Abstract: A surface mount type quartz crystal device according to a first aspect of the disclosure includes a ceramic package, a pedestal blank, a quartz-crystal vibrating piece. The pedestal blank is placed within the ceramic package via a conductive adhesive. The quartz-crystal vibrating piece is placed on the pedestal blank. The conductive adhesive is formed along an outer peripheral side of the pedestal blank so as to avoid overlap with the excitation electrode viewed in a normal direction of the excitation electrode. The pedestal blank is formed to avoid a region where a distance from the quartz-crystal vibrating piece is equal to or smaller than a size of a clearance between the pedestal blank and the quartz-crystal vibrating piece at the outer peripheral side, in a region where the excitation electrode faces at the pedestal blank side viewed in the normal direction.

Abstract: A surface mount type quartz crystal device according to a first aspect of the disclosure includes a ceramic package, a pedestal blank, a quartz-crystal vibrating piece. The pedestal blank is placed within the ceramic package via a conductive adhesive. The quartz-crystal vibrating piece is placed on the pedestal blank. The conductive adhesive is formed along an outer peripheral side of the pedestal blank so as to avoid overlap with the excitation electrode viewed in a normal direction of the excitation electrode. The pedestal blank is formed to avoid a region where a distance from the quartz-crystal vibrating piece is equal to or smaller than a size of a clearance between the pedestal blank and the quartz-crystal vibrating piece at the outer peripheral side, in a region where the excitation electrode faces at the pedestal blank side viewed in the normal direction.

Abstract: The present invention relates to a surface mounting crystal oscillator in which an IC chip, a crystal element, and a circuit component are connected together by wire bonding and are housed within a main container having a concave section. The main container has a pair of opposing inner wall step portions along both sides in the longitudinal direction, and this pair of inner wall step portions are also each divided into an upper step portion and a lower-step portion of different heights along the longitudinal direction. At least one of the upper step portions of the pair of inner wall step portions supports one end portion in the lengthwise direction of the crystal element so that the lengthwise direction of the crystal element is aligned in the widthwise direction of the main container. The circuit component is disposed on an inner base surface of the main container below the crystal element.

Abstract: The present invention relates to a surface mounting crystal oscillator in which an IC chip, a crystal element, and a circuit component are connected together by wire bonding and are housed within a main container having a concave section. The main container has a pair of opposing inner wall step portions along both sides in the longitudinal direction, and this pair of inner wall step portions are also each divided into an upper step portion and a lower-step portion of different heights along the longitudinal direction. At least one of the upper step portions of the pair of inner wall step portions supports one end portion in the lengthwise direction of the crystal element so that the lengthwise direction of the crystal element is aligned in the widthwise direction of the main container. The circuit component is disposed on an inner base surface of the main container below the crystal element.

Abstract: A semiconductor laser apparatus includes a base, a block, and a semiconductor laser element. The base has a recess on a main plane thereof. The block is perpendicularly elongating on the main plane. The block is neighboring the recess. The semiconductor laser element is mounted on a side of the block. A first end of the semiconductor element is located on outer side of the recess, and a second end of the semiconductor element is located on inner side of the recess.

Abstract: A semiconductor laser apparatus includes a base, a block, and a semiconductor laser element. The base has a recess on a main plane thereof. The block is perpendicularly elongating on the main plane. The block is neighboring the recess. The semiconductor laser element is mounted on a side of the block. A first end of the semiconductor element is located on outer side of the recess, and a second end of the semiconductor element is located on inner side of the recess.

Abstract: A superabsorbent resin composition comprising the following components components (A) and (D), wherein (A) is a superabsorbent resin, and (D) a coordination compound in which a chelating agent is coordinated with metal A.

Abstract: A superabsorbent resin composition comprising the following components

Abstract: A superabsorbent resin composition comprising the following components (A), (B) and (C), wherein (A) is a superabsorbent resin, (B) is a metal compound containing at least one metal A selected from the group consisting of titanium and zirconium and (C) is a chelating agent.

Abstract: A process for producing polymer particles comprising polymerizing a water-soluble polymerizable monomer in a system comprising a hydrophobic organic solvent inert to the polymerization and an aqueous solution of the water-soluble polymerizable monomer, the process being characterized in that the polymerization is carried out in the presence of, as a dispersant, an anionic surface active agent represented by formula (I): ##STR1## wherein R.sup.1 represents a straight-chain or branched alkyl, alkenyl or 2-hydroxyalkyl group having 5 to 29 carbon atoms; M.sup.1 and M.sup.2, which may be the same or different, each represent an alkali metal ion, an ammonium ion or a hydrogen atom; and n represents 1 or 2.

Abstract: A process for producing a polyester container having a higher strength than usual and a reduced wall thickness, whereby the polyester is present in a reduced amount contributing to resource savings, which includes preparing a polyester resin composition containing a polyester resin and 0.1 to 10 parts by weight, based on 100 parts by weight of the polyester resin, of an additive compound selected from the group consisting of compounds represented by the formula (I): ##STR1## and compounds represented by the following formula (II): ##STR2## and subjecting the resin composition to stretch blow molding.

Abstract: An absorbent composition having excellent stability comprising an absorbent resin and 0.01 to 30 percent by weight, based on the dried weight of said absorbent resin, of a radical chain terminator.