Patents by Inventor Yasuo Sugimori

Yasuo Sugimori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110014957
    Abstract: The invention provides a headset which has a service environment adaptability. The headset 1 has: a first microphone 3 which picks up a voice sound emitted from the mouth; an earphone/microphone unit 5 in which a built-in speaker 4 functions also as a second microphone which picks up a voice sound generated in the ear; and a mode switchover switch circuit 41 which switches over between a first call mode where the first microphone 3 and a speaker function of the earphone/microphone unit 5 are caused to operate, and a second call mode where a microphone function and speaker function of the earphone/microphone unit 5 are caused to operate.
    Type: Application
    Filed: July 8, 2010
    Publication date: January 20, 2011
    Applicant: HOSIDEN CORPORATION
    Inventors: Yasuo Sugimori, Yasuhiro Shigeno
  • Patent number: 7564985
    Abstract: A substrate having a metal capsule which has an open end caulked to a planar periphery portion and in which an electric apparatus is accommodated includes a substrate main body having a planar central projecting portion consisting of a resin material and a step provided on a side of the flat plate portion located opposite a mounted surface side, an annular metal member which is located between a peripheral part of the central projecting portion and a flat plate portion and which is partly exposed toward the mounted surface side like a flange, a plurality of external terminals provided on the mounted surface of the central projecting portion, a metal coat connected to the annular metal member and to at least one of the external terminals and formed along an outer surface of the central projecting portion, a plurality of internal terminals provided on an inner surface of the substrate main body located opposite the mounted surface side, ground through-holes formed in a planar peripheral portion at a position wh
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: July 21, 2009
    Assignee: Hosiden Corporation
    Inventors: Akira Yamamoto, Yasuo Sugimori
  • Patent number: 7430915
    Abstract: A vibration sensor capable of preventing a diaphragm electrode from being damaged without lowering sensitivity as well as realizing a satisfactory assembling process. The vibration sensor includes a fixed electrode 1, and a diaphragm electrode 3 having a weight member 2 attached to a membrane surface facing away from the fixed electrode 1 and fixedly supported at peripheries thereof, the vibration sensor being capable of outputting variation of capacitance between the fixed electrode and the diaphragm electrode as vibration signals. The vibration sensor further includes projecting portions 2a formed on parts of an end portion of the weight member 2 to project along the direction of the membrane surface and spaced from the membrane surface of the diaphragm electrode 3, and a restricting member 4 for contacting the projecting portions 2a of the weight member 2 displaced along the direction of the membrane surface of the diaphragm electrode 3, thereby to restrict displacement of the weight member 2.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: October 7, 2008
    Assignee: Hosiden Corporation
    Inventors: Mamoru Yasuda, Yasuo Sugimori, Takahisa Ohtsuji
  • Publication number: 20080190203
    Abstract: A signal amplifying circuit having a small-scaled circuit arrangement and exhibiting a low power consumption is provided without degrading the detection precision of an electrostatic capacity detecting element. A signal amplifying circuit comprising an AC-coupled amplifier; a voltage generating circuit for generating a DC bias voltage that is a reference of AC coupling; and a conveying means for conveying the bias voltage to the amplifier; wherein a very small voltage signal outputted by an electrostatic capacity detecting element is superimposed, as an AC component, on the bias voltage and then amplified. The signal amplifying circuit having the structure described above is characterized in that it is configured such that the input impedance of the conveying means seen from the electrostatic capacity detecting element is higher than the output impedance of the electrostatic capacity detecting element.
    Type: Application
    Filed: September 14, 2005
    Publication date: August 14, 2008
    Applicant: HOSIDEN CORPORATION
    Inventor: Yasuo Sugimori
  • Publication number: 20080137885
    Abstract: An electret condenser microphone is configured such that a substrate 12 and components stacked on the substrate 12 are fixed in a capsule 2 shaped like a cylinder. The electret condenser microphone includes a top plate 30 having sound holes 31, terminal electrode patterns 11 are provided on the substrate 12, the capsule 2 includes an inner flange portion 21 stretching to the inside of the electret condenser microphone and a curled portion 13 bent inward, the substrate 12 is positioned at the inner flange portion 21, the terminal electrode patterns 11 protrude outside the inner flange portion 21, and the top plate 30 is positioned at the curled portion 13.
    Type: Application
    Filed: April 11, 2006
    Publication date: June 12, 2008
    Applicant: Hosiden Corporation
    Inventors: Akira Yamamoto, Shinichi Saeki, Yasuo Sugimori
  • Patent number: 7352873
    Abstract: An electret-condenser microphone according to the present invention includes a vibrating diaphragm and a back electrode which compose a condenser; a cylindrical case which houses the vibrating diaphragm and the back electrode; a circuit board which is housed in an opening of the cylindrical case, is fixed to the opening by crimping a crimp edge formed by bending an opening end of the cylindrical case inward, and covers the opening; and a substrate fastened to an outer surface of the circuit board. A circular pattern and annular pattern are formed on the outer surface of the circuit board and a circular pattern and annular pattern are formed on that surface of the substrate which is farther from the circuit board. The circular pattern and annular pattern are connected with the circular pattern and annular pattern via thru-holes in the substrate, and that surface of the substrate on which and are formed serves as a reflow-soldering surface.
