Patents by Inventor Yasuo Izumi
Yasuo Izumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240147403Abstract: A UE capable of performing communication via a satellite receives a wait range via a first satellite from a first PLMN. In a case that the UE becomes able to perform communication via a second satellite connected to the first PLMN after becoming unable to perform communication via the first satellite, the UE selects the first PLMN, generates a wait timer based on the wait range, and starts a timer using the wait timer. In a case that an emergency call is made during the timer running, the UE stops the timer and performs a registration procedure for the emergency call. In a case that an emergency call is not made during the timer running, the UE performs the registration procedure after the timer expires.Type: ApplicationFiled: February 8, 2023Publication date: May 2, 2024Inventors: YASUO SUGAWARA, SHUICHIRO CHIBA, Masaki IZUMI
-
Publication number: 20240147576Abstract: A UE capable of performing communication via a satellite receives a wait range via a first satellite from a first PLMN. In a case that the UE becomes able to perform communication via a second satellite connected to a second PLMN after becoming unable to perform communication via the first satellite, the UE selects the second PLMN, generates a wait timer based on the wait range, and starts a timer using the wait timer. In a case that an emergency call is made during the timer is running, the UE stops the timer and performs a registration procedure for the emergency call. In a case that an emergency call is not made during the timer is running, the UE performs the registration procedure after the timer expires.Type: ApplicationFiled: February 8, 2023Publication date: May 2, 2024Inventors: YASUO SUGAWARA, SHUICHIRO CHIBA, Masaki IZUMI
-
Publication number: 20240114587Abstract: A User Equipment (UE) includes transmission and reception circuitry, and a controller, wherein while one or more Tsor-cm timers are running, and upon receiving a new Steering of roaming connected mode control information (SOR-CMCI), the controller sets a Tsor-cm timer value for an associated PDU session or service to a timer value in the new SOR-CMCI.Type: ApplicationFiled: December 22, 2021Publication date: April 4, 2024Inventors: YOKO KUGE, YASUO SUGAWARA, YUDAI KAWASAKI, SHUICHIRO CHIBA, Masaki IZUMI, MASAFUMI ARAMOTO
-
Publication number: 20240098841Abstract: In a case that user equipment (UE) that has established a communication path for direct C2 communication receives, from a network, a PDU session release command message for revoking authentication and/or authorization of the communication path for the direct C2 communication or a PDU session modification command message, the UE can indicate an appropriate cause value in the procedure of releasing the communication path for the direct C2 communication.Type: ApplicationFiled: February 9, 2023Publication date: March 21, 2024Inventors: SHUICHIRO CHIBA, YASUO SUGAWARA, YOKO KUGE, Masaki IZUMI
-
Patent number: 9701043Abstract: An object of the present invention is to provide a dicing blade which does not cause cracking and breaking even in a workpiece formed from a brittle material, and can stably perform cutting process in a ductile mode on the workpiece with high precision. A dicing blade 26 which performs the cutting process on the workpiece is integrally formed of a diamond sintered body 80 which is formed by sintering diamond abrasive grains 82 so as to have a discoid shape, and a content of the diamond abrasive grains 82 of the diamond sintered body 80 is 80 vol % or more. It is preferable that recessed parts which are formed on a surface of the diamond sintered body 80 are continuously provided in an outer circumferential part of the dicing blade 26 along a circumferential direction.Type: GrantFiled: April 24, 2013Date of Patent: July 11, 2017Assignees: Tokyo Seimitsu Co., Ltd., Shin-Nihon Tech Inc.Inventors: Takashi Fujita, Yasuo Izumi, Junji Watanabe
-
Publication number: 20150107572Abstract: An object of the present invention is to provide a dicing blade which does not cause cracking and breaking even in a workpiece formed from a brittle material, and can stably perform cutting process in a ductile mode on the workpiece with high precision. A dicing blade 26 which performs the cutting process on the workpiece is integrally formed of a diamond sintered body 80 which is formed by sintering diamond abrasive grains 82 so as to have a discoid shape, and a content of the diamond abrasive grains 82 of the diamond sintered body 80 is 80 vol % or more. It is preferable that recessed parts which are formed on a surface of the diamond sintered body 80 are continuously provided in an outer circumferential part of the dicing blade 26 along a circumferential direction.Type: ApplicationFiled: April 24, 2013Publication date: April 23, 2015Inventors: Takashi Fujita, Yasuo Izumi, Junji Watanabe
-
