Abstract: An inductor component includes a lamination of an insulating layer and a conductive layer. The insulating layer includes a base made of glass and inorganic particles dispersed in the base. Some of the inorganic particles partially project through the surface of the base into the conductive layer.

Abstract: A display control device for performing control on a display of a display configured to display an image of content laid out in a virtual space as viewed from a predetermined position, the display being mounted on portions of eyes by a user. The device detects an orientation, with respect to the display, of a head portion of a person other than the user and determines whether a position of the content needs to be changed based on a detection-result and the position of the content in the virtual space. A position change destination of the content in the virtual space is set based on a distance between the position change destination of the content in the virtual space and a position at a current point in time of the content and to change the position of the content when the position of the content is to be changed.

Abstract: Anchor conductors extending from internal terminal conductors and being in contact with a component body are provided inside the component body. The anchor conductors are provided so as not to be connected to a coil conductor including a circulating portion, and so as not to be exposed on an outer surface of the component body. The anchor conductors are in contact with the component body to thereby enhance fixing force of the internal terminal conductors to the component body.

Abstract: An electronic component includes a component body, a base electrode that has a surface exposed from the component body and contains at least one of silver and copper, an alloy layer deposited on the surface of the base electrode, and a nickel layer deposited on a surface of the alloy layer. The material of the alloy layer is an alloy containing nickel and tin.

Abstract: Anchor conductors extending from internal terminal conductors and being in contact with a component body are provided inside the component body. The anchor conductors are provided so as not to be connected to a coil conductor including a circulating portion, and so as not to be exposed on an outer surface of the component body. The anchor conductors are in contact with the component body to thereby enhance fixing force of the internal terminal conductors to the component body.

Abstract: Anchor conductors extending from internal terminal conductors and being in contact with a component body are provided inside the component body. The anchor conductors are provided so as not to be connected to a coil conductor including a circulating portion, and so as not to be exposed on an outer surface of the component body. The anchor conductors are in contact with the component body to thereby enhance fixing force of the internal terminal conductors to the component body.

Abstract: A manufacturing method for an organic electronic device according to a mode includes a device substrate manufacturing step S01 of manufacturing a device substrate 12 in which a first electrode layer 18, a device function portion 20 including an organic layer, and a second electrode layer 22 are sequentially laminated in each of a plurality of device formation regions DA virtually set in a flexible support substrate 16 and having at least one corner, a bonding step S02 of bonding a sealing member 14 including a sealing base 24 and an adhesive layer 26 laminated on the sealing base to a side of the second electrode layer of the device substrate via the adhesive layer such that the sealing member is not disposed at corners c1 to c4 of the device formation region, and a dicing step S03 of dicing the device substrate, to which the sealing member is bonded, for each of the device formation regions to obtain an organic electronic device 10.

Abstract: An inductor component includes a base having a columnar shape and including a mounting surface parallel with a length direction being a longitudinal direction of the columnar shape and with a width direction orthogonal to the length direction, inductor wiring arranged inside the base, a first outer electrode connected to the inductor wiring and disposed on the mounting surface, and a second outer electrode connected to the inductor wiring and disposed on the mounting surface, the first outer electrode and the second outer electrode arranged in the length direction. When a maximum dimension of the mounting surface in the length direction is L, a maximum dimension of the first outer electrode in the width direction is a, and a maximum dimension of the second outer electrode in the width direction is b, a?L/2<W and b?L/2<W.

Abstract: An electronic component includes a component body, a base electrode that has a surface exposed from the component body and contains at least one of silver and copper, an alloy layer deposited on the surface of the base electrode, and a nickel layer deposited on a surface of the alloy layer. The material of the alloy layer is an alloy containing nickel and tin.

Abstract: An inductor component includes a lamination of an insulating layer and a conductive layer. The insulating layer includes a base made of glass and inorganic particles dispersed in the base. Some of the inorganic particles partially project through the surface of the base into the conductive layer.

Abstract: A manufacturing method for an organic electronic device according to a mode includes a device substrate manufacturing step S01 of manufacturing a device substrate 12 in which a first electrode layer 18, a device function portion 20 including an organic layer, and a second electrode layer 22 are sequentially laminated in each of a plurality of device formation regions DA virtually set in a flexible support substrate 16 and having at least one corner, a bonding step S02 of bonding a sealing member 14 including a sealing base 24 and an adhesive layer 26 laminated on the sealing base to a side of the second electrode layer of the device substrate via the adhesive layer such that the sealing member is not disposed at corners c1 to c4 of the device formation region, and a dicing step S03 of dicing the device substrate, to which the sealing member is bonded, for each of the device formation regions to obtain an organic electronic device 10.

Abstract: Anchor conductors extending from internal terminal conductors and being in contact with a component body are provided inside the component body. The anchor conductors are provided so as not to be connected to a coil conductor including a circulating portion, and so as not to be exposed on an outer surface of the component body. The anchor conductors are in contact with the component body to thereby enhance fixing force of the internal terminal conductors to the component body.