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: April 1, 2008
    Assignee: Hosiden Corporation
    Inventors: Yasuhiro Shigeno, Mamoru Yasuda, Yasuo Sugimori, Naoki Toyoda
  • Patent number: 7223136
    Abstract: A substrate is obtained as follows. A structure is formed using a metal plate for a lead frame on which terminals and connection portions are formed; the terminals are exposed from either a front or back surface and the connection portions connect the terminals together. A resin is then used to make the structure hard. The height of a step in a central step portion is variable. The resin is one of PA6T, PPS, and LCP, all of which are resistant to heat. A step portion can be obtained which projects from a bottom surface of a circuit substrate. The circuit substrate is inexpensively obtained.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: May 29, 2007
    Assignee: Hosiden Corporation
    Inventors: Akira Yamamoto, Yasuo Sugimori
  • Publication number: 20070107521
    Abstract: In a vibration sensor for outputting, as vibration signals, variations of capacitance between a fixed electrode and a diaphragm 3 electrode opposed thereto, the diaphragm electrode 3 has slits 3a formed in the same plate member to define a diaphragm portion 3b positioned centrally to be vibrated and displace only by gravity, a fixed portion 3c positioned peripherally, and elastic support portions 3d for connecting the diaphragm portion 3b to the fixed portion 3c.
    Type: Application
    Filed: September 8, 2004
    Publication date: May 17, 2007
    Applicant: HOSIDEN CORPORATION
    Inventors: Mamoru Yasuda, Yasuo Sugimori
  • Patent number: 7194905
    Abstract: A three-axis acceleration sensor having a simple construction is provided for improving shock resistance without lowering sensor sensitivity. An acceleration sensor for detecting acceleration in three orthogonal directions comprises an electrode substrate pair including electrode substrates (4) opposed to each other, and each having fixed electrodes (4c, 4b, 4a) corresponding to three axes, respectively, a diaphragm (2) acting as a movable electrode, and an umbrella-like weight (3) mounted centrally of the diaphragm (2). Acceleration is detected based on variations in capacitance between the fixed electrodes (4c, 4b, 4a) and diaphragm (2). Each electrode substrate (4) has an electret layer (1) formed to cover surfaces of the fixed electrodes (4c, 4b, 4a). At least one of the electrode substrates defines, centrally thereof, a through hole (7). A shaft portion of the umbrella-like weight (3) extends through the through hole (7) from outside, and is connected to the diaphragm (2).
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: March 27, 2007
    Assignee: Hosiden Corporation
    Inventors: Akira Yamamoto, Yasuo Sugimori
  • Publication number: 20060205244
    Abstract: An electret-condenser microphone according to the present invention includes a vibrating diaphragm and a back electrode which compose a condenser; a cylindrical case which houses the vibrating diaphragm and the back electrode; a circuit board which is housed in an opening of the cylindrical case, is fixed to the opening by crimping a crimp edge formed by bending an opening end of the cylindrical case inward, and covers the opening; and a substrate fastened to an outer surface of the circuit board. A circular pattern and annular pattern are formed on the outer surface of the circuit board and a circular pattern and annular pattern are formed on that surface of the substrate which is farther from the circuit board. The circular pattern and annular pattern are connected with the circular pattern and annular pattern via thru-holes in the substrate, and that surface of the substrate on which and are formed serves as a reflow-soldering surface.
    Type: Application
    Filed: April 25, 2005
    Publication date: September 14, 2006
    Inventors: Yasuhiro Shigeno, Mamoru Yasuda, Yasuo Sugimori, Naosuke Fukada
  • Publication number: 20060150739
    Abstract: In a vibration sensor 1 comprising a diaphragm electrode 3 having weights 7a and 7b attached to opposite surfaces thereof, a first fixed electrode 2a opposed to one surface of the diaphragm electrode 3 and a second fixed electrode 2b opposed to the other surface of the diaphragm electrode 3, the vibration sensor 1 outputs vibration signals based on signals obtained from variations of capacitance between the first fixed electrode 2a and the diaphragm electrode 3 and signals obtained from variations of capacitance between the second fixed electrode 2b and the diaphragm electrode 3.
    Type: Application
    Filed: September 8, 2004
    Publication date: July 13, 2006
    Applicant: HOSIDEN CORPORATION
    Inventors: Mamoru Yasuda, Yasuo Sugimori
  • Publication number: 20060137455
    Abstract: The present invention provides a vibration sensor capable of preventing a diaphragm electrode from being damaged without lowering sensitivity as well as realizing a satisfactory assembling process. The vibration sensor comprises a fixed electrode 1, and a diaphragm electrode 3 having a weight member 2 attached to a membrane surface facing away from the fixed electrode 1 and fixedly supported at peripheries thereof, the vibration sensor being capable of outputting variation of capacitance between the fixed electrode and the diaphragm electrode as vibration signals.
