Patents by Inventor Yasushi Akutsu

Yasushi Akutsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12087722
    Abstract: An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: September 10, 2024
    Assignee: DEXERIALS CORPORATION
    Inventor: Yasushi Akutsu
  • Patent number: 12066458
    Abstract: A conductive particle-disposed film of the present invention useful for a test probe unit for a continuity test of a fine-pitch continuity test object such as a semiconductor device is configured so that conductive particles are disposed in the surface direction of the elastomer film. The thickness of the elastomer film approximately coincides with the average particle diameter of the conductive particles. Ends of the conductive particles are positioned in the vicinity of respective outermost faces of both surfaces of the elastomer film. The same or different conductive particle-disposed films may be layered. A pressure-sensitive adhesive layer may be formed on at least one surface of the conductive particle-disposed film.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: August 20, 2024
    Assignee: DEXERIALS CORPORATION
    Inventors: Shinichi Hayashi, Yasushi Akutsu
  • Patent number: 11923333
    Abstract: An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: March 5, 2024
    Assignee: DEXERIALS CORPORATION
    Inventor: Yasushi Akutsu
  • Patent number: 11901325
    Abstract: Provided is a multilayer substrate including laminated semiconductor substrates each having a penetrating hole (hereinafter referred to as through hole) having a plated film formed in the inner surface. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are selectively present at a position where the through holes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through holes are connected by the conductive particles, and the semiconductor substrates each having the through hole are bonded by an insulating adhesive.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: February 13, 2024
    Assignee: DEXERIALS CORPORATION
    Inventors: Seiichiro Shinohara, Yasushi Akutsu, Tomoyuki Ishimatsu
  • Patent number: 11794444
    Abstract: An anisotropic conductive film capable of accommodating bumps with a narrow pitch and reducing the number density of conductive particles. In an anisotropic conductive film, conductive particles are disposed in an insulating resin binder as follows. Specifically, the conductive particles are rows of conductive particles arranged in single rows with spacing therebetween; and repeating units of conductive particles formed by juxtaposition of different numbers of conductive particles are disposed repeatedly over the entire surface of the anisotropic conductive film.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: October 24, 2023
    Assignee: DEXERIALS CORPORATION
    Inventors: Reiji Tsukao, Yasushi Akutsu
  • Patent number: 11787976
    Abstract: A method of producing an anisotropic conductive film having a three-layer structure including a first connection layer, a second connection layer, and a third connection layer. The connection layers are each formed mainly of an insulating resin. The first connection layer is held between the second connection layer and the third connection layer.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: October 17, 2023
    Assignee: DEXERIALS CORPORATION
    Inventors: Seiichiro Shinohara, Yasushi Akutsu
  • Patent number: 11732105
    Abstract: A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 ?m to 100 ?m.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: August 22, 2023
    Assignee: DEXERIALS CORPORATION
    Inventors: Yasushi Akutsu, Reiji Tsukao
  • Patent number: 11685137
    Abstract: An anisotropic conductive film which suppresses occurrence of short circuit at the time of anisotropic conductive connection, prevents reduction in capturing capability of electrically conductive particles, enables favorable pushing of electrically conductive particles and exhibits not only favorable initial conductivity but also favorable conduction reliability, contains a first electrically conductive particle group and a second electrically conductive particle group, each including a plurality of electrically conductive particles, in an insulating binder. The first electrically conductive particle group and the second electrically conductive particle group are present in a first region and a second region, respectively, which differ from each other in the thickness direction of the anisotropic conductive film and are parallel to the plane direction.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: June 27, 2023
    Assignee: DEXERIALS CORPORATION
    Inventors: Hiromi Kubode, Yasushi Akutsu, Reiji Tsukao
  • Publication number: 20230159797
    Abstract: An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 ?m or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.
    Type: Application
    Filed: January 18, 2023
    Publication date: May 25, 2023
    Applicant: DEXERIALS CORPORATION
    Inventors: Daisuke SATO, Yasushi AKUTSU, Ryousuke ODAKA, Yusuke TANAKA
  • Patent number: 11591499
    Abstract: An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 ?m or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: February 28, 2023
    Assignee: DEXERIALS CORPORATION
    Inventors: Daisuke Sato, Yasushi Akutsu, Ryousuke Odaka, Yusuke Tanaka
  • Publication number: 20220199565
    Abstract: An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.
    Type: Application
    Filed: March 9, 2022
    Publication date: June 23, 2022
    Applicant: DEXERIALS CORPORATION
    Inventor: Yasushi AKUTSU
  • Publication number: 20220135753
    Abstract: A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 ?m to 100 ?m.