Patent number: 7147195Abstract: An automobile slide adjuster includes a lower rail to be secured to a vehicle body and an upper rail slidably mounted on the lower rail. A plurality of rolling elements are disposed between the upper and lower rails at a lower portion thereof. The upper rail has a plurality of upward protrusions formed on an upper portion thereof and also has an elongated opening formed along a lower edge of each of the plurality of upward protrusions. The upward protrusions are held in sliding contact with a portion of the lower rail.Type: GrantFiled: September 16, 2004Date of Patent: December 12, 2006Assignee: Delta Kogyo Co., LtdInventors: Yasuharu Danjo, Yasuo Izumi
-
Publication number: 20050056761Abstract: An automobile slide adjuster includes a lower rail to be secured to a vehicle body and an upper rail slidably mounted on the lower rail. A plurality of rolling elements are disposed between the upper and lower rails at a lower portion thereof. The upper rail has a plurality of upward protrusions formed on an upper portion thereof and also has an elongated opening formed along a lower edge of each of the plurality of upward protrusions. The upward protrusions are held in sliding contact with a portion of the lower rail.Type: ApplicationFiled: September 16, 2004Publication date: March 17, 2005Inventors: Yasuharu Danjo, Yasuo Izumi
-
Patent number: 5314175Abstract: A wire clamping device which is used to clamp bonding wire in the wire bonding of electronic components comprising: a fixed arm; a movable arm that is positioned so that the end of the fixed arm faces the and of the movable arm with a suitable gap, the movable arm being capable of bending so that the end of the movable arm approaches the end of the fixed arm; and a piezoelectric element that is attached to the movable arm which bends the movable arm by mechanical deformation of the piezoelectric device in order to clamp wire between the end of the movable arm and the end of the fixed arm. A wire clamping method for clamping bonding wire comprising bending a movable arm toward a fixed arm during wire bonding of electronic components by means of mechanical deformation of a piezoelectric element, the deformation being generated by applying a voltage to the piezoelectric element.Type: GrantFiled: April 13, 1992Date of Patent: May 24, 1994Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuo Izumi, Nobuya Matsumura, Akihiro Yamamoto, Yutaka Makino
-
Patent number: 5289966Abstract: A method is provided for electrically connecting a first electronic component which is not resistant to a reflowing temperature and a second electronic component which is resistant to the reflowing temperature to a substrate.Type: GrantFiled: September 8, 1992Date of Patent: March 1, 1994Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuo Izumi, Syoji Sato, Hiroshi Yamauchi, Ryoji Inutsuka
-
Patent number: 5234105Abstract: A package is used for keeping an electric circuit board with no electronic components provided thereon in an air-tight cavity thereof and for preventing from oxidation during the transportation to the process wherein the electronic components are mounted on the electric circuit board. The cavity is composed of the lower and upper sheet of gas-impermeable materials, which are bonded at the bonded area by the fusion bonding, adhesive agent or viscous agent. The cavity is kept in non-oxidizing atmosphere by filling inert gas or evacuating air therefrom. The lower and upper sheets are composed of single layer or multi-layers, which may be made of flexible material or rigid material. An electric circuit board accommodated in the cavity of the package is taken out by the device comprising a separation roller pair. The device weakens the bonding strength to enable easy pulling of the lower and upper sheets to unpackage the circuit board.Type: GrantFiled: November 24, 1992Date of Patent: August 10, 1993Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Syoji Sato, Yasuo Izumi, Kazumi Ishimoto, Yutaka Makino
-
Patent number: 5153707Abstract: A film material for manufacturing film carriers and its manufacturing method wherein the film material common in all may be applied with respect to the various semiconductor chips which are different in the electrode layout, because the inner lead portions for bump connection use which are required to be changed each time the electrode layout of the semiconductor chip changes are not pattern formed, and are kept as the inner lead forming portion with the whole remaining covered with the conductive metallic layer, and, the manufacturing apparatus for etching mask and model and so on have only to be one in type.Type: GrantFiled: November 6, 1990Date of Patent: October 6, 1992Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yutaka Makino, Kazumi Ishimoto, Yasuo Izumi, Yuji Uesugi
-
Patent number: 5140643Abstract: A part mounting apparatus which includes a part holding/transfer device which holds the part at a part supply position for transfer up to a predetermined part mounting position for mounting, a recognizing device for recognizing a shape of the part held by the part holding/transfer device, and an inclined mirror device for inputting into a recognizing device, an image of the shape of the part in a direction perpendicular to a direction of an optical axis of the recognizing device.Type: GrantFiled: December 27, 1990Date of Patent: August 18, 1992Assignee: Matsushita Electric Industries Co., Ltd.Inventors: Yasuo Izumi, Masanori Yasutake
-
