Abstract: A component mounting system includes a component mounter that mounts a component in a board, a tape feeder (component feeder) that is placed in the component mounter and supplies the component, and a mobile component supply device that holds a tape cassette (container) storing a component, automatically moves, and supplies the component in the tape cassette (container) to the tape feeder (component feeder).

Abstract: A feeder exchanging carriage includes a reel holder which holds a reel on which a carrier tape which stores electronic components is wound, a feeder holder which holds a tape feeder which performs a feeding operation of the carrier tape, and a base unit which is provided with a pair of front wheels and a pair of rear wheels, and a telescopic unit (a front base and a rear base) which expands and contracts an interval between the pair of front wheels and the pair of rear wheels. In a state where the feeder exchanging carriage is mounted to an electronic component mounter, the interval between the front and rear wheels is contracted by the telescopic unit, and in a state where the feeder exchanging carriage is not mounted to an electronic component mounter, the interval between the front and rear wheels is expanded by the telescopic unit.

Abstract: According to a tape feeder of the present disclosure, a tape pressing member pressing a part which engages with an outer peripheral tooth of a sprocket in a carrier tape from above is connected to a main body by a connection mechanism. The connection mechanism is configured to move the entirety of the tape pressing member in a manner parallel to the main body in a case where a portion of the tape pressing member moves in a vertical direction with respect to the main body.

Abstract: According to the present disclosure, a tape feeder includes a main body that is attached to a component mounter and has a tape traveling path which is a traveling path of a carrier tape; and a sprocket that is provided in the main body, causes an outer peripheral tooth to engage with a feed hole of the carrier tape, and rotates so as to perform pitch feeding of the carrier tape on the tape traveling path. The tape feeder includes a lock mechanism that has a press operation unit operated with pressing force, locks the sprocket in the main body in a state where the press operation unit is not operated, and unlocks the sprocket in a state where the press operation unit is operated.

Abstract: In a tape feeder which serves as a component supply device which is used for supplying components in a component mounter, a first unit which serves as a tape feed unit which pitch feeds a carrier tape which holds components to a component suction position using a pitch feeding sprocket drive mechanism, and a third unit and a second unit which serve as a tape supply unit which is attachable and detachable in relation to the tape feed unit and which supplies the carrier tape to the tape feed unit are selectively used according to the supply mode of the carrier tape to be used.

Abstract: A component mounting system includes a component mounter that mounts a component in a board, a tape feeder (component feeder) that is placed in the component mounter and supplies the component, and a mobile component supply device that holds a tape cassette (container) storing a component, automatically moves, and supplies the component in the tape cassette (container) to the tape feeder (component feeder).

Abstract: In a tape feeder which serves as a component supply device which is used for supplying components in a component mounter, a first unit which serves as a tape feed unit which pitch feeds a carrier tape which holds components to a component suction position using a pitch feeding sprocket drive mechanism, and a third unit and a second unit which serve as a tape supply unit which is attachable and detachable in relation to the tape feed unit and which supplies the carrier tape to the tape feed unit are selectively used according to the supply mode of the carrier tape to be used.

Abstract: A feeder exchanging carriage includes a reel holder which holds a reel on which a carrier tape which stores electronic components is wound, a feeder holder which holds a tape feeder which performs a feeding operation of the carrier tape, and a base unit which is provided with a pair of front wheels and a pair of rear wheels, and a telescopic unit (a front base and a rear base) which expands and contracts an interval between the pair of front wheels and the pair of rear wheels. In a state where the feeder exchanging carriage is mounted to an electronic component mounter, the interval between the front and rear wheels is contracted by the telescopic unit, and in a state where the feeder exchanging carriage is not mounted to an electronic component mounter, the interval between the front and rear wheels is expanded by the telescopic unit.

Abstract: According to a tape feeder of the present disclosure, a tape pressing member pressing a part which engages with an outer peripheral tooth of a sprocket in a carrier tape from above is connected to a main body by a connection mechanism. The connection mechanism is configured to move the entirety of the tape pressing member in a manner parallel to the main body in a case where a portion of the tape pressing member moves in a vertical direction with respect to the main body.

Abstract: According to the present disclosure, a tape feeder includes a main body that is attached to a component mounter and has a tape traveling path which is a traveling path of a carrier tape; and a sprocket that is provided in the main body, causes an outer peripheral tooth to engage with a feed hole of the carrier tape, and rotates so as to perform pitch feeding of the carrier tape on the tape traveling path. The tape feeder includes a lock mechanism that has a press operation unit operated with pressing force, locks the sprocket in the main body in a state where the press operation unit is not operated, and unlocks the sprocket in a state where the press operation unit is operated.

Abstract: An automatic pallet exchange device includes: a pallet magazine 1 that accommodates a plurality of pallets 3 respectively having a plurality of horizontally extending protrusions 16 so as to be taken in and out in horizontal directions; a pallet fixing part 23 that allows the plurality of protrusions 16 to be engaged with a plurality of depression parts 17 to horizontally fix the pallet 3 and a pallet fixing table 20 on which the pallet fixing part 23 is arranged. The pallet 3 horizontally fixed by the pallet fixing part 23 is horizontally turned and horizontally moved to exchange the pallets 3 between the pallet fixing table 20 and the pallet magazine 1.

