Patents by Inventor Yasuo Imashiro

Yasuo Imashiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6485833
    Abstract: A resin-coated metal foil comprising: a metal foil, and a resin layer formed on the metal foil by coating and semi-curing, on the metal foil, a composition containing a polycarbodiimide resin having a number-average molecular weight of 3,000 to 50,000, an epoxy resin, the proportions of the polycarbodiimide resin and the epoxy resin being 100 parts by weight and 20 to 2000 parts by weight, respectively. In the resin-coated metal foil, the resin is superior in handleability and storage stability in a semi-cured state and, after complete cure, high in heat resistance and superior in dielectric properties.
    Type: Grant
    Filed: October 20, 2000
    Date of Patent: November 26, 2002
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Takahiko Ito, Hideshi Tomita, Norimasa Nakamura
  • Patent number: 6461755
    Abstract: The present invention provides: an electroconductive resin composition comprising: (A) a liquid crystal polyester resin capable of forming an anisotropic melt phase, in an amount of 100 parts by weight, (B) a carbodiimide compound in an amount of 0.01 to 30 parts by weight, (C) an electroconductive carbon powder in an amount of 50 to 3,000 parts by weight, and (D) a filler in an amount of 0 to 10,000 parts by weight; a fuel cell separator made of the above electroconductive resin composition; a process for producing the above fuel cell separator; and a solid polymer type fuel cell using the above fuel cell separator. The electroconductive resin composition alleviates the problems of the prior art, can be mass-produced, and is superior in high temperature resistance and hydrolysis resistance.
    Type: Grant
    Filed: June 7, 2000
    Date of Patent: October 8, 2002
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Kazuo Saito, Atsushi Hagiwara, Fumio Tanno, Yasuo Imashiro, Naofumi Horie, Tsutomu Uehara
  • Patent number: 6451890
    Abstract: There are provided a polyamide resin composition which alleviates the drawbacks of the prior art and which is improved in resistance to hydrolysis particularly in an acidic medium of high temperatures, oil resistance and metal halide resistance; and a member made from the above polyamide resin composition, which can be applied even to sites where the use of a metallic member has been necessary. The polyamide resin composition of the present invention comprises a polyamide resin and a carbodiimide compound and, owing to the use of the carbodiimide compound, is improved in hydrolysis resistance, oil resistance and metal halide resistance; and the member of the present invention is made from the above polyamide resin composition.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: September 17, 2002
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Naofumi Horie, Hiroyuki Kayaki
  • Patent number: 6440258
    Abstract: The present invention provides an adhesive film for semiconductor package, which comprises a polycarbodiimide resin, an epoxy resin and an inorganic filler, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as measured by gel permeation chromatography, the epoxy resin is contained in an amount of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin, and the inorganic filler is contained in an amount of 30 to 70% by weight based on the total resin content.
    Type: Grant
    Filed: September 22, 1999
    Date of Patent: August 27, 2002
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Takahiko Ito, Hideshi Tomita, Norimasa Nakamura
  • Publication number: 20020081434
    Abstract: A thermosetting resin composition comprising:
    Type: Application
    Filed: September 17, 2001
    Publication date: June 27, 2002
    Inventors: Yasuo Imashiro, Takahiko Ito, Hideshi Tomita, Norimasa Nakamura
  • Patent number: 6387505
    Abstract: The present invention provides a prepreg which is composed of a mixture of a polycarbodiimide resin and an epoxy resin and which has a film shape; a prepreg composed of (1) a mixture of a polycarbodiimide resin and an epoxy resin and (2) a base material; a multilayer printed wiring board obtained by alternately laminating an internal substrate and an insulating adhesive layer and adhering them to each other, wherein the above prepreg is used as the insulating adhesive; and a process for producing a multilayer printed wiring board, which comprises alternately laminating an internal substrate and the above prepreg, adhering them to each other, and allowing all the internal substrates to communicate with each other at the required portions. The above prepreg has high flexibility at room temperature, causes neither chipping nor peeling of resin, and is superior in heat resistance and electrical insulation after press molding.
    Type: Grant
    Filed: September 20, 1999
    Date of Patent: May 14, 2002
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Takahiko Ito, Hideshi Tomita, Norimasa Nakamura
  • Publication number: 20020028368
    Abstract: Disclosed herein are an electrically conductive resinous composition composed mainly of an electrically conductive carbon powder and a binding agent, wherein said binding agent is a mixture of a thermoplastic resin and a carbodiimide compound, a fuel cell separator and a process for production thereof, and polymer electrolyte fuel cell. The present invention permits efficient mass production of fuel cell separators having high elasticity, good releasability, good dimensional accuracy, and good gas impermeability. The polymer electrolyte fuel cell, in which all or part of separators are those pertaining to the present invention, is immune to the cracking of separators at the time of assembling, decreases only a little in output after continuous operation, and exhibits good gas sealing performance and high impact resistance.