    Type: Application
    Filed: August 31, 2004
    Publication date: June 29, 2006
    Applicant: Hosiden Corporation
    Inventors: Mamoru Yasuda, Yasuo Sugimori, Takahisa Ohtsuji
  • Publication number: 20060104468
    Abstract: A substrate having a metal capsule which has an open end caulked to a planar periphery portion and in which an electric apparatus is accommodated includes a substrate main body having a planar central projecting portion consisting of a resin material and a step provided on a side of the flat plate portion located opposite a mounted surface side, an annular metal member which is located between a peripheral part of the central projecting portion and a flat plate portion and which is partly exposed toward the mounted surface side like a flange, a plurality of external terminals provided on the mounted surface of the central projecting portion, a metal coat connected to the annular metal member and to at least one of the external terminals and formed along an outer surface of the central projecting portion, a plurality of internal terminals provided on an inner surface of the substrate main body located opposite the mounted surface side, ground through-holes formed in a planar peripheral portion at a position wh
    Type: Application
    Filed: November 10, 2005
    Publication date: May 18, 2006
    Applicant: Hosiden Corporation
    Inventors: Akira Yamamoto, Yasuo Sugimori
  • Publication number: 20060093168
    Abstract: A substrate is obtained as follows. A structure is formed using a metal plate for a lead frame on which terminals and connection portions are formed; the terminals are exposed from either a front or back surface and the connection portions connect the terminals together. A resin is then used to make the structure hard. The height of a step in a central step portion is variable. The resin is one of PA6T, PPS, and LCP, all of which are resistant to heat. A step portion can be obtained which projects from a bottom surface of a circuit substrate. The circuit substrate is inexpensively obtained.
    Type: Application
    Filed: October 28, 2005
    Publication date: May 4, 2006
    Applicant: Hosiden Corporation
    Inventors: Akira Yamamoto, Yasuo Sugimori
  • Publication number: 20060053888
    Abstract: A three-axis acceleration sensor having a simple construction is provided for improving shock resistance without lowering sensor sensitivity. An acceleration sensor for detecting acceleration in three orthogonal directions includes an electrode substrate (5) having fixed electrodes corresponding to three axes, respectively, a diaphragm (2) having one surface thereof opposed to the fixed electrodes acting as a movable electrode, and a weight (1) mounted centrally of the other surface of the diaphragm. Acceleration is detected based on variations in capacitance between the fixed electrodes and diaphragm (2). The electrode substrate (5) has an electret layer (4) formed to cover surfaces of the fixed electrodes.
    Type: Application
    Filed: September 12, 2005
    Publication date: March 16, 2006
    Applicant: HOSIDEN CORPORATION
    Inventors: Yasuo Sugimori, Naoki Toyota
  • Publication number: 20060053889
    Abstract: A three-axis acceleration sensor having a simple construction is provided for improving shock resistance without lowering sensor sensitivity. An acceleration sensor for detecting acceleration in three orthogonal directions comprises an electrode substrate pair including electrode substrates (4) opposed to each other, and each having fixed electrodes (4c, 4b, 4a) corresponding to three axes, respectively, a diaphragm (2) acting as a movable electrode, and an umbrella-like weight (3) mounted centrally of the diaphragm (2). Acceleration is detected based on variations in capacitance between the fixed electrodes (4c, 4b, 4a) and diaphragm (2). Each electrode substrate (4) has an electret layer (1) formed to cover surfaces of the fixed electrodes (4c, 4b, 4a). At least one of the electrode substrates defines, centrally thereof, a through hole (7). A shaft portion of the umbrella-like weight (3) extends through the through hole (7) from outside, and is connected to the diaphragm (2).
    Type: Application
    Filed: September 12, 2005
    Publication date: March 16, 2006
    Applicant: HOSIDEN CORPORATION
    Inventors: Akira Yamamoto, Yasuo Sugimori
  • Publication number: 20050066736
    Abstract: A vibration membrane is formed by a laminate consisting of a piezoelectric film on both surfaces of which electrode coats are formed respectively and a soft sheet on both surfaces of which metal coats are formed respectively, and a weight is mounted on one of the surfaces of the vibration membrane. A pair of frame-like elements is provided to support the peripheral portion of the vibration membrane on each side by one frame-like element. The peripheral portion of the vibration membrane is supported by the pair of frame-like elements by accommodating the vibration membrane and the frame-like elements in a casing one end of which is open and closing the open end of the casing by a board.
    Type: Application
    Filed: September 23, 2004
    Publication date: March 31, 2005
    Inventors: Yoshiaki Ohbayashi, Mamoru Yasuda, Yasuo Sugimori