrogen or unsubstituted lower alkyl or hydroxyl-and/or carboxyl-substituted lower alkyl, and at least one of R.sub.5, R.sub.6, R.sub.

Abstract: Electrolytic stripping bath for removing metal coatings from stainless steel base material comprising at least one reducing compound selected from the group consisting of dimethylformamide, formaldehyde, thiosulfates, sulfites, hydrazine, hydroxylamine and dimethylaminoboron with the conventional compounds and having a pH of 6.0 to 9.5.