    Type: Application
    Filed: July 3, 2001
    Publication date: March 7, 2002
    Inventors: Kazuo Saito, Atsushi Hagiwara, Yasuo Imashiro, Naofumi Horie
  • Patent number: 6333101
    Abstract: The present invention provides a method of adhering adherends, including (i) providing at least two adherends at least one of which is made of a flexible material, and (ii) joining the adherends together to form a structure using a heat-resistant adhesive composition containing mainly 1) a polycarbodiimide resin and an epoxy resin, or 2) a polycarbodiimide resin, an epoxy resin and a curing agent for the polycarbodiimide resin, or 3) a polycarbodiimide resin, an epoxy resin and a curing agent for the epoxy resin. The heat-resistant adhesive composition can be applied under mild conditions, and the resultant structure has excellent heat resistance and chemical resistance, and has superior adhesion strength particularly at high temperatures.
    Type: Grant
    Filed: October 28, 1993
    Date of Patent: December 25, 2001
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Kazuo Saito, Satoshi Amano, Takahiko Itoh, Hideshi Tomita, Ikuo Takahashi
  • Patent number: 6333363
    Abstract: A method for obtaining polyester resin products having a desired strength and a mixture used in a method for obtaining polyester resin products having a desired strength. In the method and mixture a carbodiimide compound is added to a polyester resin. According to the method and mixture, polyester resin pellets having a desired strength can be obtained by adding a carbodiimide compound to a recovered polyester resin such as a recovered PET resin. Strength of the polyester resin during processing of the polyester resin is maintained.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: December 25, 2001
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Ikuo Takahashi, Naofumi Horie, Shigekazu Suzuki
  • Patent number: 6331226
    Abstract: A method for bonding LCPs mutually or an LCP and another material comprising the step of bonding LCPs mutually or an LCP and another material using an adhesive prepared by adding a polycarbodiimide resin with an epoxy resin composition comprising an epoxy resin and a curing agent, thereby providing excellent adhesion and heat resistance.
    Type: Grant
    Filed: May 25, 2000
    Date of Patent: December 18, 2001
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Hideshi Tomita, Takahiko Itoh, Norimasa Nakamura
  • Patent number: 6310119
    Abstract: The present invention provides a film-shaped encapsulating agent for electronic parts which is composed essentially of a polycarbodiimide resin and an epoxy resin or of a polycarbodiimide resin, an epoxy resin and colorant, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as determined by gel permeation chromatography and the epoxy resin is contained in a proportion of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin. The film-shaped encapsulating agent enables, for its good processability, the continuous encapsulation of electronic parts without requiring any expensive apparatus (therefore, no cost increase is incurred) and is excellent in heat resistance and electrical insulation after the encapsulation.
    Type: Grant
    Filed: September 22, 1999
    Date of Patent: October 30, 2001
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Takahiko Ito, Hideshi Tomita, Norimasa Nakamura
  • Patent number: 6225417
    Abstract: The present invention provides a one-pack type epoxy resin composition comprising an epoxy resin having at least two epoxy groups in the molecule and a polyguanidine. The one-pack type epoxy resin composition has high storage stability, can be made into a film, is curable at relatively low temperatures, and has high adhesivity.
    Type: Grant
    Filed: July 27, 1999
    Date of Patent: May 1, 2001
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Takahiko Ito, Hideshi Tomita, Norimasa Nakamura
  • Patent number: 6214940
    Abstract: A polyacetal resin composition comprising a polyacetal resin and a polycarbodiimide compound. The polyacetal resin composition is free from the problems of conventional polyacetal resins and has good water resistance at high temperatures.
    Type: Grant
    Filed: June 25, 1999
    Date of Patent: April 10, 2001
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Naofumi Horie
  • Patent number: 6194500
    Abstract: A modified emulsion of polycarbonate resin, comprising a polycarbonate resin emulsion and a monocarbodiimide compound and/or a polycarbodiimide compound; and a process for producing a modified emulsion of polycarbonate resin, which comprises adding a monocarbodiimide compound and/or a polycarbodiimide compound to a polycarbonate resin emulsion. This modified emulsion of polycarbonate resin is improved in adhesivity, water resistance and chemical resistance.
    Type: Grant
    Filed: June 2, 1999
    Date of Patent: February 27, 2001
    Assignees: Nisshinbo Industries, Inc., Matsumoto Yushi-Seiyaku Co., Ltd.
