Patents by Inventor Yasuo Matsui

Yasuo Matsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190305461
    Abstract: It is aimed to detect a mounted state of a second terminal fitting in a terminal unit in which the second terminal fitting is mounted in a terminal holding member. A connector includes an interfering projection (25) formed on a retainer (21). When a second terminal fitting (50) of a terminal unit (30) is properly mounted in a terminal holding member (31), the retainer (21) is displaceable from a partial locking position to a full locking position without the interfering projection (25) interfering with the second terminal fitting (50). When the second terminal fitting (50) is improperly mounted in the terminal holding member (31), the interfering projection (25) interferes with the second terminal fitting (50), thereby restricting a displacement of the retainer (21) to a full locking position.
    Type: Application
    Filed: May 25, 2017
    Publication date: October 3, 2019
    Inventors: Tetsuya Miyamura, Masaaki Tabata, Yasuo Omori, Hajime Matsui
  • Patent number: 10411366
    Abstract: A connector (A) includes a barrel (23) formed in a terminal fitting (15) and crimped to surround a front end part of a coated wire (11). The barrel (23) has a base plate (24) connected to a bottom portion (22) of a terminal body (16) and two crimping pieces (27) extending from both widthwise sides of the base plate (24). A molded portion (30) surrounds the barrel (23) over an entire periphery and is configured to cover the front end part of the coated wire (11) in a liquid-tight manner. A housing (35) is formed with a terminal accommodation chamber (36) for accommodating the entire terminal fitting (15). The base plate (24) is raised with respect to the bottom portion (22) of the terminal body (16).
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: September 10, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Shunya Takeuchi, Yasuo Omori, Hajime Matsui, Takehiro Nakata, Yoshiaki Yamano, Tetsuya Nakamura
  • Patent number: 10390742
    Abstract: A non-invasive monitor for measuring regional saturation of oxygen includes a sensor unit containing a printed circuit board on which a light emitting unit and a light receiving unit are mounted; a main body unit; a sensor holder for holding the sensor unit while the light emitting unit and the light receiving unit are disposed in an aperture portion; a sensor pressing board; a connecting unit for electrically connecting the sensor unit and the main body unit; and a headband. The light emitting unit and the light receiving unit are disposed such that a light emitting surface and a light receiving surface face the forehead-side, and a part or the whole of the forehead-side surface of the sensor unit is on the same surface as the forehead-side surface of the sensor holder or protrudes from the forehead-side surface of the sensor holder toward the forehead-side.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: August 27, 2019
    Assignee: KOHKEN MEDICAL CO., LTD.
    Inventors: Eiichi Matsui, Mitsuo Matsui, Yasuo Nakajima
  • Patent number: 10389044
    Abstract: A connector includes barrels (19) formed in rear end parts of terminal fittings (15) and crimped to surround front end parts of coated wires (11). First to third molds (23A, 23B, 23C) each covering the front end part of the coated wire (11) including a crimped part to the barrel (19) in a liquid-tight manner. A housing (30) is formed with terminal accommodation chambers (31) each for accommodating the entire terminal fitting (15) and a front end area of the mold (23A, 23B, 23C), and first to third contacts (26A, 26B, 26C) each formed on a projection (25) of the mold (23A, 23B, 23C) projecting out from the housing (30) and configured to suppress deformation of the projection (25) of the mold (23A, 23B, 23C) by coming into contact with the housing (30).
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: August 20, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Shunya Takeuchi, Yasuo Omori, Hajime Matsui, Takehiro Nakata
  • Publication number: 20190252803
    Abstract: A female terminal 12 is a female terminal including a terminal body 15 including a deformable upper connection piece 18A and a deformable lower connection piece 18B, the upper and lower connection pieces 18A and 18B having contact surfaces 21A and 21B that come in contact with a core 13 of a wire 11, respectively, and extending in an extension direction, and a slide 16 configured to move along the extension direction. The slide 16 has an upper contact portion 25A and a lower contact portion 25B that press the upper connection piece 18A and the lower connection piece 18B, respectively, to the core 13 while the core 13 is disposed in contact with the contact surfaces 21A and 21B of the upper and lower connection pieces 18A and 18B along the extension direction.
