Abstract: An image pickup apparatus comprising a plurality of image pickup portions for receiving different wavelength components of object light, and a plurality of optical systems for guiding the object light to the plurality of image pickup portions, respectively, each of the plurality of optical systems having a filtering function whose transmission factor becomes smaller as the distance from an optical axis thereof becomes longer.

Abstract: An image pickup apparatus is provided having first and second image pickup portions for receiving at least first and second distinct wavelength components of object light, respectively, and first and second optical systems for guiding the first and second wavelength components to the first and second image pickup portions, respectively, via different optical paths. The first and second optical systems are formed to have respective shapes so that the focal length of the first optical system with regard to the first wavelength component is equal to the focal length of the second optical system with regard to the second wavelength component.

Abstract: An image pickup apparatus comprises a plurality of openings for taking in external light at different positions, a filter(s) for extracting from external light taken in from the plurality of openings, predetermined wavelength components of subject light correspondingly to the plurality of openings, respectively, and a plurality of image pickup portions for receiving the predetermined wavelength components extracted by the filter correspondingly to the plurality of openings, respectively.

Abstract: An image pickup apparatus comprising a plurality of image pickup portions for receiving different wavelength components of object light, and a plurality of integrally formed optical systems for guiding the object light to the plurality of image pickup portions, respectively, the plurality of integrally formed optical systems being constructed so as to satisfy the following relation: 2×A×(&agr;L−0.26×10−5)×20 <½P wherein &agr;L is the coefficient of linear expansion and A is the interval between object images formed by the plurality of image pickup portions.

Abstract: An image taking apparatus which can perform a focusing operation quickly is described. The image taking apparatus comprises a light splitting unit which splits a light flux from the image-taking lens into a plurality of light fluxes, a view finder optical system for observing an object image formed by the light flux from the image-taking lens, an image pickup element which photoelectrically converts the object image to an electric signal and a focus detection unit for detecting the focusing state of the image-taking lens according to a phase difference detection system. Here, the light splitting unit changes between a first state in which the light flux is directed to the view finder optical system and the focus detection unit and a second state in which the light flux is directed to the image pickup element and the focus detection unit.

Abstract: It is an object of this invention to realize an image sensing apparatus which satisfies both the requirements for focus detection performance and high-resolution, high image quality. In order to achieve this object, there is provided an image sensing apparatus characterized by comprising an image sensing device having a plurality of pixels, an optical element array having a plurality of optical elements made to correspond one by one to each set of a plurality number of pixels of a plurality of pixels of the image sensing device, and a focusing device which generates, for each of the plurality of optical elements, one pair of focus detection signals in the pixels from light passing through the optical element, and performs focusing operation on the basis of focus detection signals generated in pairs for each of the optical elements.

Abstract: A semiconductor device formed by cutting a first substrate and a second substrate bonded together by a spacer, wherein: the spacer is disposed at an end of the first substrate after cutting; the second substrate is a semiconductor wafer formed with a light reception element or elements; and the first substrate has an optical element or an optical element set for converging light on the light reception element or elements. A method of manufacturing such a semiconductor device. A semiconductor device manufacture method includes: a step of detecting a warp of a semiconductor substrate; a step of holding the semiconductor substrate on a base under a condition that the warp is removed; a step of bonding an opposing substrate to the semiconductor substrate; and a step of cutting the opposing substrate, wherein the opposing substrate bonded to the semiconductor substrate is set with a size corresponding to the warp of the semiconductor substrate or with a gap to an adjacent opposing substrate.

Abstract: The invention provides an image pickup module comprising a semiconductor chip including a photosensor array, and an optical element for guiding light to the photosensor array, wherein the optical element includes a imaging unit and a light shielding layer, and adhesive is formed in a position between the semiconductor chip and the optical element but excluding the position of the light shielding layer in the incident direction of light, and the optical element and the semiconductor chip are fixed across the adhesive. The invention also provides an image pickup module comprising an optical element provided on a semiconductor chip, wherein the optical element includes a first lens and a second lens which is provided corresponding to the first lens.

Abstract: A semiconductor device formed by cutting a first substrate and a second substrate bonded together by a spacer, wherein: the spacer is disposed at an end of the first substrate after cutting; the second substrate is a semiconductor wafer formed with a light reception element or elements; and the first substrate has an optical element or an optical element set for converging light on the light reception element or elements. A method of manufacturing such a semiconductor device. A semiconductor device manufacture method includes: a step of detecting a warp of a semiconductor substrate; a step of holding the semiconductor substrate on a base under a condition that the warp is removed; a step of bonding an opposing substrate to the semiconductor substrate; and a step of cutting the opposing substrate, wherein the opposing substrate bonded to the semiconductor substrate is set with a size corresponding to the warp of the semiconductor substrate or with a gap to an adjacent opposing substrate.

