Abstract: The plating method is capable of firmly adhering a resist pattern on a plating base in case that, for example, a main magnetic pole of a vertical recording magnetic head is formed by using the resist pattern and accurately configurating a sectional shape of a plated pattern. The plating method comprises the steps of: applying an alkoxylsilyl propyl amino triazine dithiol solution, which is formed by dissolving alkoxylsilyl propyl amino triazine dithiol acting as molecular glue in a solvent, onto the plating base; volatilizing the solvent to form a molecular glue layer; applying resist onto the plating base coated with the molecular glue layer; optically exposing and developing the resist to expose a part of the plating base; and plating the exposed part of the plating base coated with the molecular glue layer.

Abstract: Electrolytic plating can be carried out with a uniform thickness even when the resistance of a plating seed layer is comparatively high, thereby improving the formation precision of products and improving the yield of products. In a method of carrying out plating on a substrate, an insulating layer, which includes conductive parts that conduct electricity to the substrate, is formed on the substrate that is made of a resistor, a plating seed layer, which conducts electricity to the substrate via the conductive parts, is formed on the insulating layer, and a plating film is formed on the plating seed layer with the plating seed layer as a power supply layer.