Abstract: An electronic parts mounting apparatus using a band carrier for feeding electronic parts incrementally, the carrier being a strip having many recesses disposed at equal intervals each holding an electronic part and a tape covering the recesses. The apparatus has a support for horizontally supporting the carrier with the coating tape on the top side; a separator for separating the tape from the carrier; and a pickup device for picking up the electronic parts one by one from the recesses in the carrier and by carrying the electronic parts and placing them in position on a circuit board for continuously and stably mounting the electronic parts on the circuit board.

Abstract: An assembly apparatus comprising a driving means for intermittently feeding a carrier tape with recesses formed at a uniform space interval, a plurality of transferring station units for transferring different kinds of electrical chip components from feeders into the recesses, and a control means for controlling assembling order and timings of the transferring operation by the transferring station units.

Abstract: An electronic parts mounting apparatus using a band carrier for feeding electronic parts incrementally, the carrier being a strip having many recesses disposed at equal intervals each holding an electronic part and a tape covering the recesses. The apparatus has a support for horizontally supporting the carrier with the coating tape on the top side, a separator for separating the tape from the carrier; and a pick up device for picking up the electronic parts one-by-one from the recesses in the carrier and carrying the electronic parts and placing them in position on a circuit board for continuously and stably mounting the electronic parts on the circuit board.

Abstract: In a method of mounting an electronic component wherein the electronic component is temporarily mounted on a printed circuit board before the component is securely mounted on the base plate by soldering, the improvement comprises steps of delivering adhesive to the front end of a coating head of an adhesive applicator, transferring the adhesive on to the printed circuit board between connection lands provided thereon for placement of the electronic component, and then positioning the electronic component on the adhesive applied to allow the electronic component to be held in position, with its bottom surface and a part of its side surface put in contact with the adhesive. The electronic component is thus mounted temporarily on the printed circuit board.

Abstract: An improved component engaging apparatus for mounting electrical and electronic components or the like onto a circuit board or substrate which includes a bonding agent applying unit for applying the bonding agent onto the substrate, a chip component mounting section for mounting electronic parts onto the bonding agent on the substrate, a chip component feeding section for sequentially feeding the chip components, a driving section for the chip component feeding section, and a substrate support section which is arranged to alter its position with respect to the chip component mounting section and bonding agent applying section.

Abstract: An apparatus for carrying electronic components from a supply position to an electronic circuit board or the like and placing the electronic components on the electronic circuit board or the like, which has a rod provided at its tip end with a suction tool for picking up components to be carried and which is connected with an air suction apparatus; a body frame supporting the rod for movement of the rod in the vertical and horizontal directions; two pairs of position regulating pawls which are movably supported on the rod and are supported for freely opening and closing to grasp the components from different directions which the components are held by the suction tool and positioning them; and an arrangement for opening and closing the position regulating pawls.

Abstract: A process for mounting electronic parts of very small size on electronic circuit boards or substrates, in which the substrates are maintained in predetermined relative positions, and a dispenser unit dispensing a bonding material for bonding the electronic parts to each of the substrates, a mounting unit mounting the electronic parts on each of the substrates, and/or an inspecting unit inspecting the position and/or the electrical properties of the electronic parts mounted on each of the substrates are disposed in the same relative positions as those of the substrates to carry out their individual functions on the associated substrates, so that the electronic parts can be efficiently and rationally mounted on the substrates.