    Inventors: Yasuo Imashiro, Ikuo Takahashi, Takao Masaki, Akito Iwao
  • Patent number: 6177197
    Abstract: A printing and recording sheet comprises a substrate and an ink receiving layer of a crosslinked product of a composition which comprises a polymer resin and a crosslinking agent comprising a water-soluble or dispersible carbodiimide compound which is a condensation reaction product obtained by decarbonation condensation of at least one diisocyanate or a mixture of at least one diisocyanate and at least one triisocyanate. The reaction product is blocked at terminal isocyanate groups with a hydrophilic group.
    Type: Grant
    Filed: May 15, 1998
    Date of Patent: January 23, 2001
    Assignee: Nippon Industries, Inc.
    Inventors: Yasuo Imashiro, Ikuo Takahashi, Naofumi Horie, Takeshi Yamane, Shigekazu Suzuki
  • Patent number: 6153718
    Abstract: A polyurethane resin obtained from a diol component and a diisocyanate component by an ordinary process, wherein the diisocyanate component comprises:at least one kind of unmodified diisocyanate, andat least one kind of carbodiimide-modified aromatic diisocyanate having, at one or both of the ortho positions of the two isocyanate groups, an aliphatic, alicyclic or aromatic substituent of one or more carbon atoms, or at least one kind of carbodiimide-modified aliphatic diisocyanate wherein at least one of the two carbons each bonded with an isocyanate group is di- or tri-substituted, and the molar ratio of the unmodified diisocyanate and the carbodiimide-modified diisocyanate is 35-0.1:1. The polyurethane resin containing carbodiimide bonds in the molecular chain alleviates the problems of the prior art and exhibits hydrolysis resistance stably over a long period of time without losing the carbodiimide bonds out of the molecule.
    Type: Grant
    Filed: June 23, 1999
    Date of Patent: November 28, 2000
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Ikuo Takahashi, Naofumi Horie, Takeshi Yamane
  • Patent number: 6127477
    Abstract: The present invention provides an aqueous surface-treating agent and method for surface treatment of reinforcing material, which includes a carbodiimide compound as a main component; a reinforcing material surface-treated with the above aqueous surface-treating agent; and a composite material comprising a matrix and the above reinforcing material. The aqueous surface-treating agent has good storage stability, gives no bad effect on human health owing to no use of organic solvent and, when used for the surface treatment of a reinforcing material, can produce a surface-treated reinforcing material which can produce a composite material comprising a matrix and the surface-treated reinforcing material and having high adhesivity between the two components.
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: October 3, 2000
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Ikuo Takahashi, Naofumi Horie
  • Patent number: 6127029
    Abstract: The present invention provides an aqueous surface-treating agent and method for surface treatment of reinforcing material, which includes a carbodiimide compound as a main component; a reinforcing material surface-treated with the above aqueous surface-treating agent; and a composite material comprising a matrix and the above reinforcing material. The aqueous surface-treating agent has good storage stability, gives no bad effect on human health owing to no use of organic solvent and, when used for the surface treatment of a reinforcing material, can produce a surface-treated reinforcing material which can produce a composite material comprising a matrix and the surface-treated reinforcing material and having high adhesivity between the two components.
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: October 3, 2000
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Ikuo Takahashi, Naofumi Horie
  • Patent number: 6126860
    Abstract: A hydrolysis stabilizer for an ester group-containing resin, which comprises as a main component a carbodiimide having at least two carbodiimide groups in the molecule and resulting from 4,4'-dicyclohexylmethane diisocyanate, isophorone diisocyanate or a mixture of 4,4'-dicyclohexylmethane diisocyanate and isophorone diisocyanate, or from a mixture of tetramethylxylylene diisocyanate with 4,4'-dicyclohexylmethane diisocyanate, isophorone diisocyanate or a mixture of 4,4'-dicyclohexylmethane diisocyanate and isophorone diisocyanate; and a process for the hydrolysis stabilization of an ester group-containing resin, which comprises mixing a polyester type resin with the above hydrolysis stabilizer.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: October 3, 2000
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Ikuo Takahashi, Naofumi Horie, Takeshi Yamane
  • Patent number: 6124398
    Abstract: A carbodiimide crosslinking agent comprises, as its main component, a decarbonated condensate of (A) one or more isocyanates selected from isocyanates having at least two isocyanate groups bonded to the carbon of the methylene group in the molecule, and (B) one or more isocyanates selected from alicyclic or aliphatic diisocyanates other than those defined in (A). The condensate is blocked at terminal isocyanates thereof with a hydrophilic group. A process for preparing the crosslinking agent, and a coating material comprising the agent are also described, along with a specific type of crosslinking agent for polyvinyl alcohols.
    Type: Grant
    Filed: May 13, 1998
    Date of Patent: September 26, 2000
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Ikuo Takahashi, Naofumi Horie, Takeshi Yamane, Shigekazu Suzuki