Patents by Inventor Yasushi Aiyoshizawa

Yasushi Aiyoshizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5176812
    Abstract: A copper fin material for heat-exchangers is characterized in that, on the surface of Cu or Cu alloy strip, an inner side diffused layer comprising Cu and Zn and a surface side diffused layer provided on the surface side thereof comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn is formed. A method of producing the same is characterized in that, after an alloy film comprising Zn and element with a lower diffusion coefficient into Cu than that of Zn is formed on the surface of a Cu or Cu alloy strip, a diffusion treatment is performed under heat so that, on the surface of the Cu or Cu alloy strip, an inner side diffused layer comprising Cu and Zn and a surface side diffused layer provided on the surface side thereof comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn are formed. Alternatively, the diffusion treatment under heat is combined with a rolling processing step.
    Type: Grant
    Filed: July 29, 1991
    Date of Patent: January 5, 1993
    Assignees: The Furukawa Electric Co., Ltd., Nippondenso Co., Ltd.
    Inventors: Hideo Suda, Norimasa Sato, Katsuhiko Takada, Sumio Susa, Yasushi Aiyoshizawa, Kenichi Omata
  • Patent number: 5063117
    Abstract: A copper fin material for heat-exchanger characterized in that, on the surface of Cu or Cu alloy strip, the formation of an inner side diffused layer comprising Cu and Zn and a surface side diffused layer being provided on the surface side thereof and comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn is disclosed. A method of producing the same is characterized in that, after an alloy film comprising elements with a lower diffusion coefficient into Cu than that of Zn and Zn was formed on the surface of Cu or Cu alloy strip, a diffusion treatment is given under heat so that, on the surface of Cu or Cu alloy strip, an inner side diffused layer comprising Cu and Zn and a surface side diffused layer being provided on the surface side thereof and comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn are formed, or the diffusion treatment under heat and the rolling processing are given.
    Type: Grant
    Filed: December 21, 1989
    Date of Patent: November 5, 1991
    Assignees: The Furukawa Electric Co., Ltd., Nippondenso Co., Ltd.
    Inventors: Hideo Suda, Norimasa Sato, Katsuhiko Takada, Sumio Susa, Yasushi Aiyoshizawa, Kenichi Omata