Abstract: An internal state estimating device includes an electrolysis resistance calculating part calculating a post-deterioration resistance value of an electrolysis resistive component using a detection value from a sensor, a reaction resistance calculating part calculating a post-deterioration resistance value of a reaction resistive component using a resistance increase ratio and an initial resistance value of an reaction resistor, wherein the resistance increase ratio is a ratio of the post-deterioration resistance value of the electrolysis resistive component to an initial resistance value of an electrolysis resistor, and a capacitance calculating part calculating a post-deterioration capacitance value of an electric double-layer capacitive component using the resistance increase ratio and an initial capacitance value of the electric double-layer capacitive component.

Abstract: A method of manufacturing an organic device including: forming a plurality of organic device units in one direction at predetermined intervals; affixing a sealing member extending in the one direction, such that a part of each of a first and a second electrode layer in each of the organic device units is exposed and the sealing member straddles across the plurality of organic device units; and cutting the plurality of organic device units to which the sealing member is affixed; in the affixing, the sealing member including a sealing base material containing a material having conductivity, and an adhesive portion containing a pressure-sensitive adhesive is affixed to the organic device unit; in the cutting, the sealing member is cut such that a cutting blade is allowed to approach from the sealing member side, and the adhesive portion after being cut protrudes to the outside from the sealing base material.

Abstract: A method for manufacturing an organic EL panel capable of reducing uneven emission luminance (uneven light emission) is disclosed. A method for manufacturing an organic EL panel according to an embodiment of the invention is a method for manufacturing an organic EL panel including a functional layer including at least a light emitting layer containing an organic material, including a coating step of forming a functional layer by horizontally conveying a base material (110) having flexibility using a roll-to-roll process and coating a coating solution containing an organic material onto the base material (110) using an inkjet applicator (30) disposed above the base material (110), wherein in the coating step, the base material (110) is floated by air using an air floating stage (20) disposed below the base material (110) and the coating solution is coated onto the base material (110).

Abstract: A method for manufacturing an organic device (1) includes a forming step of forming a plurality of organic device parts (10) in one direction at predetermined intervals on a support substrate (3) which extends in the one direction; a bonding step of bonding a sealing member (11) which extends in the one direction in the one direction so that respective parts of a first electrode layer (5) and a second electrode layer (9) in the organic device parts (10) are exposed and straddle the plurality of organic device parts (10); and a cutting step of separating the plurality of organic device parts (10), and in the bonding step, the sealing member (11) is bonded to the organic device part (10) using a pressure sensitive adhesive, and in the cutting step, a cutting blade B is made to enter from the side of the sealing member (11).

Abstract: A method for manufacturing an organic device (1) includes a forming step of forming a plurality of organic device parts (10) at predetermined intervals on a support substrate (3) which extends in one direction, a bonding step of bonding a sealing member (11) respective the organic device parts (10), and a cutting step of separating the organic device parts (10) into pieces, and in the cutting step, while an area of the one main surface (3a) of the support substrate (3) to which the sealing member (11) is not bonded and the sealing member (11) are supported by a support (100) in contact with the area and the sealing member (11), a cutting blade B is made to enter from the side of the other main surface (3b) of the support substrate (3).

Abstract: A method for manufacturing an organic electronic element capable of reducing unevenness in film thickness of a coating film is disclosed. A method for manufacturing an organic electronic element according to an embodiment of the invention is a method for manufacturing an organic electronic element including a functional layer containing an organic material, including a coating step of forming a functional layer by horizontally conveying a base material (110) having flexibility using a roll-to-roll process and coating a coating solution containing an organic material onto the base material (110) using a slit coat applicator (30) disposed above the base material (110), wherein in the coating step, the base material (110) is floated by air using an air floating stage (20) disposed below the base material (110) and the coating solution is coated onto the base material (110).

Abstract: An internal state estimating device includes an electrolysis resistance calculating part calculating a post-deterioration resistance value of an electrolysis resistive component using a detection value from a sensor, a reaction resistance calculating part calculating a post-deterioration resistance value of a reaction resistive component using a resistance increase ratio which is a ratio of the post-deterioration resistance value of the electrolysis resistive component to an initial resistance value of an electrolysis resistor and an initial resistance value, and a capacitance calculating part calculating a post-deterioration capacitance value of an electric double-layer capacitive component using the resistance increase ratio and an initial capacitance value of the electric double-layer capacitive component.

Abstract: A method for manufacturing an organic EL panel capable of reducing uneven emission luminance (uneven light emission) is disclosed. A method for manufacturing an organic EL panel according to an embodiment of the invention is a method for manufacturing an organic EL panel including a functional layer including at least a light emitting layer containing an organic material, including a coating step of forming a functional layer by horizontally conveying a base material (110) having flexibility using a roll-to-roll process and coating a coating solution containing an organic material onto the base material (110) using an inkjet applicator (30) disposed above the base material (110), wherein in the coating step, the base material (110) is floated by air using an air floating stage (20) disposed below the base material (110) and the coating solution is coated onto the base material (110).