Abstract: Provided is a laminated iron core in which joining failure between adjacent steel sheets thereof is less likely to occur, even if a distance between the adjacent steel sheets (thickness of an adhesive layer) is reduced. 1. The laminated iron core comprises a plurality of steel sheets laminated together while an adhesive layer is interposed between any adjacent two of the steel sheets, wherein the adhesive layer is comprised of a thermosetting resin composition containing an epoxy resin, an amino triazine novolac-based phenolic resin, an acrylic acid ester-based polymer, and inorganic particles having an average particle size of 10 nm to 100 nm, and a maximum particle size of 1 ?m or less, and wherein: the content in volume percentage of the inorganic particles in the adhesive layer is from 5 vol % to 30 vol %; the adhesive layer having a Young's modulus of 2 GPa to 6 GPa as measured at 25° C. by a nanoindentation technique; and a distance between the adjacent steel sheets being from 0.5 ?m to 5 ?m.

Abstract: A paste-like adhesive composition of the present invention contains metal particles (A) and a thermally polymerizable compound (B), in which the metal particles (A) form a particle coupling structure by causing sintering through a thermal treatment; when dynamic viscoelasticity of the composition is measured under a condition of a measurement frequency of 1 Hz, within a temperature region of 140° C. to 180° C., the composition has a temperature width of equal to or larger than 10° C. in which a shear modulus of elasticity is equal to or higher than 5,000 Pa and equal to or lower than 100,000 Pa; and an acetone insoluble fraction of a sample, which is obtained by removing the metal particles (A) and then heating the composition under conditions of 180° C. and 2 hours, is equal to or lower than 5% by weight.

Abstract: A paste-like adhesive composition of the present invention contains metal particles (A) and a thermally polymerizable compound (B), in which the metal particles (A) form a particle coupling structure by causing sintering through a thermal treatment; when dynamic viscoelasticity of the composition is measured under a condition of a measurement frequency of 1 Hz, within a temperature region of 140° C. to 180° C., the composition has a temperature width of equal to or larger than 10° C. in which a shear modulus of elasticity is equal to or higher than 5,000 Pa and equal to or lower than 100,000 Pa; and an acetone insoluble fraction of a sample, which is obtained by removing the metal particles (A) and then heating the composition under conditions of 180° C. and 2 hours, is equal to or lower than 5% by weight.

Abstract: A thermally conductive composition of the present invention contains metal particles (A) and a dispersion medium (B) in which the metal particles (A) are dispersed, wherein the metal particles (A) form a particle coupling structure by being sintered through a thermal treatment, the metal particles (A) have a particle size D50 at 50% in a volume-based cumulative distribution of equal to or greater than 0.8 ?m and equal to or smaller than 5 ?m, and the metal particles (A) have a standard deviation of the particle size of equal to or less than 2.0 ?m.

Abstract: According to the present invention, a semiconductor having excellent yield is provided. The semiconductor device (10) of the present invention includes: a base material (die pad) (2), a semiconductor element (3), and an adhesive layer (1) intervening the space between the base material and the semiconductor element (3) to adhere the base material and the semiconductor element. Thermal conductive filler (8) is contained in the adhesive layer (1), and when the content of the thermal conductive filler dispersed in the whole of the adhesive layer is expressed as C, the content of the thermal conductive filler in the region 1 ranging from the interface of the adhesive layer at the side of the semiconductor element to the depth by 2 ?m is expressed as C1, and the content of the thermal conductive filler in the region 2 ranging from the interface of the adhesive layer at the side of the base material to the depth by 2 ?m is expressed as C2, the following formulae are satisfied: C1<C, and C2<C.

Abstract: According to the present invention, a semiconductor having excellent yield is provided. The semiconductor device (10) of the present invention includes: a base material (die pad) (2), a semiconductor element(3), and an adhesive layer(1) intervening the space between the base material and the semiconductor element (3) to adhere the base material and the semiconductor element. Thermal conductive filler (8) is contained in the adhesive layer (1), and when the content of the thermal conductive filler dispersed in the whole of the adhesive layer is expressed as C, the content of the thermal conductive filler in the region 1 ranging from the interface of the adhesive layer at the side of the semiconductor element to the depth by 2 ?m is expressed as C1, and the content of the thermal conductive filler in the region 2 ranging from the interface of the adhesive layer at the side of the base material to the depth by 2 ?m is expressed as C2, the following formulae are satisfied: C1<C, and C2<C.

Abstract: According to the present invention, a resin composition having superior workability is provided. The paste-like resin composition of the present invention adheres a semiconductor element and a base material, and contains (A) a thermosetting resin and (B) metal particles. d95 in the volume-based particle size distribution of the metal particles as determined with a flow-type particle image analyzer is 10 ?m or less. In other words, the volume ratio of metal particles having a particle diameter that exceeds 10 ?m is less than 5%. Here, d95 indicates the particle diameter at which the cumulative volume ratio thereof is 95%.

Abstract: The object of the invention is to provide an optical material serving as a glass substitute, showing high light transmissivity in a broad wavelength range and capable of being adequately used in producing transparent sheets, optical lenses, liquid crystal display element plastic substrates, color filter substrates, organic EL display element plastic substrates, solar cell substrates, touch panels, optical elements, optical waveguides and LED sealants, among others, by using ordinary glass fillers. The above optical material can be obtained from a transparent composite composition which comprises a transparent resin and a glass filler and in which the transparent resin has an Abbe number of not smaller than 45.

Abstract: A transparent composite composition is provided which is low in coefficient of linear expansion and excellent in transparency, heat resistance and solvent resistance and can serve as an optical sheet for a liquid crystal display device or organic EL display device, for instance and can thus serve as a glass substitute. The transparent composite composition has a transparent resin (a) and a glass filler (b), and the transparent resin (a) is a copolymer obtained from at least one reactive monomer lower in refractive index than the glass filler (b) and at least one reactive monomer higher in refractive index than the glass filler (b).

Abstract: The object of the invention is to provide an optical material serving as a glass substitute, showing high light transmissivity in a broad wavelength range and capable of being adequately used in producing transparent sheets, optical lenses, liquid crystal display element plastic substrates, color filter substrates, organic EL display element plastic substrates, solar cell substrates, touch panels, optical elements, optical waveguides and LED sealants, among others, by using ordinary glass fillers. The above optical material can be obtained from a transparent composite composition which comprises a transparent resin and a glass filler and in which the transparent resin has an Abbe number of not smaller than 45.

Abstract: A transparent composite composition is provided which is low in coefficient of linear expansion and excellent in transparency, heat resistance and solvent resistance and can serve as an optical sheet for a liquid crystal display device or organic EL display device, for instance and can thus serve as a glass substitute.