Patent number: 5118556Abstract: A film material for the manufacture of a film carrier has a lead pattern including an outer lead portion formed independent of the electrode arrangement of a semiconductor chip to be mounted on the film carrier, and an inner lead formation portion a part of which is selectively removable in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon, the inner lead formation portion being contiguous and connected to respective leads of the outer lead portion.Type: GrantFiled: October 3, 1990Date of Patent: June 2, 1992Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yutaka Makino, Kazumi Ishimoto, Koichi Kumagai, Yasuo Izumi
-
Patent number: 5113788Abstract: A screen printing machine has a table on which a substrate is to be put, a substrate adjusting device on the table to adjust the position of the substrate on the table, a screen plate capable of being placed on the table, a squeegee movable on the plate, a suction unit connected with the table to apply suction to the substrate through through holes of the substrate, a measuring device arranged in the suction unit to measure the degree of vacuum in the suction unit, and an adjusting device arranged in the suction unit to adjust the degree of vacuum.Type: GrantFiled: August 21, 1990Date of Patent: May 19, 1992Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuo Izumi, Syoji Sato, Kazumi Ishimoto, Yutaka Makino, Shohzo Ueno
-
Patent number: 5033783Abstract: A parts mounting apparatus which picks up a part by using a suction nozzle provided in a mounting head and transports the part so as to mount the part at a predetermined position, has: a suction nozzle portion including a suction nozzle, a light transmitting plate and a suction cylinder assembled such that the suction nozzle, the light transmitting plate and the suction cylinder define a suction chamber; the suction nozzle is made of light transmitting material; the light transmitting plate is spaced a proper distance from the suction nozzle; and the suction nozzle, the light transmitting plate and the suction cylinder connected integrally with each other.Type: GrantFiled: October 19, 1989Date of Patent: July 23, 1991Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuo Izumi, Kazumi Ishimoto, Yutaka Makino
-
Patent number: 5018936Abstract: An electronic parts engaging apparatus is equipped with a parts feed portion having a plurality of parts feed devices disposed to feed, for each type of part, parts having marks indicating their separate type. A suction nozzle is composed of a light transmitting material. A recognition device recognizes the parts through the suction nozzle. A memory stores the types of the parts of the respective parts feed devices in the parts feed portion. A control stores in the memory the types of the parts found through the recognition of the marks of the parts of the respective parts feed devices with the recognition device. A periodical washing operation has an effect in that the control operation is simplified.Type: GrantFiled: June 27, 1989Date of Patent: May 28, 1991Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuo Izumi, Kazumi Ishimoto, Yutaka Makino
-
Patent number: 5017131Abstract: An atmosphere furnace including a plurality of divided furnace units, work transfer devices connecting the adjacent divided furnace units and those for the divided furnace units at both ends of the furnace. Each transfer device includes a tubular connecting frame and a work transfer member housed therein and the work transfer member has a work housing space in it. The work transfer member is rotatable, receives at a first position the work from outside or from an adjacent divided furnace unit into its work housing space, and send it out of the furnace or pass it to the adjacent divided furnace unit at a second position. When the work transfer member is at a middle position between the first and the second positions, the work housing space thereof faces an inner surface of the connecting frame so as to be sealed against the both end openings of the frame.Type: GrantFiled: June 29, 1990Date of Patent: May 21, 1991Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Syoji Sato, Yutaka Makino, Kazumi Ishimoto, Yasuo Izumi
-
Patent number: 5003692Abstract: A component mounting method for successively mounting electric components on a printed circuit board, which method comprises the steps of recognizing the position of an electric component retained by a suction nozzle by the effect of a suction force; recognizing the predetermined mounting position on a printed circuit board or any other suitable substrate, at a location spaced a predetermined distance from the printed circuit board; mounting the electric component after the latter has been aligned with the predetermined mounting position on the printed circuit board; and recognizing, through the suction nozzle, the electric component to determine if the electric component has been mounted properly after the suction nozzle has been elevated to a position spaced a predetermined distance upwardly from the printed circuit board. In the event that the latter has been mounted incorrectly, information indicative of an incorrect mounting of the electric component is recorded in a control data.Type: GrantFiled: May 16, 1990Date of Patent: April 2, 1991Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuo Izumi, Kazumi Ishimoto, Yutaka Makino