Abstract: In at least outermost side circumferential grooves on outermost sides in a tire widthwise direction among a plurality of circumferential grooves of a tread, a plurality of ridge portions are formed in a spaced relation with each other in a tire circumferential direction such that the plurality of ridge portions project from a groove bottom of the outermost side circumferential grooves and cross the outermost side circumferential grooves, and at least one of the widthwise grooves on the shoulder land portions in shoulder regions among the plurality of land portions partitioned by the circumferential grooves has, on a groove bottom thereof, a widened groove portion having an increased groove width. Therefore, the pneumatic tire in which the shoulder land portions at which the tread is most deformable and most liable to generate heat can be cooled effectively to suppress the temperature rise.

Abstract: A vulcanization mold in which a blade has a blade proximal end portion, a blade distal end side thick portion expanded in a thicknesswise direction on the distal end side, and a blade connection portion that connects the portions to each other, is a vulcanization mold wherein a sweep area that is the difference where a cross sectional area of the blade connection portion is subtracted from an area from the blade distal end side thick portion to a mold surface with a width equal to a maximum width of a thickness of the blade distal end side thick portion in a cross sectional shape perpendicular to a tire widthwise direction of the blade is smaller at the blades in circumferential end portion side regions than at the blades in a circumferential central portion side region of the sector mold. Further, a pneumatic tire is manufactured using the vulcanization mold.

Abstract: A vulcanization mold including blades having a distal end side and pullout is performed smoothly without causing any failure and a pneumatic tire. A vulcanization mold in which a blade has a proximal end, a blade distal end side expanded in a thicknesswise direction on the distal end side, and a blade connection portion that connects the proximal end portion and the blade distal end side is a vulcanization mold in which a sweep area is the difference where a cross sectional area of the blade connection is subtracted from an area blade distal end side to a mold surface with a width equal to a maximum width of a thickness of the blade distal end side in a cross sectional shape perpendicular to a tire widthwise direction of the blade is smaller in circumferential end side regions than in a circumferential central side region of the sector mold.

Abstract: A vulcanization mold is a mold including blades having a distal end side thick portion and pullout is performed smoothly by the mold without causing any failure, and a pneumatic tire. A vulcanization mold in which a blade or has a blade proximal end portion, a blade distal end side thick portion expanded in a thicknesswise direction on the distal end side, and a blade connection portion that connects the blade proximal end portion and the blade distal end side thick portion to each other is a vulcanization mold in which a blade density that is a number of blades implanted on a sector mold per unit length in a circumferential direction is lower at the blades in circumferential end portion side regions than at the blades in a circumferential central portion side region of the sector mold. Further, a pneumatic tire is manufactured using the vulcanization mold.

Abstract: A protrusion portion of a pneumatic tire is formed by center side protrusion piece portions, and end side protrusion piece portions formed at a maximum width position of the tire. The protrusion portion is formed between an end portion in a tire width direction of a tread portion, which contacts a road surface, and a folded end of a carcass ply, in a tire radial direction. A height from a surface of a side wall of the end side protrusion piece portions is larger than a height form the surface of the side wall of the center side protrusion piece portions.

Abstract: A protrusion portion of a pneumatic tire is located between a maximum width position of the tire and an extension line of an inner side belt in a tire radial direction. The pneumatic tire includes an inflection point where a direction of bending deformation is changed when a load is applied to the tire. The inflection point is located between the maximum width position and the extension line. The protrusion portion is protruded toward an outer side in a tire width direction more than a surface of a side wall at the maximum width position and the protrusion portion includes a maximum protruded portion. The maximum protruded portion is arranged at a position corresponding to the inflection point in the tire radial direction.

Abstract: To provide a method for producing a polymer for semiconductor lithography which can attain high uniformity in the polymer from lot to lot. The method for producing a polymer for semiconductor lithography includes the step (P) of heating a polymerizable monomer and a polymerization initiator in a solvent, to thereby polymerize the monomer, the step (P) having the step of controlling a polymerization pressure by regulating a liquid level in a container (WO) which is disposed between a polymerization tank and the atmospheric air and which provides liquid sealing.

Abstract: An optical semiconductor device and optical semiconductor integrated circuit are provided by combining, on a semiconductor substrate, materials having different refractive indices and different temperature dependence of the refractive indices. In particular, it becomes possible to control the temperature dependence of the oscillation wavelength with a propagating region having a material and/or structure whose temperature dependence of the refractive index is different from that of a gain region of the semiconductor laser. In addition, they can be configured to have a plurality of interfaces formed along the waveguide direction of the optical waveguide so that the light reflected off the first interface is weakened by the light reflected from the remaining interfaces. Also, they can be configured with the interfaces inclined to the propagating direction so that the waveguide loss due to the reflection and refraction between the optical waveguides whose refractive indices differ from each other can be reduced.

Abstract: To provide a method for producing a polymer for semiconductor lithography which can attain high uniformity in the polymer from lot to lot. The method for producing a polymer for semiconductor lithography includes the step (P) of heating a polymerizable monomer and a polymerization initiator in a solvent, to thereby polymerize the monomer, the step (P) having the step of controlling a polymerization pressure by regulating a liquid level in a container (WO) which is disposed between a polymerization tank and the atmospheric air and which provides liquid sealing.

