Abstract: A shaft portion formed at a vertical wall of a sensor housing is formed in a circular column shape, and an abut portion is formed facing a support wall, below the shaft portion. A width dimension of the abut portion is the same as the diameter dimension of the shaft portion as seen in plan view, and the abut portion is formed so as to overlap entirely with the shaft portion as seen from the opposite side of the shaft portion to the abut portion. Foreign objects such as dirt or dust that fall onto the circular column shaped shaft portion therefore readily slide over the shaft portion and fall down from the shaft portion, and foreign objects such as dirt or dust do not stay on the abut portion.

Abstract: A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the front of the semiconductor light emitting element. The lead includes an elongated mounting portion projecting from the resin package. The mounting portion includes a pair of first projections spaced from each other in the longitudinal direction and a second projection positioned between the first projections. The first projections and the second projection project in opposite directions from each other in the width direction of the mounting portion.

Abstract: An electric toothbrush as a vibration generator is provided with a case, a motor, an eccentric rod, a stem, and an oral hygiene member. The eccentric rod has an eccentric weight portion and a rod portion connected to a drive shaft of the motor. The angle between the first central axis of the eccentric weight portion and an extension line, defined by extending the second central axis of the rod portion towards the eccentric weight portion, is greater than 0 degrees and equal to or less than approximately 10 degrees in a state in which one end of the eccentric rod is not inserted into a shaft receiving portion. In this way, a fixed structure of an eccentric rod and a vibration generator are obtained which reduce noise generated by vibration when run at high as well as at low rotation speeds.

Abstract: A webbing take-up device is provided capable of preventing or suppressing a frame from deforming such that one of leg-plates or a back-plate displaces towards the other. A face on the center of curvature side of a curved portion of a front back plate section configuring the frame and a one width direction edge namely an upper edge of a bar support face each other along the up-low direction. When the front edge sides of leg-plates are displaced to rise due to a webbing being pulled, the one width direction edge of the bar support interferes with a front end of the front back plate section to prevent or suppress the front edge sides of the leg-plates from rising further. Deformation of the frame caused by the front edge sides of the leg-plates to rise can accordingly be prevented or suppressed.

Abstract: An electric toothbrush as a vibration generator is provided with a case, a motor, an eccentric rod, a stem, and an oral hygiene member. The eccentric rod has an eccentric weight portion and a rod portion connected to a drive shaft of the motor. The angle between the first central axis of the eccentric weight portion and an extension line, defined by extending the second central axis of the rod portion towards the eccentric weight portion, is greater than 0 degrees and equal to or less than approximately 10 degrees in a state in which one end of the eccentric rod is not inserted into a shaft receiving portion. In this way, a fixed structure of an eccentric rod and a vibration generator are obtained which reduce noise generated by vibration when run at high as well as at low rotation speeds.

Abstract: A semiconductor light emitting device (A) includes a semiconductor light emitting element (2) including a light emitting layer (22), a lead (1) formed with a reflector (11) that surrounds the semiconductor light emitting element (2), a light transmitting resin (4) covering the semiconductor light emitting element (2). The reflector (11) of the lead (1) includes a recess (12) at the bottom surface. The semiconductor light emitting element (2) is mounted to a bottom surface of the recess (12), with the light emitting layer (22) positioned outside the recess (12). A highly heat conductive material (3) having a thermal conductivity higher than that of the light transmitting resin (4) is loaded between the semiconductor light emitting element (2) and the recess (12).

Abstract: A semiconductor light emitting device (A) includes a semiconductor light emitting element (2) including a light emitting layer (22), a lead 11) formed with a reflector (11) that surrounds the semiconductor light emitting element (2), a light transmitting resin (4) covering the semiconductor light emitting element (2). The reflector (11) of the lead (1) includes a recess (12) at the bottom surface. The semiconductor light emitting element (2) is mounted to a bottom surface of the recess (12), with the light emitting layer (22) positioned outside the recess (12). A highly heat conductive material (3) having a thermal conductivity higher than that of the light transmitting resin (4)is loaded between the semiconductor light emitting element (2) and the recess (12).

Abstract: A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens.

Abstract: A semiconductor light emitting device (A) includes a semiconductor light emitting element (2) including a light emitting layer (22), a lead (1) formed with a reflector (11) that surrounds the semiconductor light emitting element (2), a light transmitting resin (4) covering the semiconductor light emitting element (2). The reflector (11) of the lead (1) includes a recess (12) at the bottom surface. The semiconductor light emitting element (2) is mounted to a bottom surface of the recess (12), with the light emitting layer (22) positioned outside the recess (12). A highly heat conductive material (3) having a thermal conductivity higher than that of the light transmitting resin (4) is loaded between the semiconductor light emitting element (2) and the recess (12).

Abstract: A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens.

Abstract: In a pretensioner device, a boot formed into a cylindrical shape covers a circumference of an elongated member, and a tip end of webbing inserted into an insertion hole of a joint anchor through a pair of through-holes formed on an upper end side of the boot is sewn at portions in front of and behind an insertion portion, whereby the boot is engaged with the elongated member. The insertion hole of the joint anchor is exposed to outside of the boot through the pair of through-holes of the boot even in a state in which the elongated member is covered with the boot. Therefore, positional shift of the boot relative to the webbing is prevented, and sewing operation of the webbing may be performed by inserting the tip end of the webbing into the insertion hole of the joint anchor after covering the elongated member with the boot.

Abstract: A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens.

Abstract: A semiconductor light emitting device (A) includes a semiconductor light emitting element (2) including a light emitting layer (22), a lead (1) formed with a reflector (11) that surrounds the semiconductor light emitting element (2), a light transmitting resin (4) covering the semiconductor light emitting element (2). The reflector (11) of the lead (1) includes a recess (12) at the bottom surface. The semiconductor light emitting element (2) is mounted to a bottom surface of the recess (12), with the light emitting layer (22) positioned outside the recess (12). A highly heat conductive material (3) having a thermal conductivity higher than that of the light transmitting resin (4) is loaded between the semiconductor light emitting element (2) and the recess (12).

Abstract: In a pretensioner device, a boot formed into a cylindrical shape covers a circumference of an elongated member, and a tip end of webbing inserted into an insertion hole of a joint anchor through a pair of through-holes formed on an upper end side of the boot is sewn at portions in front of and behind an insertion portion, whereby the boot is engaged with the elongated member. The insertion hole of the joint anchor is exposed to outside of the boot through the pair of through-holes of the boot even in a state in which the elongated member is covered with the boot. Therefore, positional shift of the boot relative to the webbing is prevented, and sewing operation of the webbing may be performed by inserting the tip end of the webbing into the insertion hole of the joint anchor after covering the elongated member with the boot.

Abstract: A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the front of the semiconductor light emitting element. The lead includes an elongated mounting portion projecting from the resin package. The mounting portion includes a pair of first projections spaced from each other in the longitudinal direction and a second projection positioned between the first projections. The first projections and the second projection project in opposite directions from each other in the width direction of the mounting portion.

Abstract: A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens.