Abstract: An electrical device includes a first unit including an electrode; a second unit having a hole at a position corresponding to the electrode of the first unit; a probe pin having a smaller diameter than the hole and configured to be elastically deformed, the probe pin being disposed in the hole such that a front end thereof is in contact with the electrode of the first unit; and an adhesive connecting the first unit and the second unit to each other and filling the hole so as to fix the probe pin.

Abstract: A method for manufacturing an electronic device, the method includes: applying an adhesive film on a package board; placing an electronic component on the package board with a bump therebetween; applying a first load to the electronic component while heating the electronic component to a first temperature higher than a reaction start temperature of the adhesive film and lower than a melting point of the bump; reducing the first load to a second load lower than the first load while maintaining the first temperature; and heating the electronic component to a second temperature higher than or equal to the melting point of the bump while maintaining the second load.

Abstract: A method for manufacturing an electronic device, the method includes: applying an adhesive film on a package board; placing an electronic component on the package board with a bump therebetween; applying a first load to the electronic component while heating the electronic component to a first temperature higher than a reaction start temperature of the adhesive film and lower than a melting point of the bump; reducing the first load to a second load lower than the first load while maintaining the first temperature; and heating the electronic component to a second temperature higher than or equal to the melting point of the bump while maintaining the second load.

Abstract: A printed circuit board manufacturing method includes: supporting a substrate on a support member; disposing a semiconductor chip on an opposite side of the substrate from the support member and pressing the semiconductor chip against the substrate with a pressing member; and employing as the support member a member formed with a cavity larger than an external profile of the semiconductor chip and formed with a sloping portion towards the center of a bottom face of the cavity.

Abstract: An interposer includes a substrate having first and second opposing surfaces, the substrate having a sheet shape; and a plurality of spring electrodes fixed to the substrate in a certain arrangement, each of the plurality of the spring electrodes including a first pad disposed opposite the first surface of the mesh and extending in a first direction, a second pad disposed opposite the second surface of the mesh and extending in the first direction, and a post extending through the substrate between the first and second surfaces and connecting an end of the first pad to an end of the second pad.

Abstract: A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure-applying member, the pressure-applying member is caused to vibrate on a two-dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.

Abstract: A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure applying member, the pressure applying member is caused to vibrate on a two dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.

Abstract: A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20–60 ?m. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20-60 &mgr;m. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: The invention provides a heat-resistant, low-dielectric polymeric material that is preferably a copolymer in which a non-polar &agr;-olefin base polymer segment and a vinyl aromatic copolymer segment are chemically combined with each other, and that is a thermoplastic resin showing a multi-phase structure in which a dispersion phase formed by one segment is finely dispersed in a continuous phase formed by another segment. It is thus possible to achieve a polymeric material that is excellent in heat resistance, has high strength, and has a low dielectric constant and a reduced dielectric loss, and so is suitable for an electrical insulating material for high-frequency purposes.

Abstract: The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition.

Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A lead-free solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contains not more than about 60 wt % Bi; not more than about 50 wt % In; optionally at least one element selected from Ag, Zn, Ge, Ga, Sb, and P; and Sn. Also, lead-free solder powders containing same, and printed circuit boards, electronic components and electronic apparati employing such alloy.

Abstract: A drying device for worked metal parts which can prevent the worked metal parts from sticking to each other to efficiently dry the whole of the parts in a short time. The drying device includes a turntable rotatably mounted, a cage detachably mounted on the turntable for containing the worked metal parts, a driving device for rotating the turntable, magnets fixed to the turntable, and an air nozzle device for blowing air toward the cage.

Abstract: Resin compositions obtained by causing copolymerization of particular radical (co-and/or) polymerizable organic peroxide and vinyl monomer in particular propylene polymers and that it is a best way to use an aqueous suspension in the manufacture.

Abstract: Resin compositions obtained by causing copolymerization of particular radical polymerizable organic peroxide and vinyl monomer in an ethylene polymer and that it is a best way to use a water suspension in the manufacture.

Abstract: Resin compositions obtained by causing copolymerization obtained by causing copolymerization of particular radial (co-and/or) polymerizable organic peroxide and vinyl monomer in particular ethylene (co-and/or) polymers and that it is a best way to use a water suspension in the manufacture.

Abstract: A graft polymerization precursor is prepared through polymerization caused by impregnating an ethylene polymer with a vinyl monomer and a radical polymerizable PO, or a mixture of this graft polymerization precursor and an ethylene polymer and vinyl polymer, is kneaded in a molten state at 100.degree. to 300.degree. C. By so doing, a resin composition having a revolutionary high grafting efficiency can be obtained, so that secondary coagulation can be prevented.