Patents by Inventor Yasuo Kanetake

Yasuo Kanetake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-packaged electronic component having bent lead terminals
    Patent number: 5387762
    Abstract: An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining a solder wire in a sandwiched state. At the time of mounting the electronic component to a circuit board, the solder wire be caused to melt at a soldering temperature for merging with solder fillets along the bonding end of the lead terminal.
    Type: Grant
    Filed: December 21, 1993
    Date of Patent: February 7, 1995
    Assignee: Rohm Co., Ltd.
    Inventors: Miki Hasegawa, Yasuo Kanetake