Abstract: A semiconductor device has a substrate with an electronic circuit, a semiconductor element provided at a first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer electrically connected to the semiconductor element. A plurality of conductive bumps provided opposite the first surface of the substrate. A thermal hardenable resin seals at least the semiconductor element, and a metal plate is electrically connected to the metal core layer.

Abstract: A device for controlling a vehicle 8 comprising a housing 3, a rectangular printed circuit board 4 which is fixed to the inside of the housing and has a control circuit thereon, and plugs 1a and 1b provided along one side of the rectangular printed circuit board 4 to transfer signals between the inside and the outside of said housing 3; wherein the plugs 1a and 1b respectively contain plug pins and the plug pins 2 are electrically connected to the printed circuit board 4 via bonding wires 5 inside the housing 3.

Abstract: A device for controlling a vehicle 8 comprising a housing 3, a rectangular printed circuit board 4 which is fixed to the inside of the housing and has a control circuit thereon, and plugs 1a and 1b provided along one side of the rectangular printed circuit board 4 to transfer signals between the inside and the outside of said housing 3; wherein the plugs 1a and 1b respectively contain plug pins and the plug pins 2 are electrically connected to the printed circuit board 4 via bonding wires 5 inside the housing 3.

Abstract: A device for controlling a vehicle 8 has a housing, a rectangular printed circuit board inside of the housing and a control circuit thereon. Plugs are provided along one side of the rectangular printed circuit board to transfer signals between the inside and the outside of the housing. The plugs have plug pins that are electrically connected to the printed circuit board within the housing.

Abstract: A semiconductor device with enhanced heat releasability and low-cost manufacturability is disclosed. This device has a substrate with an electronic circuit disposed on a first principal surface, a semiconductor element which is provided at the first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer which is provided in the substrate and electrically connected to the semiconductor element, a plurality of conductive bumps provided on a second principal surface opposite to the first surface of the substrate, a thermal hardenable sealing resin for sealing at least the semiconductor element and the first surface side of the substrate, and a metal plate provided at the second surface for being electrically connected to the metal core layer. An electronic control module using the device is also disclosed.

Abstract: A device for controlling a vehicle 8 comprising a housing 3, a rectangular printed circuit board 4 which is fixed to the inside of the housing and has a control circuit thereon, and plugs 1a and 1b provided along one side of the rectangular printed circuit board 4 to transfer signals between the inside and the outside of said housing 3; wherein the plugs 1a and 1b respectively contain plug pins and the plug pins 2 are electrically connected to the printed circuit board 4 via bonding wires 5 inside the housing 3.

Abstract: A device for controlling a vehicle 8 having a housing 3, a rectangular printed circuit board 4 which is fixed to the inside of the housing and has a control circuit thereon. Plugs 1a and 1b are provided along one side of the rectangular printed circuit board 4 to transfer signals between the inside and the outside of the housing 3. The plugs 1a and 1b respectively contain plug pins and the plug pins 2 are electrically connected to the printed circuit board 4 via bonding wires 5 inside the housing 3.

Abstract: The present invention has an object to enhance the reliability of the electrical connection of a silver-based conductor film on the surface of a glass ceramic board. In order to achieve the object, according to the present invention, by the use of a conductor paste containing a silver particle having a specific surface area of 0.3 m2/g to 3.0 m2/g and no glass, printing is carried out on a glass ceramic board and the conductor paste is fired at a firing temperature having a difference of ±50° C. from a softening temperature of amorphous borosilicate glass contained in the glass ceramic. Consequently, a silver-based conductor film having high reliability of the electrical connection is formed on the ceramic board.

Abstract: A device for controlling a vehicle 8 comprising a housing 3, a rectangular printed circuit board 4 which is fixed to the inside of the housing and has a control circuit thereon, and plugs 1a and 1b provided along one side of the rectangular printed circuit board 4 to transfer signals between the inside and the outside of said housing 3; wherein the plugs 1a and 1b respectively contain plug pins and the plug pins 2 are electrically connected to the printed circuit board 4 via bonding wires 5 inside the housing 3.

Abstract: The present invention has an object to enhance the reliability of the electrical connection of a silver-based conductor film on the surface of a glass ceramic board. In order to achieve the object, according to the present invention, by the use of a conductor paste containing a silver particle having a specific surface area of 0.3 m2/g to 3.0 m2/g and no glass, printing is carried out on a glass ceramic board and the conductor paste is fired at a firing temperature having a difference of ±50° C. from a softening temperature of amorphous borosilicate glass contained in the glass ceramic. Consequently, a silver-based conductor film having high reliability of the electrical connection is formed on the ceramic board.