Abstract: A partially quaternized styrene-based polymer contains given amounts of a constituent unit having a quaternary salt type anion-exchange group and a constituent unit having a haloalkyl group. Due to the polymer, the ionic conductivity and the gas diffusion properties are kept high and the swelling of the electrode catalyst layer in a post-crosslinking step can be minimized to form a highly active catalytic electrode layer and obtain an excellent fuel-cell output.

Abstract: A film carrier tape for mounting an electronic part comprising an insulating film and a wire pattern which is made of a conductive metal and is provided on the surface of the insulating film, wherein an undercoating layer containing nickel as a main constituent is formed on at least a part of the surface of the wiring pattern made of a conductive metal, an intermediate layer containing palladium as a main constituent is formed on the surface of he undercoating layer, a surface layer containing gold as a main constituent is formed on the surface of the intermediate layer, and the average thickness of the intermediate layer containing palladium as a main constituent is not more than 0.04 ?m.

Abstract: Disclosed is a film carrier tape for mounting electronic part comprising an insulating film and a wiring pattern which is made of a conductive metal and is provided on the surface of the insulating film, wherein an undercoating layer containing nickel as a main constituent is formed on at least a part of the surface of the wiring pattern made of a conductive metal, an intermediate layer containing palladium as a main constituent is formed on the surface of the undercoating layer, a surface layer containing gold as a main constituent is formed on the surface of the intermediate layer, and the average thickness of the intermediate layer containing palladium as a main constituent is not more than 0.04 &mgr;m. According to the present invention, a film carrier tape for mounting electronic part, in which the wire bonding strength to the bonding pad (connecting terminal) and the peel strength of the solder ball to the ball pad are high and the variability range of these strengths is small, is provided.

Abstract: Provided is a method of manufacturing a printed wiring board which keeps a good etching factor of formed circuits, eliminates an etching residue and can effectively prevent the occurrence of surface layer migration.