Patents by Inventor Yasuo Ishiwata

Yasuo Ishiwata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11415746
    Abstract: A sensor installed into a mold including a cable insertion member having a fixing portion with a fitting recess is provided. The sensor includes an optical fiber a part of which is bendable, and a fiber holder having a fiber insertion portion through which the optical fiber is inserted and a to-be-fixed portion extending from the fiber insertion portion. Further, the to-be-fixed portion is fixed to the fixing portion while being fitted to the fitting recess.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: August 16, 2022
    Assignee: FUTABA CORPORATION
    Inventors: Sho Sekiguchi, Yasuo Ishiwata
  • Publication number: 20210165161
    Abstract: A sensor installed into a mold including a cable insertion member having a fixing portion with a fitting recess is provided. The sensor includes an optical fiber a part of which is bendable, and a fiber holder having a fiber insertion portion through which the optical fiber is inserted and a to-be-fixed portion extending from the fiber insertion portion. Further, the to-be-fixed portion is fixed to the fixing portion while being fitted to the fitting recess.
    Type: Application
    Filed: November 24, 2020
    Publication date: June 3, 2021
    Inventors: Sho SEKIGUCHI, Yasuo ISHIWATA
  • Patent number: 10948816
    Abstract: The present invention provides a pellicle frame which can effectively inhibit deformation of an exposure master plate (8) caused by affixing the pellicle (1), and which does not have a complex shape, and a pellicle which uses said pellicle frame are provided. The pellicle frame with an anodized film on a surface of an aluminum alloy frame is characterized in that: the aluminum alloy frame comprises an aluminum alloy which contains Ca: 5.0 to 10.0% by weight with the remainder aluminum and unavoidable impurities are contained, and has an area (volume) ratio of an Al4Ca phase, which is a dispersed phase, is greater than or equal to 25%, and a crystal structure of a part of the Al4Ca phase is monoclinic; wherein the anodized film contains Al4Ca particles.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: March 16, 2021
    Assignee: NIPPON LIGHT METAL COMPANY, LTD.
    Inventors: Yoshihiro Taguchi, Takayuki Yamaguchi, Jun Yu, Yasuo Ishiwata
  • Publication number: 20190316241
    Abstract: The present invention provides an aluminum alloy plastic working material which has a low Young's modulus, but has an excellent proof stress and a method for efficiently producing the same. The aluminum alloy plastic working material of the present invention comprises: 5.0 to 10.0 wt % of Ca, and the remainder aluminum and unavoidable impurities, a volume ratio of an Al4Ca phase, which is a dispersed phase, is 25% or more. The Al4Ca phase comprises a tetragonal Al4Ca phase and a monoclinic Al4Ca phase, and an intensity ratio (I1/I2) of the highest diffraction peak (I1) attributed to the tetragonal system to the highest diffraction peak (I2) attributed to the monoclinic system, which are obtained by an X-ray diffraction measurement, is 1 or less.
    Type: Application
    Filed: June 30, 2017
    Publication date: October 17, 2019
    Inventors: Jun YU, Yasuo ISHIWATA, Dalsuke SHiMOSAKA, Takutoshi KONDO, Yoshihiro TAGUCHI
  • Publication number: 20190302607
    Abstract: The present invention provides a pellicle frame which can effectively inhibit deformation of an exposure master plate (8) caused by affixing the pellicle (1), and which does not have a complex shape, and a pellicle which uses said pellicle frame are provided. The pellicle frame with an anodized film on a surface of an aluminum alloy frame is characterized in that: the aluminum alloy frame comprises an aluminum alloy which contains Ca: 5.0 to 10.0% by weight with the remainder aluminum and unavoidable impurities are contained, and has an area (volume) ratio of an Al4Ca phase, which is a dispersed phase, is greater than or equal to 25%, and a crystal structure of a part of the Al4Ca phase is monoclinic; wherein the anodized film contains Al4Ca particles.
