Patents by Inventor Yasuou Yamazaki

Yasuou Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8946889
    Abstract: A semiconductor module is provided which includes a semiconductor unit which is made by a resin mold. The resin mold has formed therein a coolant path through which a coolant flows to cool a semiconductor chip embedded in the resin mold. The resin mold also includes heat spreaders, and electric terminals embedded therein. Each of the heat spreaders has a fin heat sink exposed to the flow of the coolant. The fin heat sink is welded to a surface of each of the heat spreaders through an insulator, thus minimizing an electrical leakage from the heat spreader to the coolant.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: February 3, 2015
    Assignee: Denso Corporation
    Inventors: Chikage Katou, Hiroaki Arai, Yoshiyuki Yamauchi, Yasuou Yamazaki, Naoki Sugimoto, Yasuyuki Sakai
  • Publication number: 20140091452
    Abstract: A semiconductor module is provided which includes a semiconductor unit which is made by a resin mold. The resin mold has formed therein a coolant path through which a coolant flows to cool a semiconductor chip embedded in the resin mold. The resin mold also includes heat spreaders, and electric terminals embedded therein. Each of the heat spreaders has a fin heat sink exposed to the flow of the coolant. The fin heat sink is welded to a surface of each of the heat spreaders through an insulator, thus minimizing an electrical leakage from the heat spreader to the coolant.
    Type: Application
    Filed: November 4, 2013
    Publication date: April 3, 2014
    Applicant: DENSO CORPORATION
    Inventors: Chikage Katou, Hiroaki Arai, Yoshiyuki Yamauchi, Yasuou Yamazaki, Naoki Sugimoto, Yasuyuki Sakai
  • Publication number: 20110316143
    Abstract: A semiconductor module is provided which includes a semiconductor unit which is made by a resin mold. The resin mold has formed therein a coolant path through which a coolant flows to cool a semiconductor chip embedded in the resin mold. The resin mold also includes heat spreaders, and electric terminals embedded therein. Each of the heat spreaders has a fin heat sink exposed to the flow of the coolant. The fin heat sink is welded to a surface of each of the heat spreaders through an insulator, thus minimizing an electrical leakage from the heat spreader to the coolant.
    Type: Application
    Filed: June 23, 2011
    Publication date: December 29, 2011
    Applicant: DENSO CORPORATION
    Inventors: Chikage NORITAKE, Hiroaki Arai, Yoshiyuki Yamauchi, Yasuou Yamazaki, Naoki Sugimoto, Yasuyuki Sakai
  • Patent number: 5405422
    Abstract: In a roll of electrically conductive filter materials (21-28) coiled together with spacers (31) to be (38) disposed in alternate relation to the filter materials, the filter materials (21-28) have a plurality of pairs of adjoining edges joined together to define openings for admitting gases into the roll, so that the filter materials (21-28) may collect particulates from the gases flowing therethrough. A central electrode (41) is connected in the center of the roll, while a cylindrical outer electrode (42) is connected about the outer periphery of the roll, so that upon application of an electric voltage thereacross, the two electrodes may supply an electric current to the filter materials (21-28) to heat them for regeneration.
    Type: Grant
    Filed: May 20, 1993
    Date of Patent: April 11, 1995
    Assignee: Nippondenso Co., Ltd.
    Inventors: Naoki Ueda, Hiroshi Kondo, Yasuou Yamazaki, Yukihisa Takeuchi
  • Patent number: 5067455
    Abstract: Additive is supplied to the lubricating oil by an additive supplying pump according to TBN of the lubricating oil which is detected by a TBN sensor which detects the current produced by the impressed voltage. TBN is kept between 0 and 2.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: November 26, 1991
    Assignee: Nippondenso Co., Ltd.
    Inventors: Atsushi Okajima, Yasuou Yamazaki, Yasuhide Okamoto, Masaei Nozawa, Yukihisa Takeuchi, Hajime Akado