    Type: Application
    Filed: February 11, 2019
    Publication date: August 15, 2019
    Inventors: Shunya Takeuchi, Hajime Kawase, Masaaki Tabata, Yasuo Omori, Teruo Hara, Hajime Matsui, Masahide Hio, Hideki Matsunaga, Yoshihiro Mizutani, Takamaru Amano, Takeshi Misaiji, Hiroshi Kobayashi
  • Patent number: 10367319
    Abstract: It is aimed to build a trunk line of an in-vehicle network having low connection resistance. The in-vehicle network is composed of a trunk line (1) and branch lines (2) branched from branch points (3) arranged at a plurality of intermediate positions of the trunk line (19 via connectors (CO) and to be connected to electronic control units (U). A bypass bypassed toward the connector (CO) from the trunk line (1) is formed at each branch point (3) of the branch line (1), and an exposed part of a core (7) is formed in this bypass and connected to a trunk line terminal (6). A branch line terminal (8) connected to an end of the branch line (2) and the trunk line terminal (6) are connected inside the connector (CO).
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: July 30, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Hajime Matsui, Yasuo Omori
  • Publication number: 20190229448
    Abstract: A board connector includes a housing (10) mounted on a mounting surface (S) of a circuit board (P) and includes a terminal holding portion (11). Two types of long narrow terminal fittings (13, 20) are provided and each includes a board connecting portion (14, 21) extending in a front-rear direction and to be fixed to the mounting surface (S) behind the terminal holding portion (11). Each terminal connecting portion (15, 22) penetrates the terminal holding portion (11) in the front-rear direction. The terminal connecting portions (15, 22) have different heights from the mounting surface (S). The two types of terminal fittings (13, 20) include extra length links (16, 23) longer than heights of the terminal connecting portions (15, 22) from the mounting surface (S) and linking front ends (14F, 21F) of the board connecting portions (14, 21) and rear ends (15R, 22R) of the terminal connecting portions (15, 22).
    Type: Application
    Filed: May 25, 2017
    Publication date: July 25, 2019
    Inventors: Tetsuya Miyamura, Masaaki Tabata, Yasuo Omori, Hajime Matsui
  • Publication number: 20190157792
    Abstract: It is aimed to simplify the shape of a terminal unit in a structure for mounting the terminal unit into a housing. A connector includes a housing (10) formed with an accommodating portion (11) inside, a guide groove (13) formed in the accommodating portion (11), a terminal unit (30) configured by accommodating a plurality of terminal fittings (49) into a terminal holding member (31) and to be inserted into the accommodating portion (11), a guide rib (46) formed on the terminal unit (30) and configured to guide the terminal unit (30) by sliding in contact with the guide groove (13), and a retainer (20) configured to restrict outward detachment of the terminal unit (30) from the accommodating portion (11) by being mounted into the housing (10) and locking the guide rib (46).
    Type: Application
    Filed: May 25, 2017
    Publication date: May 23, 2019
    Inventors: Tetsuya Miyamura, Masaaki Tabata, Yasuo Omori, Hajime Matsui
  • Patent number: 7922918
    Abstract: There is provided a method of manufacturing a circuit board having a first fixed contact and a second fixed contact that extend substantially orthogonal to each other on the same surface, the life span required for the first fixed contact being longer than that required for the second fixed contact. The method includes: etching a copper foil formed on the entire surface of an insulating substrate to form the patterns of the first and second fixed contacts; polishing the surface of the insulating substrate with buff to remove an oxide film adhered to the copper foil; and sequentially forming a nickel layer having a thickness of about 1 to about 5 ?m and a gold layer having a thickness of about 0.01 to about 0.5 ?m on each of the first and second fixed contacts. In the method, the buffing direction is substantially aligned with a direction in which a first movable contact slides on the first fixed contact.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: April 12, 2011
    Assignee: Alps Electric Co., Ltd.
    Inventors: Yasuo Matsui, Shunji Araki
  • Patent number: 7799852
    Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: September 21, 2010
    Assignees: NEC Corporation, Sumitomo Bakelite Company Limited
    Inventors: Yukihiro Kiuchi, Masatoshi Iji, Katsushi Terajima, Isao Katayama, Yasuo Matsui, Ken Oota
  • Publication number: 20080093335
    Abstract: There is provided a method of manufacturing a circuit board having a first fixed contact and a second fixed contact that extend substantially orthogonal to each other on the same surface, the life span required for the first fixed contact being longer than that required for the second fixed contact. The method includes: etching a copper foil formed on the entire surface of an insulating substrate to form the patterns of the first and second fixed contacts; polishing the surface of the insulating substrate with buff to remove an oxide film adhered to the copper foil; and sequentially forming a nickel layer having a thickness of about 1 to about 5 ?m and a gold layer having a thickness of about 0.01 to about 0.5 ?m on each of the first and second fixed contacts. In the method, the buffing direction is substantially aligned with a direction in which a first movable contact slides on the first fixed contact.
