Abstract: A skin material and a urethane foam layer directly or indirectly overlap each other, a water-swellable sewing thread is sewn through the skin material and the urethane foam layer, and the water-swellable sewing thread is swollen. As a result, an interior member is formed.

Abstract: As pellets suddenly soften by crystallization heat at a temperature equal to or higher than the glass transition temperature due to the characteristics of polylactic acid and a blocking phenomenon occurs, there is a need for inhibiting the blocking phenomenon. It is thus an object of the present invention to improve productivity of a polylactic acid resin and a polylactic acid-based resin composition comprising polylactic acid as a main component by inhibiting the blocking phenomenon. Aiming at solving above problems, in the present invention, a resin composition comprising polylactic acid or a blend of polylactic acid and another resin obtained by manufacturing the polylactic acid by polymerization or blending the polylactic acid and the another resin after manufacturing the polylactic acid is subjected to a heat treatment at a temperature of the glass transition temperature of polylactic acid ±10° C. for 15 minutes or more before a drying and crystallization treatment.

Abstract: In a method of manufacturing multi-layer printed wiring board, an uncured resin sheet is laminated on both surfaces of a printed wiring board having one or more layers, an organic cover film having a release property is laminated on the surfaces of the uncured resin sheets on upper and lower sides of the printed wiring board, a position of the printed wiring board is irradiated with a laser beam from the surface of the organic cover film to form a non-through hole that reaches a metal land for electrically conducting the layers of the inner printed wiring board, the non-through hole is filled with a thermosetting electrically conducting paste which is then half-cured, and the organic cover film is peeled off.

Abstract: A method of manufacturing highly reliable and highly dense printed wiring board which is not warped even by the application of pressure and heat in manufacturing the multi-layer printed wiring board. The highly precise and highly dense multi-layer printed wiring board is realized by using an uncured resin sheet reinforced with fiber as an interlayer insulating layer, forming non-through holes in the uncured resin sheet using a laser beam, filling the non-through holes with a conductive paste, half-curing the conductive paste to form a wiring material, and sticking the wiring material onto the wiring substrate by application of pressure and heat, without causing a deviation in position even in applying pressure and heat.

Abstract: A method of manufacturing highly reliable and highly densely printed wiring board which are not warped even by the application of pressure and heat in the step of manufacturing the multi-layer printed wiring board. The highly precise and highly dense multi-layer printed wiring board is realized by using an uncured resin sheet reinforced with fiber as an interlayer insulating layer, forming non-through holes in the uncured resin sheet by using a laser beam, filling the non-through holes with a conductive paste, half-curing the conductive paste to form a wiring material, and sticking the wiring material onto the wiring substrate by the application of pressure and heat, without causing deviation in position even in the step of applying pressure and heat.

Abstract: In a method of manufacturing multi-layer printed wiring board, an uncured resin sheet is laminated on both surfaces of a printed wiring board having one or more layers, an organic cover film having release property is laminated on the surfaces of the uncured resin sheets on the upper and lower sides of the inner printed wiring board, a desired position of the printed wiring board is irradiated with a laser beam from the surface of the organic cover film to form a non-through hole that reaches a metal land for electrically conducting the layers formed on the inner printed wiring board, the non-through hole is filled with a thermosetting electrically conducting paste which is then half-cured, and the organic cover film is peeled off.