Patents by Inventor Yasunori Matsushima

Yasunori Matsushima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a printed wiring board
    Patent number: 5274915
    Abstract: The invention has been achieved to solve the problem mentioned above. The object of the invention is to provide a novel method of manufacturing a printed wiring board by allowing manufacturers to provide a slit and perforations on the substrate without causing even the slightest crack to be generated in the course of manufacturing the printed wiring board.In the course of manufacturing printed wiring boards splittable across a slit and perforations,the method embodied by the invention executes those sequential steps including the following; provision of thickness adjusting film for specific regions adjacent to the slit and perforations; adjustment of the thickness of a main substrate and a splittable substrate which is splittable by means of the slit and the perforations; and formation of the slit and the perforations by applying a pressing and punching process.
    Type: Grant
    Filed: June 18, 1991
    Date of Patent: January 4, 1994
    Assignee: Nippon CMK Corp.
    Inventors: Yasunori Matsushima, Kunio Nishi