    Type: Application
    Filed: October 15, 2007
    Publication date: April 24, 2008
    Inventors: Yasuo Matsui, Shunji Araki
  • Publication number: 20060247393
    Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.
    Type: Application
    Filed: June 30, 2006
    Publication date: November 2, 2006
    Applicants: NEC CORPORATION, SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Yukihiro Kiuichi, Masatoshi Iji, Katsushi Terajima, Isao Katayama, Yasuo Matsui, Ken Oota
  • Patent number: 7098276
    Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: August 29, 2006
    Assignees: NEC Corporation, Sumitomo Bakelite Company
    Inventors: Yukihiro Kiuchi, Masatoshi Iji, Katsushi Terajima, Isao Katayama, Yasuo Matsui, Ken Oota
  • Patent number: 5575501
    Abstract: In a collapsible steering shaft a collapse load is decreased while assuring the heat resistance of a coupling portion between an outer shaft and an inner shaft. In addition, a time during which a great collapse load is needed is also decreased. Female serration grooves on an inner surface of the outer shaft are engaged with male serration grooves on an outer surface of the inner shaft. A recess is formed on the outer surface of the inner shaft and is aligned with a root in the male serration grooves, and a steel ball is set in the recess. A part of this steel ball intrudes into a top part of a thread in the female serration grooves. A flat portion is formed by removing a part of the male serration grooves, whereby the top part crushed by the steel ball can be prevented from frictionally engaging with the male serration grooves.
    Type: Grant
    Filed: February 16, 1995
    Date of Patent: November 19, 1996
    Assignee: NSK Ltd.
    Inventors: Seiichi Moriyama, Yasuo Matsui, Kiyoshi Sadakata
  • Patent number: 4484042
    Abstract: A push-button switch affording a clear click feeling, comprising a contact plate which is curved in one direction and which is formed into a movable contact by providing therein two substantially parallel slits extending in a perimetric direction, forming a movable contact portion between said two slits, and curving both side edges of said contact plate along said slits oppositely to the direction of the curvature of said movable contact portion so as to form normally-contacted contact portion; a switch body which includes first stationary contacts and a second stationary contact; and a push button; said normally-contacted contact portions of said contact plate being normally held in electrical contact with said first stationary contacts of said switch body, while said movable contact portion of said contact plate is depressed and deformed oppositely to the direction of the curvature thereof by said push button, thereby to come into electrical contact with said second stationary contact of said switch body; s
    Type: Grant
    Filed: August 2, 1983
    Date of Patent: November 20, 1984
    Assignee: Alps Electric Co., Ltd.
    Inventor: Yasuo Matsui
  • Patent number: 4435826
    Abstract: A frame synchronizer for detecting synchronizing patterns inserted at leading positions of data trains, for each data, which data trains are independent for each period, by a mechanical sensor mounted on the earth observing satellite LANDSAT is disclosed. The code synchronizer comprises a PN code generator for cyclically generating a PN code, a comparator and a counter. A receiving code train including the PN code as a synchronizing signal is applied to the PN code generator and the number of times of coincidence of the output code of the PN generator and an input code is counted. When the number of times of coincidence exceeds a preset number, it is determined that the synchronization has been obtained. A probability of wrong synchronization is minimized and the loss of image on a ground station is prevented.
    Type: Grant
    Filed: August 28, 1981
    Date of Patent: March 6, 1984
    Assignee: Hitachi, Ltd.
    Inventor: Yasuo Matsui
  • Patent number: 4091064
    Abstract: Electric cables insulated with a cured polyolefin and having high electrical breakdown strength are produced, in each instance, by applying, an insulating layer of polyolefin containing a curing agent onto a conductor by means of an extruder, forming and hot-curing said layer by means of a long-land die, simultaneously applying a specific forming coagent to a tapered portion of the long-land die, and cooling the resulting hot-cured insulating layer formed on the conductor in a cooling zone.
    Type: Grant
    Filed: May 24, 1976
    Date of Patent: May 23, 1978
    Assignees: Dainichi Nihon Densen Kabushiki Kaisha, Mitsubishi Petrochemical Co., Ltd
    Inventors: Mitsuo Kakinuma, Isoji Motegi, Yasuo Matsui, Masatake Matsui, Masaaki Ohtsuju, Kiyoshi Takahashi, Takeo Fukuda