Abstract: The semiconductor inspecting apparatus can inspect a semiconductor device on which a plurality of product chips and a single TEG (test element group) chip are formed in the same step. The semiconductor inspecting apparatus includes a stage (2) for mounting a semiconductor wafer (1) on which product chips (A) and TEG chips (T) for inspecting the characteristics of the product chips (A) are arranged repeatedly; and a prober (3) for inspecting the defectiveness or non-defectiveness of each product chip and further printing an inspection result mark on the inspected product chip, respectively, when the stage is moved or scanned relative to the probe.