Abstract: Probe card is a part which is incorporated into probing equipment to test finished IC chips. This card is customarily mounted with a plurality of probes, very fine needle and generally L letter shaped, each of which is disposed so that its front end may project downwardly toward an IC chip. Conventional probes are difficult to align all the probe front ends with electrical ends on the IC chip. Overdrive is normally taken to produce adequate contact pressures with respective probes after all contacts between the probe front ends and the IC ends are formed, but this action often causes conventional probe ends to slip down from the IC ends. The proposed probe card includes a new provision of a resin layer of an elastic, insulative characteristic to fill the central open area of the supporter which is assembled into the probe card. The filling, by such a resin layer, makes the probe front ends resiliently held in position so that a deviation from proper respective dispositions by overdrive becomes avoidable.

Abstract: Probe card is a part which is incorporated into probing equipment to test finished IC chips. This card is customarily mounted with a plurality of probes, very fine needle and generally L letter shaped, each of which is disposed so that its front end may project downwardly toward an IC chip. Conventional probes are difficult to align all the probe front ends with electrical ends on the IC chip. Overdrive is normally taken to produce adequate contact pressures with respective probes after all contacts between the probe front ends and the IC ends are formed, but this action often causes conventional probe ends to slip down from the IC ends. The proposed probe card includes a new provision of a resin layer of an elastic, insulative characteristic to fill the central open area of the supporter which is assembled into the probe card. The filling, by such a resin layer, makes the probe front ends resiliently held in position so that a deviation from proper respective dispositions by overdrive becomes avoidable.

Abstract: A probe card includes a printed circuit plate having an aperture at the center thereof and a ring fixed around said aperture on either side of the plate. The ring being adapted to support probe needles in radial arrays with respect to the aperture. Each of the arrays has a multilayer of probe needles which have their terminal tips aligned on a plane in parallel with the plate and their opposite terminal ends connected to the printed circuit for external connection.

Abstract: A probe card includes a printed circuit plate having an aperture at the center thereof and a ring fixed around said aperture on either side of the plate. The ring is adapted to support probe needles in radial arrays with respect to the aperture. Each of the arrays has a multilayer of probe needles which have their terminal tips aligned on a plane in parallel with the plate and their opposite terminal ends connected to the printed circuit for external connection.

Abstract: A testing apparatus of semiconductor wafers includes a base plate and a probe card including probe needles, wherein the probe card is detachably affixed to the base plate under air suction, which is derived from a vacuum produced in an airtightly sealed space provided between the base plate and the probe card.