Abstract: A semiconductor device manufacturing apparatus for encapsulating with a resin a semiconductor chip includes upper and lower molds configured to receive therebetween a lead frame on which the semiconductor chip is mounted. A positioning pin provided to the lower mold is configured to be received by a positioning hole provided in the lead frame. Ejector pins provided in proximity to the positioning pin are arranged so as to be symmetrical with respect to the positioning pin.

Abstract: A lower mold (2) of a set of upper and lower molds for resin encapsulation of a lead frame having a semiconductor chip mounted thereon is provided with a tapered positioning pin (3) to be engaged with a positioning hole formed in the lead frame. A columnar portion of the tapered positioning pin has an outer diameter larger than an inner diameter of a positioning hole. An ejector pin (4) and an ejector pin in a pair (5) for ejecting a package out of the molds after the molding are fixed to an ejector pin coupling mechanism (6).

Abstract: A semiconductor device manufacturing apparatus for encapsulating with a resin a semiconductor chip. A lead frame on which the semiconductor chip is mounted is provided between an upper mold and a lower mold. A tapered positioning pin is provided to the lower mold and includes a columnar portion having an outer diameter larger than an inner diameter of a positioning hole provided at an upper surface of the lead frame and configured to receive the columnar portion of the tapered positioning pin. Ejector pins are disposed in proximity to the tapered positioning pin at a distance determined by a thickness of the lead frame. The ejector pins are arranged so as to be symmetrical with respect to the tapered positioning pin.

Abstract: A lower mold (2) of a set of upper and lower molds for resin encapsulation of a lead frame having a semiconductor chip mounted thereon is provided with a tapered positioning pin (3) to be engaged with a positioning hole formed in the lead frame. A columnar portion of the tapered positioning pin has an outer diameter larger than an inner diameter of a positioning hole. An ejector pin (4) and an ejector pin in a pair (5) for ejecting a package out of the molds after the molding are fixed town ejector pin coupling mechanism (6).