    Type: Application
    Filed: October 28, 2021
    Publication date: May 5, 2022
    Applicant: DEXERIALS CORPORATION
    Inventors: Yasushi AKUTSU, Reiji TSUKAO
  • Patent number: 11309270
    Abstract: An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: April 19, 2022
    Assignee: DEXERIALS CORPORATION
    Inventors: Reiji Tsukao, Yasushi Akutsu
  • Publication number: 20220084975
    Abstract: An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin.
    Type: Application
    Filed: November 29, 2021
    Publication date: March 17, 2022
    Applicant: DEXERIALS CORPORATION
    Inventors: Reiji TSUKAO, Yasushi AKUTSU
  • Patent number: 11248148
    Abstract: Methods for securely transferring and attaching electrically conductive particles filled in openings to a binder resin layer. The methods include a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: February 15, 2022
    Assignee: DEXERIALS CORPORATION
    Inventor: Yasushi Akutsu
  • Patent number: 11195813
    Abstract: A first anisotropic conductive film 1A or a second anisotropic conductive film 1B has a first insulating resin layer 2 and a second insulating resin layer 3. The first insulating resin layer 2 is formed of a photopolymerized resin, and the second insulating resin layer 3 is formed of a polymerizable resin. Conductive particles 10 are disposed in a single layer on a surface of the first insulating resin layer 2 on a side of the second insulating resin layer 3. The first anisotropic conductive film further has a third insulating resin layer 4 formed of a polymerizable resin, and the second anisotropic conductive film 1B has an intermediate insulating resin layer 6. The intermediate insulating resin layer 6 is formed of a resin containing no polymerization initiator, and is in contact with the conductive particles 10. These anisotropic conductive films have favorable connection reliability.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: December 7, 2021
    Assignee: DEXERIALS CORPORATION
    Inventors: Reiji Tsukao, Yasushi Akutsu
  • Publication number: 20210371706
    Abstract: A method of producing an anisotropic conductive film having a three-layer structure including a first connection layer, a second connection layer, and a third connection layer. The connection layers are each formed mainly of an insulating resin. The first connection layer is held between the second connection layer and the third connection layer.
    Type: Application
    Filed: August 16, 2021
    Publication date: December 2, 2021
    Applicant: DEXERIALS CORPORATION
    Inventors: Seiichiro SHINOHARA, Yasushi AKUTSU
  • Patent number: 11136476
    Abstract: Anisotropic conductive film produced that a light-transmitting transfer die having openings with conductive particles disposed therein is prepared, and photopolymerizable insulating resin squeezed into openings to transfer conductive particles onto the surface of the photopolymerizable insulating resin layer, first connection layer is formed which has a structure in which conductive particles are arranged in a single layer in a plane direction of photopolymerizable insulating resin layer and the thickness of photopolymerizable insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than thickness of photopolymerizable insulating resin layer in regions in proximity to conductive particles; first connection layer is irradiated with ultraviolet rays through light-transmitting transfer die; release film is removed from first connection layer; second connection layer is formed on the surface of first connection layer opposite to light-transmitting transfer die; and th
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: October 5, 2021
    Assignee: DEXERIALS CORPORATION
    Inventors: Seiichiro Shinohara, Yasushi Akutsu
  • Patent number: 11139629
    Abstract: An anisotropic conductive film is capable of preventing a short circuit between terminals even though narrowing of the interval between connecting terminals advances. An electrically conductive support plate supports a base film having one surface with an adhesive layer. An array plate is disposed to face the adhesive layer and has through holes arranged in a pattern corresponding to the array pattern of electrically conductive particles. A spray sprays the electrically conductive particles together with a liquid while applying a voltage to the electrically conductive particles, in which the electrically conductive particles which are charged with an electrical charge are sprayed together with a liquid from the spray while applying a voltage between the spray and the support plate and the electrically conductive particles which have passed through the through holes of the array plate are arranged on the adhesive layer in the array pattern of the through holes.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: October 5, 2021
    Assignee: DEXERIALS CORPORATION
    Inventor: Yasushi Akutsu
  • Publication number: 20210280548
    Abstract: An anisotropic conductive film includes a conductive particle array layer in which a plurality of conductive particles are arrayed in a prescribed manner and held in an insulating resin layer. The anisotropic conductive film has a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer holding the array of the conductive particles is asymmetric with respect to the conductive particle. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film, short circuits and conductive failure can be reduced.
    Type: Application
    Filed: May 24, 2021
    Publication date: September 9, 2021
    Applicant: DEXERIALS CORPORATION
    Inventors: Kenichi SARUYAMA, Yasushi AKUTSU