    Type: Application
    Filed: June 30, 2017
    Publication date: October 3, 2019
    Inventors: Yoshihiro TAGUCHI, Takayuki YAMAGUCHI, Jun YU, Yasuo ISHIWATA
  • Publication number: 20160214299
    Abstract: A measurement apparatus for receiving a detection signal as a measurement target signal from a sensor provided at an injection molding apparatus which includes molds and selectively injects a molding material into each of the molds, includes input terminals to which trigger signals outputted from the injection molding apparatus are inputted. The trigger signals indicates timing of injecting the molding material into each of the molds.
    Type: Application
    Filed: January 13, 2016
    Publication date: July 28, 2016
    Inventors: Ryoichiro HAYANO, Yasuhiro NOHARA, Yasunori IIYA, Yasuo ISHIWATA
  • Patent number: 8845781
    Abstract: Provided are a method and an apparatus for melting an aluminum powder, which are capable of melting the aluminum powder with a high yield and allow the melted aluminum to be reused for a variety of applications. The method for melting the aluminum powder includes the steps of: preparing a mixture (M) including an aluminum powder (A) and a fluoride-based flux (F) by previously mixing the aluminum powder (A) and the fluoride-based flux (F); and melting the mixture (M) in molten aluminum (L).
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: September 30, 2014
    Assignees: Toyo Aluminium Kabushiki Kaisha, Nippon Light Metal Company, Ltd.
    Inventors: Yasuo Ishiwata, Kazumi Tono, Yuji Suzuki, Akira Kato, Kazuya Higashimura, Akiei Tanaka, Katsuya Moriguchi
  • Publication number: 20130025414
    Abstract: Provided are a method and an apparatus for melting an aluminum powder, which are capable of melting the aluminum powder with a high yield and allow the melted aluminum to be reused for a variety of applications. The method for melting the aluminum powder includes the steps of: preparing a mixture (M) including an aluminum powder (A) and a fluoride-based flux (F) by previously mixing the aluminum powder (A) and the fluoride-based flux (F); and melting the mixture (M) in molten aluminum (L).
    Type: Application
    Filed: April 18, 2011
    Publication date: January 31, 2013
    Applicants: NIPPON LIGHT METAL COMPANY, LTD., TOYO ALUMINIUM KABUSHIKI KAISHA
    Inventors: Yasuo Ishiwata, Kazumi Tono, Yuji Suzuki, Akira Kato, Kazuya Higashimura, Akiei Tanaka, Katsuya Moriguchi
  • Patent number: 8234389
    Abstract: A communication control method is provided for an encryption processing unit connected to a connection status acquiring unit which is connected to a circuit that transmits packets on a network and acquires the status of a connection to a network for an encrypting device for encrypting the packet, and connected to an expansion card for connecting to the network, based on the network connection status requested and acquired from the connection status acquiring unit by the expansion card each prescribed period of time, by relaying and acquiring the network connection status from the connection status acquiring unit and forcibly notifying the expansion card that the connection status is connected and/or not connected, according to a requirement/criteria.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: July 31, 2012
    Assignee: Fujitsu Limited
    Inventors: Osamu Kezuka, Kazuho Kitazawa, Yasuo Ishiwata, Masaru Sakurai, Sadayuki Ohyama
  • Publication number: 20080215724
    Abstract: A communication control method is provided for an encryption processing unit connected to a connection status acquiring unit which is connected to a circuit that transmits packets on a network and acquires the status of a connection to a network for an encrypting device for encrypting the packet, and connected to an expansion card for connecting to the network, based on the network connection status requested and acquired from the connection status acquiring unit by the expansion card each prescribed period of time, by relaying and acquiring the network connection status from the connection status acquiring unit and forcibly notifying the expansion card that the connection status is connected and/or not connected, according to a requirement/criteria.
    Type: Application
    Filed: February 6, 2008
    Publication date: September 4, 2008
    Applicant: Fujitsu Limited
    Inventors: Osamu KEZUKA, Kazuho Kitazawa, Yasuo Ishiwata, Masaru Sakurai, Sadayuki Ohyama
  • Patent number: 7035957
    Abstract: A PCI bridge circuit connects to first and second PCI buses and performs data transfer between PCI devices. The PCI bridge circuit has a data buffer and controller and the controller 70, prior to the establishment of a data transfer state with the first PCI device via the first PCI bus, receives data from the second PCI device via the second PCI bus into a data buffer and inserts a wait state. Consequently while reducing the capacity of the data buffer, data transfer between PCI devices can be performed without affecting the transfer performance.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: April 25, 2006
    Assignee: Fujitsu Limited
    Inventor: Yasuo Ishiwata
  • Publication number: 20040139268
    Abstract: A PCI bridge circuit connects to first and second PCI buses and performs data transfer between PCI devices. The PCI bridge circuit has a data buffer and controller and the controller 70, prior to the establishment of a data transfer state with the first PCI device via the first PCI bus, receives data from the second PCI device via the second PCI bus into a data buffer and inserts a wait state. Consequently while reducing the capacity of the data buffer, data transfer between PCI devices can be performed without affecting the transfer performance.