Abstract: An integrated optical waveguide has a first optical waveguide, a second optical waveguide, and a groove. The second optical waveguide is coupled to the first optical waveguide and has a refractive index that is different from the first optical waveguide. The groove is disposed so as to traverse an optical path of the first optical waveguide and is separated from an interface between the first optical waveguide and the second optical waveguide by a predetermined spacing. The spacing from the interface and the width of the groove are determined such that reflection at a boundary between the first optical waveguide and the second optical waveguide is weakened. A semiconductor board may be disposed at a boundary between the first optical waveguide and the second optical waveguide.

Abstract: An integrated optical waveguide has first, second, and third optical waveguiding regions. The second optical waveguiding region has a refractive index different from that of the first optical waveguiding region. The second optical waveguiding region has an interface surface with the first optical waveguiding region that is inclined with respect to the waveguide direction of the first optical waveguiding region. The third optical waveguiding region has an interface surface with the second optical waveguiding region that is disposed such that a refraction direction through the interface surface is in line with the waveguide direction.

Abstract: An integrated optical waveguide has a first optical waveguide, a second optical waveguide, and a groove. The second optical waveguide is coupled to the first optical waveguide and has a refractive index that is different from the first optical waveguide. The groove is disposed so as to traverse an optical path of the first optical waveguide and is separated from an interface between the first optical waveguide and the second optical waveguide by a predetermined spacing. The spacing from the interface and the width of the groove are determined such that reflection at a boundary between the first optical waveguide and the second optical waveguide is weakened. A semiconductor board may be disposed at a boundary between the first optical waveguide and the second optical waveguide.

Abstract: An integrated optical waveguide has first, second, and third optical waveguiding regions. The second optical waveguiding region has a refractive index different from that of the first optical waveguiding region. The second optical waveguiding region has an interface surface with the first optical waveguiding region that is inclined with respect to the waveguide direction of the first optical waveguiding region. The third optical waveguiding region has an interface surface with the second optical waveguiding region that is disposed such that a refraction direction through the interface surface is in line with the waveguide direction.

Abstract: An optical amplifier includes a first optical path, second optical path, semiconductor optical amplifier, and multi-mode interference 3-dB coupler. The first optical path guides oscillation light. The second optical path guides signal light. The semiconductor optical amplifier causes oscillation on the first optical path. The multi-mode interference 3-dB coupler crosses the first and optical paths in the gain medium of the semiconductor optical amplifier.

Abstract: An optical amplifier includes a first optical path, second optical path, semiconductor optical amplifier, and multi-mode interference 3-dB coupler. The first optical path guides oscillation light. The second optical path guides signal light. The semiconductor optical amplifier causes oscillation on the first optical path. The multi-mode interference 3-dB coupler crosses the first and optical paths in the gain medium of the semiconductor optical amplifier.

Abstract: The present invention is to provide a wavelength tunable DBR laser having the wider wavelength tuning characteristic, able to attain a 6 nm or more continuous wavelength shift and also higher in output power than a conventional wavelength tunable DBR laser. The DBR laser is constituted such that optical waveguides formed on a substrate, comprising an active region optical waveguide 22 having a light emitting function and passive region optical waveguides 23a and 23b provided on both ends of the active region 22, these passive region optical waveguides 23a and 23b have anterior and posterior DBR regions 24 and 29 with a wavelength tuning function, a posterior DBR region 29 is provided with a diffraction grating whose length is 95% or more in a saturated effective length value, and an anterior DBR region 24 whose length is shorter than the above length to take out the emitting light.

Abstract: An optical amplifier includes a first optical path, second optical path, semiconductor optical amplifier, and multi-mode interference 3-dB coupler. The first optical path guides oscillation light. The second optical path guides signal light. The semiconductor optical amplifier causes oscillation on the first optical path. The multi-mode interference 3-dB coupler crosses the first and optical paths in the gain medium of the semiconductor optical amplifier.

Abstract: An optical amplifier includes a first optical path, second optical path, semiconductor optical amplifier, and multi-mode interference 3-dB coupler. The first optical path guides oscillation light. The second optical path guides signal light. The semiconductor optical amplifier causes oscillation on the first optical path. The multi-mode interference 3-dB coupler crosses the first and optical paths in the gain medium of the semiconductor optical amplifier.

Abstract: A pressure sensor has a sensing unit and a pressure transmitting rod housed in a case, and a pressure receiving diaphragm. The case has a sensing unit housing portion and a pipe portion that extends from the sensing unit housing portion in a form of a pipe. The pipe portion includes an inner pipe and an outer pipe. The inner pipe is arranged inside the outer pipe and fixed to the outer pipe. The pipe portion has the first end located adjacent to the sensing unit and the second end away from the sensing unit. The inner pipe is projected from the outer pipe at the second end of the pipe portion. The pressure receiving diaphragm is welded to the inner pipe at the second end of the pipe portion such that it covers an opening of the inner pipe. The pressure transmitting rod is arranged inside the case such that its first end and second end are located on the sensing unit side and the pressure receiving diaphragm side, respectively.

Abstract: An optical amplifier includes a first optical path, second optical path, semiconductor optical amplifier, and multi-mode interference 3-dB coupler. The first optical path guides oscillation light. The second optical path guides signal light. The semiconductor optical amplifier causes oscillation on the first optical path. The multi-mode interference 3-dB coupler crosses the first and optical paths in the gain medium of the semiconductor optical amplifier.