Patents by Inventor Yasuo Matsui

Yasuo Matsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7922918
    Abstract: There is provided a method of manufacturing a circuit board having a first fixed contact and a second fixed contact that extend substantially orthogonal to each other on the same surface, the life span required for the first fixed contact being longer than that required for the second fixed contact. The method includes: etching a copper foil formed on the entire surface of an insulating substrate to form the patterns of the first and second fixed contacts; polishing the surface of the insulating substrate with buff to remove an oxide film adhered to the copper foil; and sequentially forming a nickel layer having a thickness of about 1 to about 5 ?m and a gold layer having a thickness of about 0.01 to about 0.5 ?m on each of the first and second fixed contacts. In the method, the buffing direction is substantially aligned with a direction in which a first movable contact slides on the first fixed contact.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: April 12, 2011
    Assignee: Alps Electric Co., Ltd.
    Inventors: Yasuo Matsui, Shunji Araki
  • Patent number: 7799852
    Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: September 21, 2010
    Assignees: NEC Corporation, Sumitomo Bakelite Company Limited
    Inventors: Yukihiro Kiuchi, Masatoshi Iji, Katsushi Terajima, Isao Katayama, Yasuo Matsui, Ken Oota
  • Publication number: 20080093335
    Abstract: There is provided a method of manufacturing a circuit board having a first fixed contact and a second fixed contact that extend substantially orthogonal to each other on the same surface, the life span required for the first fixed contact being longer than that required for the second fixed contact. The method includes: etching a copper foil formed on the entire surface of an insulating substrate to form the patterns of the first and second fixed contacts; polishing the surface of the insulating substrate with buff to remove an oxide film adhered to the copper foil; and sequentially forming a nickel layer having a thickness of about 1 to about 5 ?m and a gold layer having a thickness of about 0.01 to about 0.5 ?m on each of the first and second fixed contacts. In the method, the buffing direction is substantially aligned with a direction in which a first movable contact slides on the first fixed contact.
    Type: Application
    Filed: October 15, 2007
    Publication date: April 24, 2008
    Inventors: Yasuo Matsui, Shunji Araki
  • Publication number: 20060247393
    Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.
    Type: Application
    Filed: June 30, 2006
    Publication date: November 2, 2006
    Applicants: NEC CORPORATION, SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Yukihiro Kiuichi, Masatoshi Iji, Katsushi Terajima, Isao Katayama, Yasuo Matsui, Ken Oota
  • Patent number: 7098276
    Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: August 29, 2006
    Assignees: NEC Corporation, Sumitomo Bakelite Company
    Inventors: Yukihiro Kiuchi, Masatoshi Iji, Katsushi Terajima, Isao Katayama, Yasuo Matsui, Ken Oota
  • Patent number: 5575501
    Abstract: In a collapsible steering shaft a collapse load is decreased while assuring the heat resistance of a coupling portion between an outer shaft and an inner shaft. In addition, a time during which a great collapse load is needed is also decreased. Female serration grooves on an inner surface of the outer shaft are engaged with male serration grooves on an outer surface of the inner shaft. A recess is formed on the outer surface of the inner shaft and is aligned with a root in the male serration grooves, and a steel ball is set in the recess. A part of this steel ball intrudes into a top part of a thread in the female serration grooves. A flat portion is formed by removing a part of the male serration grooves, whereby the top part crushed by the steel ball can be prevented from frictionally engaging with the male serration grooves.
    Type: Grant
    Filed: February 16, 1995
    Date of Patent: November 19, 1996
    Assignee: NSK Ltd.
    Inventors: Seiichi Moriyama, Yasuo Matsui, Kiyoshi Sadakata
  • Patent number: 4484042
    Abstract: A push-button switch affording a clear click feeling, comprising a contact plate which is curved in one direction and which is formed into a movable contact by providing therein two substantially parallel slits extending in a perimetric direction, forming a movable contact portion between said two slits, and curving both side edges of said contact plate along said slits oppositely to the direction of the curvature of said movable contact portion so as to form normally-contacted contact portion; a switch body which includes first stationary contacts and a second stationary contact; and a push button; said normally-contacted contact portions of said contact plate being normally held in electrical contact with said first stationary contacts of said switch body, while said movable contact portion of said contact plate is depressed and deformed oppositely to the direction of the curvature thereof by said push button, thereby to come into electrical contact with said second stationary contact of said switch body; s
    Type: Grant
    Filed: August 2, 1983
    Date of Patent: November 20, 1984
    Assignee: Alps Electric Co., Ltd.
    Inventor: Yasuo Matsui
  • Patent number: 4435826
    Abstract: A frame synchronizer for detecting synchronizing patterns inserted at leading positions of data trains, for each data, which data trains are independent for each period, by a mechanical sensor mounted on the earth observing satellite LANDSAT is disclosed. The code synchronizer comprises a PN code generator for cyclically generating a PN code, a comparator and a counter. A receiving code train including the PN code as a synchronizing signal is applied to the PN code generator and the number of times of coincidence of the output code of the PN generator and an input code is counted. When the number of times of coincidence exceeds a preset number, it is determined that the synchronization has been obtained. A probability of wrong synchronization is minimized and the loss of image on a ground station is prevented.
    Type: Grant
    Filed: August 28, 1981
    Date of Patent: March 6, 1984
    Assignee: Hitachi, Ltd.
    Inventor: Yasuo Matsui
  • Patent number: 4091064
    Abstract: Electric cables insulated with a cured polyolefin and having high electrical breakdown strength are produced, in each instance, by applying, an insulating layer of polyolefin containing a curing agent onto a conductor by means of an extruder, forming and hot-curing said layer by means of a long-land die, simultaneously applying a specific forming coagent to a tapered portion of the long-land die, and cooling the resulting hot-cured insulating layer formed on the conductor in a cooling zone.
    Type: Grant
    Filed: May 24, 1976
    Date of Patent: May 23, 1978
    Assignees: Dainichi Nihon Densen Kabushiki Kaisha, Mitsubishi Petrochemical Co., Ltd
    Inventors: Mitsuo Kakinuma, Isoji Motegi, Yasuo Matsui, Masatake Matsui, Masaaki Ohtsuju, Kiyoshi Takahashi, Takeo Fukuda