Patents by Inventor Yasunori HOSHINO
Yasunori HOSHINO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958951Abstract: A resin composition is provided containing a polymer having a structural unit represented by the following Formula (1) in the molecule, and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less. In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.Type: GrantFiled: July 30, 2020Date of Patent: April 16, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Masashi Koda, Yuki Kitai, Atsushi Wada, Yasunori Hoshino
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Patent number: 11866536Abstract: A copper-clad laminate includes an insulating layer formed of a cured product of a resin composition and a surface treated copper foil in contact with the insulating layer, in which the resin composition contains a compound having at least one group specified in the present application and a crosslinking type curing agent; and the surface treated copper foil is a surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of copper foil.Type: GrantFiled: December 18, 2019Date of Patent: January 9, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yuki Kitai, Masashi Koda, Yasunori Hoshino, Atsushi Wada, Mikio Sato
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Patent number: 11820105Abstract: One aspect of the present invention is a prepreg including a resin composition or a semi-cured product of the resin composition and a fibrous base material, in which the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, the fibrous base material is quartz glass cloth, the prepreg contains a silane coupling agent having an unsaturated carbon-carbon double bond in a molecule, in an amount of 0.01% by mass or more and less than 3% by mass with respect to the prepreg, and a cured product of the prepreg has a dielectric loss tangent of 0.002 or less at 10 GHz.Type: GrantFiled: September 28, 2018Date of Patent: November 21, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mikio Sato, Hiroaki Fujiwara, Yuki Kitai, Masashi Koda, Yasunori Hoshino
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Publication number: 20230272213Abstract: A resin composition includes: a polyphenylene ether compound having at least one of groups expressed by formulas (1) and (2), a curing agent reactable with the polyphenylene ether compound, a styrene-based polymer having structural units expressed by formulas (3) and (4); and an inorganic filler containing boron nitride, wherein a content of the inorganic filler is 100 to 320 parts by mass relative to 100 parts by mass of a total of the polyphenylene ether compound, the curing agent, and the styrene-based polymer.Type: ApplicationFiled: July 13, 2021Publication date: August 31, 2023Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yasunori HOSHINO, Yuki KITAI, Mikio SATO
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Publication number: 20230257578Abstract: A resin composition includes: a polyphenylene ether compound; a curing agent reactable with the polyphenylene ether compound; and an inorganic filler including a boron nitride filler, wherein a particle size distribution of the inorganic filler, which is measured by a laser diffraction-based particle size distribution measuring method, has at least two peaks in a particle diameter range of 0.8 to 30.0 ?m, the peaks including at least one peak in a particle diameter range of 0.8 to 5.0 ?m and at least one peak in a particle diameter range of 5.0 to 30.0 ?m.Type: ApplicationFiled: July 13, 2021Publication date: August 17, 2023Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mikio SATO, Yuki KITAI, Yasunori HOSHINO
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Patent number: 11647583Abstract: A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.Type: GrantFiled: April 18, 2017Date of Patent: May 9, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Shimpei Obata, Ryuuji Takahashi, Yasunori Hoshino, Shigetoshi Fujita
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Publication number: 20220389189Abstract: An aspect of the present invention is a resin composition, which contains a polyphenylene ether compound, a curing agent, boron nitride, and an inorganic filler other than the boron nitride, in which the content of boron nitride is 15 to 70 parts by volume with respect to 100 parts by volume of the sum of the polyphenylene ether compound and the curing agent.Type: ApplicationFiled: September 3, 2020Publication date: December 8, 2022Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mikio SATO, Yuki KITAI, Yasunori HOSHINO
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Publication number: 20220289969Abstract: An aspect of the present invention is a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less.Type: ApplicationFiled: July 30, 2020Publication date: September 15, 2022Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Masashi KODA, Yuki KITAI, Atsushi WADA, Yasunori HOSHINO
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Publication number: 20220275122Abstract: A resin composition is provided containing a polymer having a structural unit represented by the following Formula (1) in the molecule, and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less. In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.Type: ApplicationFiled: July 30, 2020Publication date: September 1, 2022Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Masashi KODA, Yuki KITAI, Atsushi WADA, Yasunori HOSHINO
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Patent number: 11401393Abstract: A prepreg includes a resin composition or a semi-cured product of the resin composition, and a glass cloth, wherein the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, a content of the modified polyphenylene ether compound is 40 to 90 mass % with respect to a total mass of the modified polyphenylene ether compound and the crosslinkable curing agent, a cured product of the resin composition has a relative permittivity of 2.6 to 3.8, the glass cloth has a relative permittivity of 4.7 or less and a dielectric loss tangent of 0.0033 or less, and a cured product of the prepreg has a relative permittivity of 2.7 to 3.8 and a dielectric loss tangent of 0.002 or less.Type: GrantFiled: September 28, 2018Date of Patent: August 2, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yuki Kitai, Mikio Sato, Yasunori Hoshino, Masashi Koda, Takayoshi Ozeki, Hiroaki Fujiwara
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COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL
Publication number: 20220220272Abstract: A copper clad laminate includes: an insulating layer containing a cured product of a resin composition; and a surface treated copper foil on one surface or both surfaces of the insulating layer, the resin composition containing a polymer, and the surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of a copper foil, the finely roughened particle treatment layer being formed of fine copper particles having a particle size of 40 to 200 nm, a heat resistance treatment layer containing nickel provided on the finely roughened particle treatment layer, a rust prevention treatment layer containing at least chromium provided on the heat resistance treatment layer, a silane coupling agent layer provided on the rust prevention treatment layer, and an amount of nickel attached in the heat resistance treatment layer being 30 to 60 mg/m2.Type: ApplicationFiled: May 14, 2020Publication date: July 14, 2022Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yuki KITAI, Masashi KODA, Yasunori HOSHINO, Atsushi WADA, Mikio SATO -
