Abstract: Provided is a printing device including: an capacitive touch panel; a home operation portion including a mechanical key for transitioning from a screen displayed on the capacitive touch panel to a basic screen; and a power supply operation portion including a mechanical key for shifting a power state of the printing device, in which the home operation portion is located in a first direction of the capacitive touch panel, and the power supply operation portion is located in a second direction of the capacitive touch panel, and the first direction and the second direction are orthogonal or opposite directions.

Abstract: Provided is a printing device that performs printing using a recording material, the printing device including: an capacitive touch panel; a home operation portion including a mechanical key for transitioning from a screen displayed on the capacitive touch panel to a basic screen including information on a remaining amount of the recording material; and a power supply operation portion including a mechanical key for shifting a power state of the printing device, in which the home operation portion is closer to the capacitive touch panel than the power supply operation portion.

Abstract: A tag label producing apparatus has a cartridge holder for setting a first roll configured by winding a base tape equipped with identification marks, which include marks formed by two black strips and arranged with a pitch 2Pp and marks formed by one black strip and arranged with the pitch 2Pp, at a plurality of portions, a feeding roller driving shaft that feeds the base tape supplied from the first roll attached to the cartridge holder a print head that makes a predetermined print on the base tape or a cover film to be bonded thereto, and a mark sensor that detects the identification mark on the base tape, and controls the feeding roller driving shaft and the print head in coordination with each other in accordance with the detection result of the identification mark by the mark sensor.

Abstract: A semiconductor-encapsulating liquid epoxy resin composition comprises (A) a liquid epoxy resin, (B) an aromatic amine curing agent, and (C) an inorganic filler comprising an inorganic filler A which is a silica having an average particle size of 0.1 to 3 ?m, and an inorganic filler B which is an amorphous nanosilica having an average particle size of 5 to 70 nm and having its surface treated with a coupling agent represented by the following formula (1) and/or (2): wherein n is an integer of 1 to 5, and m is 1 or 2.

Abstract: To realize smooth manufacturing of tag tape and RFID labels. The RFID tag label producing apparatus 1 comprises a tag inserter 26 for inserting at predetermined intervals RFID tags Tg between an adhesive layer 200Aa of a first tape 200A fed out from a first tape roll 211 and an adhesive layer 200Ba of a second tape 200B fed out from a second tape roll 213, and a base tape roll 215 for taking up a base tape 210 produced by bonding of the first tape 200A and the second tape 200B and attachment of the RFID tags Tg by the tag inserter 226, and making this a tag tape roll. The REID tag comprises RFID circuit elements To provided with an IC circuit part 151 for storing information and an tag antenna 152 connected to the IC circuit part 151 for performing transmission and reception of information.

Abstract: An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a phosphazene compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract: An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and (C) an inorganic filler, the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract: [Object] To realize smooth manufacturing of tag tape and RFID labels. [Solving Means] The RFID tag label producing apparatus 1 comprises a tag inserter 26 for inserting at predetermined intervals RFID tags Tg between an adhesive layer 200Aa of a first tape 200A fed out from a first tape roll 211 and an adhesive layer 200Ba of a second tape 200B fed out from a second tape roll 213, and a base tape roll 215 for taking up a base tape 210 produced by bonding of the first tape 200A and the second tape 200B and attachment of the RFID tags Tg by the tag inserter 226, and making this a tag tape roll. The REID tag comprises RFID circuit elements To provided with an IC circuit part 151 for storing information and an tag antenna 152 connected to the IC circuit part 151 for performing transmission and reception of information.

Abstract: The apparatus for producing RFID labels comprises a second roll configured by winding a base tape having a plurality of RFID circuit elements arranged with a predetermined arrangement regularity and a plurality of identification marks arranged with a fixed pitch in a tape longitudinal direction; a cartridge holder including a portion to be detected for recording correlation information indicating which of a plurality of predetermined correlations is a relation of the arrangement regularity to the fixed pitch; a feeding roller drive shaft for feeding the base tape supplied from a cartridge attached to the cartridge holder; a loop antenna for transmitting and receiving information by radio communication with the RFID circuit element; and a mark sensor detecting the identification mark of the base tape, and a control circuit acquires the correlation information from the portion to be detected of the cartridge.

Abstract: A tag label producing apparatus has a cartridge holder for setting a first roll configured by winding a base tape equipped with identification marks, which include marks formed by two black strips and arranged with a pitch 2Pp and marks formed by one black strip and arranged with the pitch 2Pp, at a plurality of portions, a feeding roller driving shaft that feeds the base tape supplied from the first roll attached to the cartridge holder a print head that makes a predetermined print on the base tape or a cover film to be bonded thereto, and a mark sensor that detects the identification mark on the base tape, and controls the feeding roller driving shaft and the print head in coordination with each other in accordance with the detection result of the identification mark by the mark sensor.

Abstract: An epoxy resin composition comprising (A) a mixture of a naphthalene type epoxy resin and an anthracene type epoxy resin, (B) a curing agent in the form of a naphthalene type phenolic resin, and (C) an inorganic filler is best suited for semiconductor encapsulation.

Abstract: An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a phenolic resin curing agent, (C) a copolymer obtained through addition reaction of alkenyl groups on an alkenyl-containing epoxy compound and SiH groups on an organohydrogenpolysiloxane of 20 to 50 silicon atoms, and (D) an inorganic filler is best suited for semiconductor encapsulation because the cured composition has good thermal cycling, anti-warping, reflow resistance, and moisture-proof reliability.

Abstract: An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a rare earth oxide or hydrotalcite compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract: An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a phosphazene compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract: An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and (C) an inorganic filler, the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract: Process for the protection of a building that has already been built or is going to be built, whereby an effective amount of an insecticidally active compound is spread around or under the said building at discrete locations. The insecticide may be an arylpyrazole.

Abstract: Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.

Abstract: Process for the protection of a building that has already been built or is going to be built, whereby an effective amount of an insecticidally active compound is spread around or under the said building at discrete locations. The insecticide may be an arylpyrazole.

Abstract: Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.

Abstract: An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.