Abstract: In a focus detecting device of the type in which light fluxes passing through two areas obtained by dividing a pupil of an image forming lens are received by a sensor to detect a phase difference, pixels of the sensor are disposed in such a manner that the sensor has the light-receiving sensitivity in different directions with respect to the luminance distribution, and the phase-difference detection and the contrast detection are performed according to the direction of the light-receiving sensitivity so as to perform appropriate focus detection.

Abstract: A focus state detection apparatus for detecting focus state on the basis of signals outputted from a pair of area sensors each of which is configured in two dimension in accordance with an image of an object passing through an optical system and formed on the pair of area sensors. Each of the pair of area sensors is divided into a plurality of areas each of which can be controlled independently, and charging pixels of the area sensors is controlled by each pair of corresponding divided areas of the area sensors.

Abstract: An image pickup apparatus, which comprises a plurality of photoelectric conversion areas, and a light adjustment area including a first transmission portion for transmitting light which is provided in association with a first photoelectric conversion area included in the plurality of photoelectric conversion areas and a second transmission portion for transmitting light which is provided in association with a second photoelectric conversion area included in the plurality of photoelectric conversion areas, wherein the light adjustment area is configured to cause a part of light incident on the second transmission portion to be incident on the first transmission portion.

Abstract: A semiconductor device formed by cutting a first substrate and a second substrate bonded together by a spacer, wherein: the spacer is disposed at an end of the first substrate after cutting; the second substrate is a semiconductor wafer formed with a light reception element or elements; and the first substrate has an optical element or an optical element set for converging light on the light reception element or elements. A method of manufacturing such a semiconductor device. A semiconductor device manufacture method includes: a step of detecting a warp of a semiconductor substrate; a step of holding the semiconductor substrate on a base under a condition that the warp is removed; a step of bonding an opposing substrate to the semiconductor substrate; and a step of cutting the opposing substrate, wherein the opposing substrate bonded to the semiconductor substrate is set with a size corresponding to the warp of the semiconductor substrate or with a gap to an adjacent opposing substrate.

Abstract: This invention has as its object to provide an image sensing apparatus which can satisfactorily correct misregistration among images, and can composite the images. To achieve this object, an image sensing apparatus includes: a plurality of apertures that receives external light from different positions; a plurality of image sensing units that outputs image signals obtained by independently receiving light that comes from an identical position of an object and is received via the plurality of apertures, and independently extracting predetermined color components for each received light; and a signal processing device that forms a signal that outputs an object image by mixing the image signals output from the plurality of image sensing units.

Abstract: It is an object of this invention to provide an image sensing apparatus capable of forming a high-resolution image by increasing the number of final output pixels. To achieve this object, a digital color camera has a plurality of image sensing units for receiving object images via different apertures. These image sensing units are so arranged that images of an object at a predetermined distance are received as they are shifted a predetermined amount from each other in at least the vertical direction. Further, these image sensing units have filters having different spectral transmittance characteristics.

Abstract: A focus state detection apparatus for detecting focus state on the basis of signals outputted from a pair of area sensors each of which is configured in two dimension in accordance with an image of an object passing through an optical system and formed on the pair of area sensors. Each of the pair of area sensors is divided into a plurality of areas each of which can be controlled independently, and charging pixels of the area sensors is controlled by each pair of corresponding divided areas of the area sensors.

Abstract: A thin viewfinder device includes, in order an object side to a viewing eye side, a first prism, and a second prism disposed separately from the first prim across an air gap. The first prism, the air gap and the second prism are arranged in such a manner that an object light flux obtained within a viewing field passes through the first prism, the air gap and the second prism so as to reach the viewing eye, while an object light flux obtained outside the viewing field is totally reflected by surfaces of the first prism so as to be prevented from reaching the viewing eye.

Abstract: In a focus detecting device of the type in which light fluxes passing through two areas obtained by dividing a pupil of an image forming lens are received by a sensor to detect a phase difference, pixels of the sensor are disposed in such a manner that the sensor has the light-receiving sensitivity in different directions with respect to the luminance distribution, and the phase-difference detection and the contrast detection are performed according to the direction of the light-receiving sensitivity so as to perform appropriate focus detection.

Abstract: An optical apparatus includes a projecting optical system for projecting an image of an object in a viewfield onto an image receiving surface. First detecting structure is provided for detecting which position is viewed in the viewfield. Second detecting structure is provided for detecting a defocus for the image receiving surface of the image of the object. Optical system driving structure is provided for driving a portion of the projecting optical system according to the defocus detected by the second detecting structure. A processor is provided for causing the detection by said second detecting structure and the drive by said optical system driving structure to be repeated until the image of the object is focused on the image receiving surface.

Abstract: A camera which uses exchangeable photographing lenses, and is capable of focus detection using a plurality of focus areas, includes a memory for storing information pertaining to the number of focus areas that can be used in focus detection in units of mountable photographing lenses, and a microprocessor for controlling focus detection on the basis of information corresponding to the photographing lens mounted, of the information stored in the memory.