Publication number: 20220159830Abstract: A prepreg includes: a resin composition or a semi-cured product thereof; and a fibrous base material, wherein the resin composition contains a polymer having a structural unit expressed by the formula (1) in a molecule, and a curing agent each at a predetermined content rate. A cured product of the resin composition has a Dk of 2.6 to 3.8, and the fibrous base material includes a glass cloth having a Dk of 4.7 or less and a Df of 0.0033 or less. A cured product of the prepreg has a Dk of 2.7 to 3.8, and a Df of 0.002 or less. In the formula (1), Z represents an arylene group, R1 to R3 each independently represents a hydrogen atom or an alkyl group, and R4 to R6 each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.Type: ApplicationFiled: March 26, 2020Publication date: May 19, 2022Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yasunori HOSHINO, Yuki KITAI, Atsushi WADA, Masashi KODA, Mikio SATO
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Publication number: 20220106426Abstract: A copper-clad laminate includes an insulating layer formed of a cured product of a resin composition and a surface treated copper foil in contact with the insulating layer, in which the resin composition contains a compound having at least one group specified in the present application and a crosslinking type curing agent; and the surface treated copper foil is a surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of copper foil.Type: ApplicationFiled: December 18, 2019Publication date: April 7, 2022Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yuki KITAI, Masashi KODA, Yasunori HOSHINO, Atsushi WADA, Mikio SATO
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Patent number: 11242425Abstract: A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.Type: GrantFiled: April 22, 2019Date of Patent: February 8, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mikio Sato, Hiroaki Fujiwara, Yuki Kitai, Masashi Koda, Yasunori Hoshino, Takayoshi Ozeki
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Publication number: 20210269595Abstract: An aspect of the present invention is a resin composition containing a compound (A) having at least one group represented by the following Formula (1) in a molecule and an acenaphthylene compound (B). In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.Type: ApplicationFiled: July 9, 2019Publication date: September 2, 2021Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mikio SATO, Yuki KITAI, Yasunori HOSHINO, Masashi KODA, Atsushi WADA
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Publication number: 20210246251Abstract: A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.Type: ApplicationFiled: April 22, 2019Publication date: August 12, 2021Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mikio SATO, Hiroaki FUJIWARA, Yuki KITAI, Masashi KODA, Yasunori HOSHINO, Takayoshi OZEKI
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Publication number: 20200270411Abstract: A prepreg includes a resin composition or a semi-cured product of the resin composition, and a glass cloth, wherein the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, a content of the modified polyphenylene ether compound is 40 to 90 mass % with respect to a total mass of the modified polyphenylene ether compound and the crosslinkable curing agent, a cured product of the resin composition has a relative permittivity of 2.6 to 3.8, the glass cloth has a relative permittivity of 4.7 or less and a dielectric loss tangent of 0.0033 or less, and a cured product of the prepreg has a relative permittivity of 2.7 to 3.8 and a dielectric loss tangent of 0.002 or less.Type: ApplicationFiled: September 28, 2018Publication date: August 27, 2020Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yuki KITAI, Mikio SATO, Yasunori HOSHINO, Masashi KODA, Takayoshi OZEKI, Hiroaki FUJIWARA
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Publication number: 20200247972Abstract: One aspect of the present invention is a prepreg including a resin composition or a semi-cured product of the resin composition and a fibrous base material, in which the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, the fibrous base material is quartz glass cloth, the prepreg contains a silane coupling agent having an unsaturated carbon-carbon double bond in a molecule, in an amount of 0.01% by mass or more and less than 3% by mass with respect to the prepreg, and a cured product of the prepreg has a dielectric loss tangent of 0.002 or less at 10 GHz.Type: ApplicationFiled: September 28, 2018Publication date: August 6, 2020Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mikio SATO, Hiroaki FUJIWARA, Yuki KITAI, Masashi KODA, Yasunori HOSHINO
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Publication number: 20200223998Abstract: One aspect of the present invention relates to a prepreg having a thermosetting resin composition or a semi-cured product of a thermosetting resin composition, and a fibrous base material, in which the thermosetting resin composition contains (A) a thermosetting resin containing a modified polyphenylene ether compound, (B) a first inorganic filler in which a molybdenum compound is present on at least a part of the surface, and (C) a second inorganic filler, a content of (B) the first inorganic filler is 0.1 parts by weight or more and 15 parts by weight or less, and a content of (C) the second inorganic filler is 200 parts by mass or less, with respect to 100 parts by weight of (A) the thermosetting resin, and the fibrous base material is a glass cloth containing quartz glass yarn.Type: ApplicationFiled: September 28, 2018Publication date: July 16, 2020Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yasunori HOSHINO, Hiroaki FUJIWARA, Yuki KITAI, Takayoshi OZEKI, Mikio SATO, Masashi KODA
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Patent number: 10472478Abstract: A prepreg includes: a woven fabric base; and a semi-cured product of a resin composition, which fills an inside of the woven fabric base and coats a surface of the woven fabric base. The resin composition includes a thermosetting resin, an inorganic filler, a first thermoplastic resin soluble in an organic solvent, and a second thermoplastic resin insoluble in an organic solvent. With respect to 100 parts by mass of the thermosetting resin, a content ratio of the inorganic filler ranges from 50 parts by mass to 150 parts by mass, inclusive, and a total content ratio of the first thermoplastic resin and the second thermoplastic resin ranges from 20 parts by mass to 50 parts by mass, inclusive.Type: GrantFiled: September 5, 2016Date of Patent: November 12, 2019Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Yasunori Hoshino, Shimpei Obata, Shigetoshi Fujita, Ryuji Takahashi