    Type: Application
    Filed: December 23, 2003
    Publication date: July 15, 2004
    Applicant: FUJITSU LIMITED
    Inventor: Yasuo Ishiwata
  • Patent number: 6379141
    Abstract: An abnormal mold detector is provided that can previously detect the breakage of a mold tool with an ejector plate. A pressure sensor is attached to the ejector pin of a mold to detect the mold internal pressure. The operation status of the mold is detected by the sensor attached to the mold piece of the mold. An abnormality detector, formed of a CPU, processes the detected pressure signal and the mold working state indicating signal. The abnormality detector sets a reference value D exceeding a normal sticking resistance of the ejector pin. As a material is injected, the mold internal pressure increases during one cycle (A and B) in the molding step. After the molding process, the ejection process is carried out by the ejector pin during the value C. When a sticking resistance exceeding the value D is confirmed during the monitoring operation (FF), the abnormality detector decides that there may be the possibility that an abnormal state occurs in the mold tool.
    Type: Grant
    Filed: August 24, 1999
    Date of Patent: April 30, 2002
    Assignee: Futaba Denshi Kogyo Kabushiki Kaisha
    Inventors: Hiroaki Kawasaki, Yutaka Hiroshima, Yasuo Ishiwata, Chisato Akinari
  • Patent number: 6345974
    Abstract: An ejector pin with a pressure sensor is provided, of which the sensor output can be utilized without any correction even in different diameter thereof, so that no design changes are required according to loads to the ejector pin. The ejector pin has a bar portion for extruding a molded component and a sleeve portion slidably housing the bar portion. The end of the bar portion faces the cavity from the opening at the end of the guide portion. A housing room is defined by the step portion at the lower end of the sleeve portion. A strain producing portion with an U-shaped cross section fixed on the base end of the bar portion is disposed inside the housing room. A strain sensor is attached on the lower surface of the beam of the strain producing portion. Only the area of the end of the bar portion is related to the pressure detection. When the pressure of a resin is applied on the end of the bar portion, the downward load on the bar portion bends the beam down.
    Type: Grant
    Filed: March 8, 1999
    Date of Patent: February 12, 2002
    Assignee: Futaba Denshi Kogyo Kabushiki Kaisha
    Inventors: Hiroaki Kawasaki, Yutaka Hiroshima, Chisato Akinari, Yasuo Ishiwata
  • Publication number: 20010010172
    Abstract: An ejector plate movement detector is provided that can be mounted, without complicatedly machining a mold tool and occupying an installation place, and can detect movement of an ejector plate, with damages of parts suppressed to a necessary minimum. The detector 21A comprises a rod-like pin 22; a pressure detector 23 integrally attached on one end of the pin 22 and mounted on the ejector plate 12, for detecting the pressure applied via the pin 22 when the ejector plate 12 is moved forward and backward; a biasing member 24 for always biasing the ejector plate 12 to its original position with respect to the pin 22; and a holder 25 having one end fixedly mounted to the receiving plate 6, for housing said biasing means 24 and movably holding the pin against the biasing means 24. Whether or not the ejector plate 12 is normally moved is checked by monitoring waveforms of output values from the pressure sensor 27 before and after the movement of the ejector plate 12 at the ejection of a molded piece.
    Type: Application
    Filed: January 29, 2001
    Publication date: August 2, 2001
    Applicant: FUTABA DENSHI KOGYO KABUSHIKI KAISHA
    Inventors: Hiroaki Kawasaki, Yasuo Ishiwata, Yutaka Hiroshima, Chisato Akinari