Abstract: To provide a chip supply pallet preventing destruction of a chip and preventing a reduction in a productivity from being brought about in exchanging a wafer sheet, the chip supply pallet includes a first member 33 having a tension ring 51 brought into contact with a wafer sheet from a lower side, and a fixing member 54 of fixing a ring frame holding the wafer sheet on an inner side on a lower side of the wafer sheet brought into contact with the tension ring 51, and a second member 34 having a fixed portion for fixing to a predetermined position of a chip supply apparatus and a held portion 36 of being held when the chip interchanging pallet 3 is transferred, and the first member 33 is configured to be able to rotationally displace relative to the second member 34 fixed to the predetermined position of the chip supply apparatus.

Abstract: In a chip mounting apparatus, a structure is employed that a separation facilitation head keeping part is provided for detachably keeping a plurality kinds of separation facilitation heads in a wafer ring holding part and a chip separation facilitation unit is allowed to access to the separation facilitation head keeping part by a moving mechanism to automatically carry out a changing operation for changing the separation facilitation head between the separation facilitation head keeping part and a separation facilitation head attaching part provided in the chip separation facilitation unit without annoying operator's hands. Thus, the separation facilitation head can be automatically changed to improve the operation rate of the apparatus.

Abstract: To provide a chip supply pallet preventing destruction of a chip and preventing a reduction in a productivity from being brought about in exchanging a wafer sheet, the chip supply pallet includes a first member 33 having a tension ring 51 brought into contact with a wafer sheet from a lower side, and a fixing member 54 of fixing a ring frame holding the wafer sheet on an inner side on a lower side of the wafer sheet brought into contact with the tension ring 51, and a second member 34 having a fixed portion for fixing to a predetermined position of a chip supply apparatus and a held portion 36 of being held when the chip interchanging pallet 3 is transferred, and the first member 33 is configured to be able to rotationally displace relative to the second member 34 fixed to the predetermined position of the chip supply apparatus.

Abstract: An automatic pallet exchange device includes: a pallet magazine 1 that accommodates a plurality of pallets 3 respectively having a plurality of horizontally extending protrusions 16 so as to be taken in and out in horizontal directions; a pallet fixing part 23 that allows the plurality of protrusions 16 to be engaged with a plurality of depression parts 17 to horizontally fix the pallet 3 and a pallet fixing table 20 on which the pallet fixing part 23 is arranged. The pallet 3 horizontally fixed by the pallet fixing part 23 is horizontally turned and horizontally moved to exchange the pallets 3 between the pallet fixing table 20 and the pallet magazine 1.

Abstract: In an electronic part mounting apparatus provided with first, second and third beam members 31, 32 and 33, all supported by a common Y-axis frame at both ends thereof, holding a chip 6 by suction from an electronic part feeding unit 2 by means of a mounting head attached to the first beam member 31, and mounting the chip onto a substrate held by first and second substrate-holding units 10A and 10B, a supporting mechanism for the substrate-holding unit (an SHU-supporting mechanism) 10 is provided which supports a slide table 50, on which the first and second substrate-holding unit 10A and 10B are arranged, in such a manner that the slide table is movable between an operating position P1 and a maintenance position P2. With such configuration, the slide table 50 can be moved to the maintenance position P2 easily accessible for maintenance, leading to the improvement of working efficiency.

Abstract: In a chip mounting apparatus, a structure is employed that a separation facilitation head keeping part is provided for detachably keeping a plurality kinds of separation facilitation heads in a wafer ring holding part and a chip separation facilitation unit is allowed to access to the separation facilitation head keeping part by a moving mechanism to automatically carry out a changing operation for changing the separation facilitation head between the separation facilitation head keeping part and a separation facilitation head attaching part provided in the chip separation facilitation unit without annoying operator's hands. Thus, the separation facilitation head can be automatically changed to improve the operation rate of the apparatus.

Abstract: In an electronic part mounting apparatus provided with first, second and third beam members 31, 32 and 33, all supported by a common Y-axis frame at both ends thereof, holding a chip 6 by suction from an electronic part feeding unit 2 by means of a mounting head attached to the first beam member 31, and mounting the chip onto a substrate held by first and second substrate-holding units 10A and 10B, a supporting mechanism for the substrate-holding unit (an SHU-supporting mechanism) 10 is provided which supports a slide table 50, on which the first and second substrate-holding unit 10A and 10B are arranged, in such a manner that the slide table is movable between an operating position P1 and a maintenance position P2. With such configuration, the slide table 50 can be moved to the maintenance position P2 easily accessible for maintenance, leading to the improvement of working efficiency.

Abstract: Head part carrying a nozzle for picking-up a chip is moved up and down with the use of a can and cam follower during movement of the head part between a wafer in a chip supply part and a substrate in a positioning part so as to shorten a stroke for the up and down movement of the nozzle for picking up a chip from a wafer in the chip supply part, and mounting the chip on the substrate, and a load during the movement of the nozzle is reduced thereby it is possible to enhance the speed at which the head part is moved between the wafer and the substrate so as to shorten the time tact and to enhance the working efficiency.